AU2001281127A1 - Fault detection method and apparatus using multiple dimension measurements - Google Patents

Fault detection method and apparatus using multiple dimension measurements

Info

Publication number
AU2001281127A1
AU2001281127A1 AU2001281127A AU8112701A AU2001281127A1 AU 2001281127 A1 AU2001281127 A1 AU 2001281127A1 AU 2001281127 A AU2001281127 A AU 2001281127A AU 8112701 A AU8112701 A AU 8112701A AU 2001281127 A1 AU2001281127 A1 AU 2001281127A1
Authority
AU
Australia
Prior art keywords
detection method
fault detection
multiple dimension
dimension measurements
measurements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001281127A
Inventor
Naomi M. Jenkins
Richard J. Markle
Matthew A. Purdy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001281127A1 publication Critical patent/AU2001281127A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
AU2001281127A 2000-09-27 2001-08-07 Fault detection method and apparatus using multiple dimension measurements Abandoned AU2001281127A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US67184800A 2000-09-27 2000-09-27
US09/671,848 2000-09-27
PCT/US2001/024685 WO2002027782A2 (en) 2000-09-27 2001-08-07 Fault detection method and apparatus using multiple dimension measurements

Publications (1)

Publication Number Publication Date
AU2001281127A1 true AU2001281127A1 (en) 2002-04-08

Family

ID=24696108

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001281127A Abandoned AU2001281127A1 (en) 2000-09-27 2001-08-07 Fault detection method and apparatus using multiple dimension measurements

Country Status (2)

Country Link
AU (1) AU2001281127A1 (en)
WO (1) WO2002027782A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20041525A (en) 2004-11-26 2006-03-17 Imbera Electronics Oy Electronics module and manufacturing process
US10290088B2 (en) 2014-02-14 2019-05-14 Kla-Tencor Corporation Wafer and lot based hierarchical method combining customized metrics with a global classification methodology to monitor process tool condition at extremely high throughput
CN113042599A (en) * 2021-03-29 2021-06-29 成都腾达模具有限公司 Processing method of qualified grid cell tube

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4571685A (en) * 1982-06-23 1986-02-18 Nec Corporation Production system for manufacturing semiconductor devices
US5385629A (en) * 1993-10-14 1995-01-31 Micron Semiconductor, Inc. After etch test method and apparatus
EP0720216B1 (en) * 1994-12-29 2001-10-17 AT&T Corp. Linewidth metrology of integrated circuit structures
US5715181A (en) * 1995-04-03 1998-02-03 Horst; Robert L. Isogrammetric analysis method for high-yield processes
US5991699A (en) * 1995-05-04 1999-11-23 Kla Instruments Corporation Detecting groups of defects in semiconductor feature space
US6417013B1 (en) * 1999-01-29 2002-07-09 Plasma-Therm, Inc. Morphed processing of semiconductor devices

Also Published As

Publication number Publication date
WO2002027782A3 (en) 2003-09-04
WO2002027782A2 (en) 2002-04-04

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AU2001281127A1 (en) Fault detection method and apparatus using multiple dimension measurements