AU2001286462A1 - Manufacturing fire retardant circuit boards without the use of fire retardant resin additives - Google Patents

Manufacturing fire retardant circuit boards without the use of fire retardant resin additives

Info

Publication number
AU2001286462A1
AU2001286462A1 AU2001286462A AU8646201A AU2001286462A1 AU 2001286462 A1 AU2001286462 A1 AU 2001286462A1 AU 2001286462 A AU2001286462 A AU 2001286462A AU 8646201 A AU8646201 A AU 8646201A AU 2001286462 A1 AU2001286462 A1 AU 2001286462A1
Authority
AU
Australia
Prior art keywords
fire retardant
circuit boards
resin additives
manufacturing
retardant resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001286462A
Inventor
John A Andresakis
Dave Paturel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oak Mitsui Inc
Original Assignee
Oak Mitsui Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oak Mitsui Inc filed Critical Oak Mitsui Inc
Publication of AU2001286462A1 publication Critical patent/AU2001286462A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU2001286462A 2000-09-07 2001-08-13 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives Abandoned AU2001286462A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/656,489 US6495244B1 (en) 2000-09-07 2000-09-07 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
US09656489 2000-09-07
PCT/US2001/025363 WO2002021886A2 (en) 2000-09-07 2001-08-13 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives

Publications (1)

Publication Number Publication Date
AU2001286462A1 true AU2001286462A1 (en) 2002-03-22

Family

ID=24633239

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001286462A Abandoned AU2001286462A1 (en) 2000-09-07 2001-08-13 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives

Country Status (10)

Country Link
US (1) US6495244B1 (en)
EP (1) EP1329142A2 (en)
JP (1) JP2004508734A (en)
KR (1) KR100787075B1 (en)
CN (1) CN1293792C (en)
AU (1) AU2001286462A1 (en)
CA (1) CA2419805A1 (en)
MY (1) MY127341A (en)
TW (1) TW516348B (en)
WO (1) WO2002021886A2 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7646098B2 (en) * 2005-03-23 2010-01-12 Endicott Interconnect Technologies, Inc. Multilayered circuitized substrate with p-aramid dielectric layers and method of making same
US8084863B2 (en) * 2005-03-23 2011-12-27 Endicott Interconnect Technologies, Inc. Circuitized substrate with continuous thermoplastic support film dielectric layers
US20090258161A1 (en) * 2008-04-10 2009-10-15 Japp Robert M Circuitized substrate with P-aramid dielectric layers and method of making same
US8871843B2 (en) * 2009-12-15 2014-10-28 Apple Inc. Halogen-free flame retardant material
CN102131347B (en) * 2010-01-15 2012-11-28 欣兴电子股份有限公司 Circuit substrate and manufacturing method thereof
WO2012050400A2 (en) 2010-10-14 2012-04-19 주식회사 엘지화학 Resin blend for melting process
KR101503005B1 (en) * 2011-07-22 2015-03-18 주식회사 엘지화학 Thermosetting resin composition and Prepreg and Metal Clad laminate using the same
US10070518B2 (en) 2013-02-06 2018-09-04 Isola Usa Corp. Prepregs and laminates having homogeneous dielectric properties
NL2010625C2 (en) * 2013-04-11 2014-10-14 Aviat Glass & Technology B V MIRROR, AND METHOD FOR MANUFACTURING SUCH MIRROR
CN104744892A (en) * 2013-12-27 2015-07-01 台燿科技股份有限公司 Resin composition and use thereof
CN106400994A (en) * 2015-07-28 2017-02-15 天津佳华炜业建材科技有限公司 Polystyrene board having A2 grade flame retardation effect and preparation method thereof
CN106590452B (en) * 2016-11-25 2018-02-27 常州中英科技股份有限公司 A kind of bonding sheet for copper-clad plate
US11044802B2 (en) 2017-02-16 2021-06-22 Azotek Co., Ltd. Circuit board
US11225563B2 (en) * 2017-02-16 2022-01-18 Azotek Co., Ltd. Circuit board structure and composite for forming insulating substrates
CN108099304A (en) * 2018-01-08 2018-06-01 烟台智本知识产权运营管理有限公司 A kind of two layers of gum-free double side flexible copper coated board and preparation method thereof
CN108045025A (en) * 2018-01-08 2018-05-18 烟台智本知识产权运营管理有限公司 A kind of two layers of gum-free double side flexible copper coated board and preparation method thereof
CN108409966B (en) * 2018-03-08 2020-07-24 陕西天策新材料科技有限公司 Modified bismaleimide resin suitable for resin transfer molding process and preparation method thereof
CN112840747A (en) * 2018-10-09 2021-05-25 杜邦电子公司 Thermal substrate
KR20220015562A (en) * 2020-07-31 2022-02-08 동우 화인켐 주식회사 Flexible Metal Laminate and Printed Circuit Board Using the Same

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US707749A (en) 1901-11-19 1902-08-26 Heinrich Winkelmann Phonograph.
US3527665A (en) 1967-01-23 1970-09-08 Fmc Corp Copper-clad laminates of unsaturated thermosetting resins with copper layer coated with polyphenylene oxide resin
DE3012889C2 (en) * 1979-04-30 1984-01-12 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Base material for the manufacture of printed circuits
DE4026353C1 (en) * 1990-08-21 1991-12-12 Fa. Carl Freudenberg, 6940 Weinheim, De
DE4102473A1 (en) * 1990-08-21 1992-02-27 Freudenberg Carl Fa SUPPORT FOR COPPER FOILS FROM FLEXIBLE PCBS
JPH04206595A (en) * 1990-11-30 1992-07-28 Hitachi Ltd Manufacture of thin film multilayer wiring board
US5707749A (en) 1990-11-30 1998-01-13 Hitachi, Ltd. Method for producing thin film multilayer wiring board
US5103293A (en) * 1990-12-07 1992-04-07 International Business Machines Corporation Electronic circuit packages with tear resistant organic cores
US5098781A (en) * 1990-12-28 1992-03-24 General Electric Company Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates
TW224561B (en) * 1991-06-04 1994-06-01 Akocho Co
DE4308187A1 (en) * 1993-03-15 1994-09-22 Siemens Ag Epoxy resin mixtures
US5879794A (en) * 1994-08-25 1999-03-09 W. L. Gore & Associates, Inc. Adhesive-filler film composite
US6071836A (en) 1994-10-13 2000-06-06 World Properties, Inc. Polybutadiene and polyisoprene thermosetting compositions and method of manufacture thereof
US5571609A (en) * 1994-10-13 1996-11-05 Rogers Corporation Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture thereof
US5686172A (en) * 1994-11-30 1997-11-11 Mitsubishi Gas Chemical Company, Inc. Metal-foil-clad composite ceramic board and process for the production thereof
JPH08172277A (en) * 1994-12-16 1996-07-02 Shin Etsu Chem Co Ltd Board for multilayer flexible printed wiring
WO1996028511A1 (en) * 1995-03-10 1996-09-19 Toshiba Chemical Corporation Halogen-free flame-retardant epoxy resin composition
JP3862770B2 (en) * 1995-09-07 2006-12-27 日立化成工業株式会社 Method for producing metal-clad laminate
US6214455B1 (en) * 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
JPH10195178A (en) 1997-01-06 1998-07-28 Toshiba Chem Corp Flame-retardant epoxy resin composition, prepreg, laminate and copper-clad printed circuit board
JPH10321974A (en) * 1997-05-22 1998-12-04 Matsushita Electric Ind Co Ltd Board for forming circuit
GB9713526D0 (en) 1997-06-26 1997-09-03 Dow Deutschland Inc Flame retardant laminating formulations
JPH11240214A (en) 1998-02-26 1999-09-07 Brother Ind Ltd Image formation apparatus
JPH11343398A (en) 1998-03-31 1999-12-14 Hitachi Chem Co Ltd Flame retardant epoxy resin composition, and prepreg, laminate for electrical wiring board and metallic foil with resin using the composition
DE19952246A1 (en) 1998-11-04 2000-05-31 Thomson Brandt Gmbh Electromechanical component includes covering and support layers composed of inflammable plastic material

Also Published As

Publication number Publication date
KR20030026360A (en) 2003-03-31
WO2002021886A3 (en) 2002-06-20
US6495244B1 (en) 2002-12-17
JP2004508734A (en) 2004-03-18
TW516348B (en) 2003-01-01
MY127341A (en) 2006-11-30
CN1293792C (en) 2007-01-03
EP1329142A2 (en) 2003-07-23
WO2002021886A2 (en) 2002-03-14
CA2419805A1 (en) 2002-03-14
CN1465212A (en) 2003-12-31
KR100787075B1 (en) 2007-12-21

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