AU2002213215A1 - Infrared end-point system for cmp - Google Patents
Infrared end-point system for cmpInfo
- Publication number
- AU2002213215A1 AU2002213215A1 AU2002213215A AU1321502A AU2002213215A1 AU 2002213215 A1 AU2002213215 A1 AU 2002213215A1 AU 2002213215 A AU2002213215 A AU 2002213215A AU 1321502 A AU1321502 A AU 1321502A AU 2002213215 A1 AU2002213215 A1 AU 2002213215A1
- Authority
- AU
- Australia
- Prior art keywords
- cmp
- point system
- infrared end
- infrared
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/688,013 US6540587B1 (en) | 2000-10-13 | 2000-10-13 | Infrared end-point detection system |
US09/688,013 | 2000-10-13 | ||
PCT/US2001/032124 WO2002031866A2 (en) | 2000-10-13 | 2001-10-11 | Infrared end-point system for cmp |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002213215A1 true AU2002213215A1 (en) | 2002-04-22 |
Family
ID=24762753
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002213215A Abandoned AU2002213215A1 (en) | 2000-10-13 | 2001-10-11 | Infrared end-point system for cmp |
Country Status (8)
Country | Link |
---|---|
US (1) | US6540587B1 (en) |
EP (1) | EP1332515A2 (en) |
JP (1) | JP2005505122A (en) |
KR (1) | KR20030051711A (en) |
CN (1) | CN1263087C (en) |
AU (1) | AU2002213215A1 (en) |
TW (1) | TW496813B (en) |
WO (1) | WO2002031866A2 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4810728B2 (en) * | 2000-12-04 | 2011-11-09 | 株式会社ニコン | Polishing condition monitoring method and apparatus, polishing apparatus, and semiconductor device manufacturing method |
US6929531B2 (en) * | 2002-09-19 | 2005-08-16 | Lam Research Corporation | System and method for metal residue detection and mapping within a multi-step sequence |
US6938509B2 (en) * | 2003-06-23 | 2005-09-06 | Cnh America Llc | Transmission shift control for selecting forward, reverse, neutral and park, and method of operation of the same |
US20050066739A1 (en) * | 2003-09-26 | 2005-03-31 | Lam Research Corporation | Method and apparatus for wafer mechanical stress monitoring and wafer thermal stress monitoring |
US7537511B2 (en) * | 2006-03-14 | 2009-05-26 | Micron Technology, Inc. | Embedded fiber acoustic sensor for CMP process endpoint |
US7544112B1 (en) * | 2006-12-13 | 2009-06-09 | Huffman Corporation | Method and apparatus for removing coatings from a substrate using multiple sequential steps |
US7371152B1 (en) * | 2006-12-22 | 2008-05-13 | Western Digital (Fremont), Llc | Non-uniform subaperture polishing |
US7630859B2 (en) * | 2007-05-01 | 2009-12-08 | Verity Instruments, Inc. | Method and apparatus for reducing the effects of window clouding on a viewport window in a reactive environment |
JP2008246628A (en) * | 2007-03-30 | 2008-10-16 | Disco Abrasive Syst Ltd | Chuck table mechanism |
JP6128941B2 (en) | 2013-05-10 | 2017-05-17 | ルネサスエレクトロニクス株式会社 | Semiconductor device manufacturing method and semiconductor manufacturing apparatus |
JP6721967B2 (en) | 2015-11-17 | 2020-07-15 | 株式会社荏原製作所 | Buff processing device and substrate processing device |
JP6893957B2 (en) * | 2015-11-17 | 2021-06-23 | 株式会社荏原製作所 | Buffing equipment and substrate processing equipment |
US10903050B2 (en) * | 2018-12-10 | 2021-01-26 | Lam Research Corporation | Endpoint sensor based control including adjustment of an edge ring parameter for each substrate processed to maintain etch rate uniformity |
CN110948379B (en) * | 2019-10-24 | 2020-10-20 | 清华大学 | Chemical mechanical polishing device |
CN110948376B (en) * | 2019-10-24 | 2020-10-20 | 清华大学 | Driving device for chemical mechanical polishing bearing head |
KR20220150332A (en) * | 2020-03-10 | 2022-11-10 | 도쿄엘렉트론가부시키가이샤 | Longwave infrared thermal sensor for integration into track systems |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5196353A (en) * | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
US5605487A (en) * | 1994-05-13 | 1997-02-25 | Memc Electric Materials, Inc. | Semiconductor wafer polishing appartus and method |
KR100281723B1 (en) * | 1995-05-30 | 2001-10-22 | 코트게리 | Polishing method and device |
JPH0929620A (en) * | 1995-07-20 | 1997-02-04 | Ebara Corp | Polishing device |
US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
US5957750A (en) * | 1997-12-18 | 1999-09-28 | Micron Technology, Inc. | Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates |
JP2000015557A (en) | 1998-04-27 | 2000-01-18 | Ebara Corp | Polishing device |
US6241847B1 (en) * | 1998-06-30 | 2001-06-05 | Lsi Logic Corporation | Method and apparatus for detecting a polishing endpoint based upon infrared signals |
US6077783A (en) * | 1998-06-30 | 2000-06-20 | Lsi Logic Corporation | Method and apparatus for detecting a polishing endpoint based upon heat conducted through a semiconductor wafer |
US6074517A (en) | 1998-07-08 | 2000-06-13 | Lsi Logic Corporation | Method and apparatus for detecting an endpoint polishing layer by transmitting infrared light signals through a semiconductor wafer |
US6352466B1 (en) | 1998-08-31 | 2002-03-05 | Micron Technology, Inc. | Method and apparatus for wireless transfer of chemical-mechanical planarization measurements |
-
2000
- 2000-10-13 US US09/688,013 patent/US6540587B1/en not_active Expired - Fee Related
-
2001
- 2001-10-11 EP EP01981582A patent/EP1332515A2/en not_active Withdrawn
- 2001-10-11 CN CNB018173004A patent/CN1263087C/en not_active Expired - Fee Related
- 2001-10-11 AU AU2002213215A patent/AU2002213215A1/en not_active Abandoned
- 2001-10-11 WO PCT/US2001/032124 patent/WO2002031866A2/en active Application Filing
- 2001-10-11 KR KR10-2003-7005141A patent/KR20030051711A/en not_active Application Discontinuation
- 2001-10-11 JP JP2002535160A patent/JP2005505122A/en active Pending
- 2001-10-12 TW TW090125352A patent/TW496813B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2005505122A (en) | 2005-02-17 |
WO2002031866A3 (en) | 2002-09-06 |
CN1263087C (en) | 2006-07-05 |
KR20030051711A (en) | 2003-06-25 |
US6540587B1 (en) | 2003-04-01 |
CN1498415A (en) | 2004-05-19 |
WO2002031866A2 (en) | 2002-04-18 |
TW496813B (en) | 2002-08-01 |
EP1332515A2 (en) | 2003-08-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001239746A1 (en) | Group-browsing system | |
WO2002024285A8 (en) | Bet matching system | |
AU2002218623A1 (en) | Robot system | |
AU2002218627A1 (en) | Robot system | |
AU4309601A (en) | Chemical-mechanical polishing method | |
AU2001256760A1 (en) | Faucet controller | |
SG106633A1 (en) | Polishing system | |
AU2002224378A1 (en) | Multiprobe detection system for chemical-mechanical planarization tool | |
AU2002213215A1 (en) | Infrared end-point system for cmp | |
AU2001235435A1 (en) | System for connecting elements | |
AU2001276537A1 (en) | Slimming system | |
AU2001271498A1 (en) | Glint-resistant position determination system | |
AU2001240980A1 (en) | Polishing system for ceramic products | |
AU2001230408A1 (en) | Packer system | |
AU2001296492A1 (en) | Activated slurry cmp system and methods for implementing the same | |
AU2001284775A1 (en) | Anti-balling system | |
AU2001275394A1 (en) | Floor covering removal tool | |
AUPQ979300A0 (en) | Mining system | |
AUPQ402599A0 (en) | Flooring system | |
AUPR135000A0 (en) | Sander | |
AU2001289885A1 (en) | Air-preparation system | |
AU2001270827A1 (en) | Flooring system | |
AU2002236729A1 (en) | Methods for improved planarization post cmp processing | |
AU2001293667A1 (en) | Buckle-fastener system | |
AU2001234322A1 (en) | Control system |