AU2001275534A1 - High sensitivity optical inspection system and method for detecting flaws on a diffractive surface - Google Patents
High sensitivity optical inspection system and method for detecting flaws on a diffractive surfaceInfo
- Publication number
- AU2001275534A1 AU2001275534A1 AU2001275534A AU7553401A AU2001275534A1 AU 2001275534 A1 AU2001275534 A1 AU 2001275534A1 AU 2001275534 A AU2001275534 A AU 2001275534A AU 7553401 A AU7553401 A AU 7553401A AU 2001275534 A1 AU2001275534 A1 AU 2001275534A1
- Authority
- AU
- Australia
- Prior art keywords
- high sensitivity
- inspection system
- optical inspection
- diffractive surface
- detecting flaws
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21164300P | 2000-06-14 | 2000-06-14 | |
US60211643 | 2000-06-14 | ||
US09688056 | 2000-10-13 | ||
US09/688,056 US6603542B1 (en) | 2000-06-14 | 2000-10-13 | High sensitivity optical inspection system and method for detecting flaws on a diffractive surface |
PCT/US2001/040955 WO2001096840A2 (en) | 2000-06-14 | 2001-06-14 | High sensitivity optical inspection system and method for detecting flaws on a diffractive surface |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001275534A1 true AU2001275534A1 (en) | 2001-12-24 |
Family
ID=26906332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001275534A Abandoned AU2001275534A1 (en) | 2000-06-14 | 2001-06-14 | High sensitivity optical inspection system and method for detecting flaws on a diffractive surface |
Country Status (4)
Country | Link |
---|---|
US (1) | US6603542B1 (en) |
JP (3) | JP3965117B2 (en) |
AU (1) | AU2001275534A1 (en) |
WO (1) | WO2001096840A2 (en) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6897957B2 (en) | 2001-03-26 | 2005-05-24 | Candela Instruments | Material independent optical profilometer |
US6665078B1 (en) * | 1997-09-22 | 2003-12-16 | Candela Instruments | System and method for simultaneously measuring thin film layer thickness, reflectivity, roughness, surface profile and magnetic pattern in thin film magnetic disks and silicon wafers |
US6031615A (en) | 1997-09-22 | 2000-02-29 | Candela Instruments | System and method for simultaneously measuring lubricant thickness and degradation, thin film thickness and wear, and surface roughness |
US6757056B1 (en) | 2001-03-26 | 2004-06-29 | Candela Instruments | Combined high speed optical profilometer and ellipsometer |
US6909500B2 (en) * | 2001-03-26 | 2005-06-21 | Candela Instruments | Method of detecting and classifying scratches, particles and pits on thin film disks or wafers |
US7123357B2 (en) * | 1997-09-22 | 2006-10-17 | Candela Instruments | Method of detecting and classifying scratches and particles on thin film disks or wafers |
US6930765B2 (en) * | 2001-03-26 | 2005-08-16 | Kla-Tencor Technologies | Multiple spot size optical profilometer, ellipsometer, reflectometer and scatterometer |
US6483580B1 (en) * | 1998-03-06 | 2002-11-19 | Kla-Tencor Technologies Corporation | Spectroscopic scatterometer system |
US7061601B2 (en) * | 1999-07-02 | 2006-06-13 | Kla-Tencor Technologies Corporation | System and method for double sided optical inspection of thin film disks or wafers |
US6603542B1 (en) * | 2000-06-14 | 2003-08-05 | Qc Optics, Inc. | High sensitivity optical inspection system and method for detecting flaws on a diffractive surface |
JP2003004427A (en) * | 2001-06-22 | 2003-01-08 | Hitachi Ltd | Defect inspection method and apparatus by image comparison |
US7280230B2 (en) * | 2001-12-19 | 2007-10-09 | Kla-Tencor Technologies Corporation | Parametric profiling using optical spectroscopic systems |
US6882437B2 (en) * | 2002-04-19 | 2005-04-19 | Kla-Tencor Technologies | Method of detecting the thickness of thin film disks or wafers |
IL149557A (en) * | 2002-05-09 | 2008-11-03 | Nova Measuring Instr Ltd | Optical system operating with variable angle of incidence |
US7505619B2 (en) * | 2002-09-27 | 2009-03-17 | Kla-Tencor Technologies Corporation | System and method for conducting adaptive fourier filtering to detect defects in dense logic areas of an inspection surface |
US20040114786A1 (en) * | 2002-12-06 | 2004-06-17 | Cross Match Technologies, Inc. | System and method for capturing print information using a coordinate conversion method |
JP4536337B2 (en) * | 2003-06-10 | 2010-09-01 | 株式会社トプコン | Surface inspection method and surface inspection apparatus |
DE10331593A1 (en) * | 2003-07-11 | 2005-02-03 | Leica Microsystems Semiconductor Gmbh | Method for defect segmentation in structures on semiconductor substrates |
US20050264585A1 (en) * | 2004-05-26 | 2005-12-01 | Trombley Michael G | Visual display transformation |
US7075741B1 (en) | 2004-06-14 | 2006-07-11 | Kla Tencor Technologues Corporation | System and method for automatically determining magnetic eccentricity of a disk |
US7396022B1 (en) | 2004-09-28 | 2008-07-08 | Kla-Tencor Technologies Corp. | System and method for optimizing wafer flatness at high rotational speeds |
US7201799B1 (en) | 2004-11-24 | 2007-04-10 | Kla-Tencor Technologies Corporation | System and method for classifying, detecting, and counting micropipes |
US7684032B1 (en) | 2005-01-06 | 2010-03-23 | Kla-Tencor Corporation | Multi-wavelength system and method for detecting epitaxial layer defects |
US20070146692A1 (en) * | 2005-12-23 | 2007-06-28 | Xerox Corporation | Fiber optic specular surface flaw detection |
US7362450B2 (en) * | 2005-12-23 | 2008-04-22 | Xerox Corporation | Specular surface flaw detection |
US7724362B1 (en) * | 2006-03-14 | 2010-05-25 | Kla-Tencor Corporation | Oblique incidence macro wafer inspection |
US8432395B2 (en) * | 2009-06-16 | 2013-04-30 | Apple Inc. | Method and apparatus for surface contour mapping |
US8885148B2 (en) | 2011-01-04 | 2014-11-11 | Asml Holding N.V. | System and method for design of linear motor for vacuum environment |
US9632407B2 (en) | 2014-07-18 | 2017-04-25 | Kabushiki Kaisha Yoshiba | Mask processing apparatus and mask processing method |
KR101657982B1 (en) * | 2014-09-15 | 2016-09-30 | (주)자비스 | Apparatus for Investigating LED Package with X-ray |
GB201518322D0 (en) | 2015-10-16 | 2015-12-02 | Rolls Royce Plc | A method for classifying a defect in a component intended to have a monocrystalline |
US10156664B2 (en) | 2016-02-12 | 2018-12-18 | Lasertec Corporation | Mask inspection apparatus and mask inspection method |
JP6053084B1 (en) * | 2016-02-12 | 2016-12-27 | レーザーテック株式会社 | Mask inspection apparatus and mask inspection method |
WO2018085237A1 (en) | 2016-11-02 | 2018-05-11 | Corning Incorporated | Method and apparatus for inspecting defects on transparent substrate and method of emitting incident light |
KR102537558B1 (en) | 2016-11-02 | 2023-05-26 | 코닝 인코포레이티드 | Method and apparatus for inspecting defects on a transparent substrate |
ES2910779T3 (en) * | 2017-12-20 | 2022-05-13 | Fundacion Tecnalia Res & Innovation | Methods and systems for visual inspection |
KR102160170B1 (en) * | 2018-11-21 | 2020-09-25 | 에스케이실트론 주식회사 | Apparatus and method for measuring particle on surface of wafer |
CN117232790B (en) * | 2023-11-07 | 2024-02-02 | 中国科学院长春光学精密机械与物理研究所 | Method and system for evaluating surface defects of optical element based on two-dimensional scattering |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5713340A (en) * | 1980-06-27 | 1982-01-23 | Hitachi Ltd | Inspection apparatus for surface defect |
US4532723A (en) | 1982-03-25 | 1985-08-06 | General Electric Company | Optical inspection system |
US4518257A (en) | 1982-07-28 | 1985-05-21 | General Electric Company | Optical inspection system and method |
JPS61104243A (en) * | 1984-10-29 | 1986-05-22 | Hitachi Ltd | Method and apparatus for detecting foreign matter |
US4794647A (en) | 1985-04-08 | 1988-12-27 | Northern Telecom Limited | Automatic optical inspection system |
US5127726A (en) | 1989-05-19 | 1992-07-07 | Eastman Kodak Company | Method and apparatus for low angle, high resolution surface inspection |
US5200799A (en) | 1989-09-12 | 1993-04-06 | Matsushita Electric Industrial Co., Ltd. | System for optically inspecting conditions of parts packaged on substrate |
JPH03102249A (en) * | 1989-09-18 | 1991-04-26 | Hitachi Ltd | Method and apparatus for detecting foreign matter |
US5085517A (en) | 1989-10-31 | 1992-02-04 | Chadwick Curt H | Automatic high speed optical inspection system |
JPH04166709A (en) * | 1990-10-30 | 1992-06-12 | Omron Corp | Surface-state observing apparatus |
DE69208413T2 (en) | 1991-08-22 | 1996-11-14 | Kla Instr Corp | Device for automatic testing of photomask |
US5563702A (en) | 1991-08-22 | 1996-10-08 | Kla Instruments Corporation | Automated photomask inspection apparatus and method |
US5155372A (en) | 1991-11-26 | 1992-10-13 | International Business Machines Corporation | Optical inspection system utilizing wedge shaped spatial filter |
US5432607A (en) | 1993-02-22 | 1995-07-11 | International Business Machines Corporation | Method and apparatus for inspecting patterned thin films using diffracted beam ellipsometry |
US5517234A (en) | 1993-10-26 | 1996-05-14 | Gerber Systems Corporation | Automatic optical inspection system having a weighted transition database |
US5506793A (en) | 1994-01-14 | 1996-04-09 | Gerber Systems Corporation | Method and apparatus for distortion compensation in an automatic optical inspection system |
KR960015001A (en) | 1994-10-07 | 1996-05-22 | 가나이 쓰토무 | Method and apparatus for manufacturing a semiconductor substrate and for inspecting pattern defects on an inspected object |
US5903342A (en) | 1995-04-10 | 1999-05-11 | Hitachi Electronics Engineering, Co., Ltd. | Inspection method and device of wafer surface |
US5625193A (en) | 1995-07-10 | 1997-04-29 | Qc Optics, Inc. | Optical inspection system and method for detecting flaws on a diffractive surface |
US5644393A (en) | 1995-10-19 | 1997-07-01 | Hitachi Electronics Engineering Co., Ltd. | Extraneous substance inspection method and apparatus |
JPH1183753A (en) | 1997-07-09 | 1999-03-26 | Toshiba Corp | Optical substrate inspecting device |
US6072897A (en) | 1997-09-18 | 2000-06-06 | Applied Materials, Inc. | Dimension error detection in object |
US6104481A (en) * | 1997-11-11 | 2000-08-15 | Kabushiki Kaisha Topcon | Surface inspection apparatus |
JPH11142127A (en) * | 1997-11-11 | 1999-05-28 | Topcon Corp | Wafer surface inspecting method and equipment therefor |
US6046801A (en) | 1997-12-23 | 2000-04-04 | Analog Technologies, Inc. | Laser-based inspection system for optical disks |
US6122046A (en) | 1998-10-02 | 2000-09-19 | Applied Materials, Inc. | Dual resolution combined laser spot scanning and area imaging inspection |
JP2001013085A (en) | 1999-06-30 | 2001-01-19 | Nidek Co Ltd | Flow inspection apparatus |
US6603542B1 (en) * | 2000-06-14 | 2003-08-05 | Qc Optics, Inc. | High sensitivity optical inspection system and method for detecting flaws on a diffractive surface |
-
2000
- 2000-10-13 US US09/688,056 patent/US6603542B1/en not_active Expired - Lifetime
-
2001
- 2001-06-14 JP JP2002510920A patent/JP3965117B2/en not_active Expired - Fee Related
- 2001-06-14 WO PCT/US2001/040955 patent/WO2001096840A2/en active Application Filing
- 2001-06-14 AU AU2001275534A patent/AU2001275534A1/en not_active Abandoned
-
2006
- 2006-05-02 JP JP2006128653A patent/JP2006284595A/en not_active Withdrawn
-
2007
- 2007-11-16 JP JP2007298286A patent/JP4767935B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP4767935B2 (en) | 2011-09-07 |
WO2001096840A2 (en) | 2001-12-20 |
JP3965117B2 (en) | 2007-08-29 |
JP2008058331A (en) | 2008-03-13 |
JP2004503770A (en) | 2004-02-05 |
US6603542B1 (en) | 2003-08-05 |
JP2006284595A (en) | 2006-10-19 |
WO2001096840A3 (en) | 2002-06-27 |
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