AU2001273838A1 - Method and device for laser cutting microscopic samples - Google Patents

Method and device for laser cutting microscopic samples

Info

Publication number
AU2001273838A1
AU2001273838A1 AU2001273838A AU7383801A AU2001273838A1 AU 2001273838 A1 AU2001273838 A1 AU 2001273838A1 AU 2001273838 A AU2001273838 A AU 2001273838A AU 7383801 A AU7383801 A AU 7383801A AU 2001273838 A1 AU2001273838 A1 AU 2001273838A1
Authority
AU
Australia
Prior art keywords
laser cutting
microscopic samples
cutting microscopic
samples
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001273838A
Inventor
Michael Ganser
Rudiger Stenzel
Albrecht Weiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leica Microsystems CMS GmbH
Original Assignee
Leica Microsystems Wetzlar GmbH
Leica Microsystems CMS GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsystems Wetzlar GmbH, Leica Microsystems CMS GmbH filed Critical Leica Microsystems Wetzlar GmbH
Publication of AU2001273838A1 publication Critical patent/AU2001273838A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/32—Micromanipulators structurally combined with microscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/2813—Producing thin layers of samples on a substrate, e.g. smearing, spinning-on
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/02—Devices for withdrawing samples
    • G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
    • G01N2001/045—Laser ablation; Microwave vaporisation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
    • G01N2001/2873—Cutting or cleaving
    • G01N2001/2886—Laser cutting, e.g. tissue catapult
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/141—With means to monitor and control operation [e.g., self-regulating means]

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microscoopes, Condenser (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Laser Beam Processing (AREA)
AU2001273838A 2000-04-13 2001-04-10 Method and device for laser cutting microscopic samples Abandoned AU2001273838A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10018255 2000-04-13
DE10018255A DE10018255C2 (en) 2000-04-13 2000-04-13 Laser cutting process and laser cutting device for laser cutting with microscopic samples
PCT/DE2001/001414 WO2001079806A1 (en) 2000-04-13 2001-04-10 Method and device for laser cutting microscopic samples

Publications (1)

Publication Number Publication Date
AU2001273838A1 true AU2001273838A1 (en) 2001-10-30

Family

ID=7638554

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001273838A Abandoned AU2001273838A1 (en) 2000-04-13 2001-04-10 Method and device for laser cutting microscopic samples

Country Status (7)

Country Link
US (1) US20020164678A1 (en)
EP (1) EP1279016A1 (en)
JP (1) JP4236844B2 (en)
AU (1) AU2001273838A1 (en)
DE (1) DE10018255C2 (en)
TW (1) TW496958B (en)
WO (1) WO2001079806A1 (en)

Families Citing this family (16)

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DE20122509U1 (en) * 2001-11-26 2005-12-22 Alpha Laser Gmbh Laser processing device has control unit for controlling drive depending on operator inputs and/or stored data devices for moving processing device on running mechanism
US6951627B2 (en) * 2002-04-26 2005-10-04 Matsushita Electric Industrial Co., Ltd. Method of drilling holes with precision laser micromachining
US7880117B2 (en) 2002-12-24 2011-02-01 Panasonic Corporation Method and apparatus of drilling high density submicron cavities using parallel laser beams
DE10300091A1 (en) * 2003-01-04 2004-07-29 Lubatschowski, Holger, Dr. microtome
US9217694B2 (en) * 2003-10-21 2015-12-22 Leica Microsystems Cms Gmbh Method for automatically generating laser cutting lines in laser microdissection processes
DE102006030195A1 (en) * 2006-06-30 2008-01-03 P.A.L.M. Microlaser Technologies Gmbh Method and apparatus for laser microdissection and laser catapulting
DE102007016301A1 (en) * 2007-04-04 2008-10-09 P.A.L.M. Microlaser Technologies Gmbh Laser microdissection method and laser microdissection device
US20080302226A1 (en) * 2007-06-07 2008-12-11 Credo Technology Corporation Power tool having imaging device and display device
DE102007035582A1 (en) * 2007-07-30 2009-02-05 P.A.L.M. Microlaser Technologies Gmbh Method and device for processing a biological object with laser radiation
EP2028600B1 (en) * 2007-08-24 2016-10-26 Sysmex Corporation Diagnosis support system for cancer, diagnosis support for information providing method for cancer, and computer program product
DE102011001474A1 (en) * 2011-03-22 2012-09-27 Carl Zeiss Microimaging Gmbh Laser microdissection method and laser microdissection device
DE102013216938B3 (en) 2013-08-26 2015-01-08 Leica Microsystems Cms Gmbh Method for calibrating a laser deflector of a laser microdissection system and laser microdissection system
DE102014202646A1 (en) 2014-02-13 2015-08-13 Leica Microsystems Cms Gmbh Method for producing an object from a material and / or for processing an object
DE102016217250A1 (en) * 2016-09-09 2018-03-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Microfluidic device for cell culture experiments and uses thereof
CN109668765B (en) * 2019-01-18 2021-11-09 南京理工大学 Method for preparing multi-orientation mesoscopic stretching sample based on femtosecond laser processing
DE102020100587A1 (en) * 2020-01-13 2021-07-15 Leica Microsystems Cms Gmbh Method for checking a dissection process in a laser microdissection system and means for carrying it out

Family Cites Families (24)

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US3642007A (en) * 1969-08-12 1972-02-15 Thomas G Roberts Continuous wave laser surgical device
GB1584779A (en) * 1976-09-24 1981-02-18 Agfa Gevaert Laserbeam recording
FR2555039B1 (en) * 1983-11-21 1986-04-04 Centre Nat Rech Scient SCANNING CATADIOPTRIC OPHTHALMOSCOPE
JPS60164487A (en) * 1984-02-06 1985-08-27 Hitachi Ltd Method for cell fusion
JPH0638742B2 (en) * 1986-02-19 1994-05-25 株式会社日立製作所 Raw sample processing method
JPS6359875A (en) * 1986-08-29 1988-03-15 Mitsubishi Electric Corp Apparatus for processing cell with laser
US4731158A (en) * 1986-09-12 1988-03-15 International Business Machines Corporation High rate laser etching technique
US4840175A (en) * 1986-12-24 1989-06-20 Peyman Gholam A Method for modifying corneal curvature
JPS63202369A (en) * 1987-02-18 1988-08-22 Hitachi Ltd Perforation with laser and apparatus therefor
US5057100A (en) * 1988-04-11 1991-10-15 I.L. Med., Inc. Laser head and microscope attachment assembly with swivel capability
JP3170023B2 (en) * 1992-02-27 2001-05-28 ホーヤ株式会社 Laser processing equipment
DE4232915A1 (en) * 1992-10-01 1994-04-07 Hohla Kristian Device for shaping the cornea by removing tissue
DE4300698A1 (en) * 1993-01-13 1994-07-14 Raimund Schuetze Device and method for handling, processing and observing small particles, in particular biological particles
US5611946A (en) * 1994-02-18 1997-03-18 New Wave Research Multi-wavelength laser system, probe station and laser cutter system using the same
US6040139A (en) * 1995-09-19 2000-03-21 Bova; G. Steven Laser cell purification system
WO1997029354A1 (en) * 1996-02-05 1997-08-14 Bayer Aktiengesellschaft Process and device for sorting and for extraction of biological objects arranged on planar means, such as biological cells or cell organelles, histological sections, chromosome particles etc. using laser beams
AU4562497A (en) * 1996-10-02 1998-04-24 Cell Robotics, Inc. Microscope with laser port
US6469779B2 (en) * 1997-02-07 2002-10-22 Arcturus Engineering, Inc. Laser capture microdissection method and apparatus
JPH11148887A (en) * 1997-11-17 1999-06-02 Japan Science & Technology Corp Cutting method for organism sample as well as method and apparatus for collection of cut piece
JPH10216966A (en) * 1998-02-20 1998-08-18 Hoya Corp Laser beam machine
CA2337900C (en) * 1998-07-30 2004-05-11 Robert F. Bonner Precision laser capture microdissection utilizing short pulse length
DE10018251C2 (en) * 2000-04-13 2003-08-14 Leica Microsystems Laser cutting device with microscope
DE10043506C1 (en) * 2000-09-01 2001-12-06 Leica Microsystems Laser micro dissection of tissue samples for culture uses a laser beam to cut border around section, leaving connecting strip which is cut using single, focused laser impulse which is wider than previous cut, so that section falls out
DE10043504C2 (en) * 2000-09-01 2002-07-04 Leica Microsystems Method for laser microdissection and use of a device for laser microdissection

Also Published As

Publication number Publication date
TW496958B (en) 2002-08-01
JP4236844B2 (en) 2009-03-11
WO2001079806A1 (en) 2001-10-25
DE10018255C2 (en) 2003-08-28
EP1279016A1 (en) 2003-01-29
US20020164678A1 (en) 2002-11-07
DE10018255A1 (en) 2001-10-25
JP2003531369A (en) 2003-10-21

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