DE102014202646A1 - Method for producing an object from a material and / or for processing an object - Google Patents

Abstract

The present invention relates to a method for producing an object (210) from a material (205) and / or for processing an object (210) as well as an apparatus for producing and / or processing an object, wherein the object (210) in the course of Production and / or processing by means of a laser beam (207) is applied, wherein the laser beam (207) by a device for laser microdissection (100) is generated.

Description

The present invention relates to a method for producing an object from a material and / or for processing an object, and to an apparatus for producing and / or processing an object. The object is applied in the course of production and / or processing by means of a laser beam.

State of the art

Appropriate three-dimensional objects can be produced and processed by means of known generative manufacturing methods. In this case, the object is assembled from a material or from a starting material in layers. Such materials are usually in an informal state, especially as a liquid or powder. For each of these layers, the material is applied and solidified in the desired shape. Layer by layer, the finished object is thus constructed or assembled from the material.

Such a technique is known, for example, as 3D printing, in which a liquid binder (such as epoxy resin) is sprayed onto a powder bed via a nozzle. After solidification, a new powder layer is applied, which in turn is selectively solidified, etc., until the three-dimensional object is formed.

The material can also be selectively applied or treated with a suitable laser beam. By means of the laser beam, for example, the material can be liquefied or melted or remelted (selective laser melting). Furthermore, an already liquid material can be cured by means of the laser beam (stereolithography). By means of the laser beam, the material can also be sintered (selective laser sintering). During sintering, a powdery or granular material in a defined atmosphere is first melted by heating (and optionally under elevated pressure) and then cured. Generative manufacturing techniques typically use a CO ₂ laser, an Nd: YAG laser, or a fiber laser to create this laser beam. The laser beam scans over the cross-section of the object in the layer currently to be generated.

In a generative manufacturing process, no special tools are needed that have stored geometry of the finished object, such as molds into which a liquid material is introduced and cured. Generative manufacturing processes thus have the advantage that no complicated production of molds is necessary. Furthermore, material loss hardly occurs in generative production processes, as is the case, for example, with subtractive production methods such as cutting, turning or drilling.

Generative manufacturing methods can be used in the course of a so-called "rapid prototyping", wherein the respective object is produced as a prototype. Furthermore, in the course of a so-called "rapid tooling" tools and tool components can be produced. Furthermore, in the course of a so-called "rapid manufacturing" certain components can be produced. In particular in the field of electronics and micromechanics, object structures with dimensions of about 10 μm to several 100 μm can be manufactured with high efficiency by means of generative manufacturing processes. Furthermore, generally only roughness values of up to 1.5 μm can be achieved by means of known generative manufacturing methods.

For processing an object, this can be exposed to a laser beam which cuts, liquefies or vaporizes the object at defined positions on the surface or, more generally, at the location of the absorption of the laser energy. With regard to the achievable dimensions of object structures, what has been said regarding generative production methods applies.

It is therefore desirable to provide a way to perform production and / or processing of objects with higher accuracy and less roughness.

Disclosure of the invention

According to the invention, a method for producing an object from a material and / or for processing an object as well as an apparatus for producing an object from a material and / or for processing an object with the features of the independent patent claims are proposed. Advantageous embodiments are the subject of the dependent claims and the following description.

Suitable materials can be used in this case expedient materials, such as plastics, metals or ceramics. The materials are in particular informal, in particular as a liquid or as a powder. In particular, finely powdered granules or colloidal solutions of plastics, ceramics and / or metals can be used as material. In particular, epoxy resins can be used as a material.

In the course of production and / or processing, the object is subjected to a laser beam. According to the invention, this laser beam generated by a device for laser microdissection.

Devices and methods for laser microdissection are known in particular from the field of medical technology. In the course of a laser microdissection, certain subareas of a biological sample are usually selected and cut out or cut out of the biological sample with the aid of a focused laser beam as so-called dissectate. For a detailed explanation of the laser microdissection, see DE 100 18 255 A1 or the EP 1 186 879 B1 the same applicant.

In particular, a device for laser microdissection has a device for generating a laser beam, for example an infrared or ultraviolet laser beam. Furthermore, a device for laser microdissection can also have a microscope. The laser beam is coupled into a beam path of the microscope. The laser beam is focused on the sample by a convenient microscope objective. In this case, the device for laser microdissection in particular comprises a laser deflection or laser scanning device which is set up to move the laser beam or its point of impingement over the (fixed) sample. This makes it possible in a simple manner to observe the sample microscopically during the dissection process. This structure is also preferred in the context of the present invention. For details regarding structure and operation is expressly to the said EP 1 186 879 B1 directed.

Advantages of the invention

In the course of the invention, it has been recognized that use of a device for laser microdissection during the manufacture and / or processing of objects brings about considerable advantages. In medical technology, high demands are placed on lasers or laser beams, which are used in the course of a laser microdissection. To ensure the most precise cutting line possible, the laser beam must be focused and guided with particular precision. By the invention, these advantages of laser microdissection can also be used for the production or processing of objects.

Instead of cutting out certain portions by means of the laser beam from a biological sample, the laser beam of the laser microdissection device is focused on specific areas of the object which are manufactured or processed. Since the laser beam of the laser microdissection apparatus can be focused with high precision on diameters of 0.4 to more than 20 μm (150x to 4x objective), the object can be processed with a higher precision than in the case of the conventional production mentioned above - or processing method is the case. In particular, a higher accuracy and a lower roughness of the object can be achieved than with conventional manufacturing or processing methods. In particular, an accuracy of less than 10 μm to 1 μm can be achieved and a roughness value of less than 0.5 μm. By means of the invention, object structures can thus be produced in a tenfold smaller scale than in conventional manufacturing or processing methods.

Advantageously, the laser microdissection device comprises a microscope with at least one objective and a laser deflection unit or laser scanning device. The laser beam is generated by a suitable laser and coupled into the microscope. The laser beam is directed by the laser scanning device at variable angles through the lens on the material and / or on the object to preselected positions. Thereby, a structure of the material and / or a structure of the object is changed on a microscopic scale. As a result, the object is made of the material or processed.

The laser scanning device, for example, by relative rotation of two glass wedge plates to each other to move the position of the laser beam on the object or the material. The laser beam is focused in particular by means of the microscope objective on the object or on the material. This setting of the position can be done by a user or automatically. In particular, the object can be observed by means of this microscope, which is part of the device for laser microdissection, enlarged. Thus, a processing or change of the object, which is caused by exposure to the laser beam, observed immediately by means of the microscope and checked for quality.

Preferably, a sequence of positions on the material and / or on the object is selected by means of control means. These positions are approached successively with the laser beam. Thus, the object is gradually produced or edited. Such control means are, for example, a control unit and a computing unit, which are associated with the laser scanning device. By means of the arithmetic unit, which is designed, for example, as a computer, the sequence of positions can be preselected by a user, for example. The arithmetic unit transmits the sequence of positions to the control unit. The control unit generates corresponding control signals for controlling a motor of the laser scanning device, whereby the laser beam deflected defined and directed to the appropriate position.

Further preferably, the control means at least a first optical component is adjusted, with which an angle of the laser beam with respect to an optical axis of the lens is varied. This sets a horizontal impact point of the laser beam on the material or on the object. As such a first optical component in particular glass wedge plates or mirrors are used.

Alternatively or additionally, the control means further preferably at least a second optical component is adjusted, with which a distance of a laser focus of the laser beam is adjusted relative to the lens. This sets a vertical point of incidence of the laser beam on the material or on the object. In particular axially displaceable (focusing) lenses are used as such a second optical component.

The sequence of positions preferably describes a two-dimensional or a three-dimensional structure on the material or on the object. Thus, for example, a particular area of the object can be edited or manufactured as a two-dimensional structure. In particular, a specific volume of the object can be processed or produced as a three-dimensional structure.

The main fields of application of the present invention can be divided into three areas: First, objects can be produced in layers by means of an additive manufacturing process from a material using a laser beam, this laser beam being provided by a laser microdissection device. Secondly, in particular, objects which have been produced in layers (with or without the use of a laser beam) by means of a generative manufacturing process, but also other objects can be processed or post-processed by means of a laser beam, the latter laser beam being provided by a laser microdissection device. Finally, thirdly, objects made of a shape-neutral material, for example in the form of a sphere or a cylinder, can be produced by machining this shape-neutral material by means of a laser beam in order to produce the object by ablation of the material, said laser beam in turn being produced by a device provided for laser microdissection. These three areas will be described in more detail below.

In the course of the invention, for example, (micro) functional components or microstructured components can be manufactured or processed. Such components can be used, for example, in optics, telecommunications, communications technology, medical technology or toolmaking. For example, waveguides, optical gratings, micro-injection and embossing molds, Fresnel lenses, printheads, microelectrodes, cathodes, and microstructured mold ejectors may be fabricated as objects. Also art or jewelry objects can be made or edited in the way. For example, signs of the zodiac or geometric shapes can be made as objects, which can then be cast, for example, in epoxy resin and used as beads.

In an advantageous embodiment of the invention, the object is assembled in layers by means of a generative manufacturing process of the material. In particular, this material is applied in layers in the course of the generative layer construction process and cured. In the course of this application and / or curing, the material or the object is subjected to the laser beam of the laser microdissection device.

In a preferred embodiment of the invention, the material is applied for a corresponding layer and melted or remelted by means of the laser beam. More preferably, the material is applied in the liquid state for a corresponding layer and cured by means of the laser beam. More preferably, the material is applied in particular in a powdery state and sintered by means of the laser beam. The laser beam of the device for laser microdissection is used in the course of the above-described layer-by-layer production of the object.

The laser beam of the device for laser microdissection is used in the same way as conventional laser beams (for example, a CO ₂ laser or a Nd: YAG laser) in conventional generative layer construction method.

In a further preferred embodiment of the invention, the object is made of a shape-neutral material, in particular of a band, wire or rod-shaped material. In particular, the material is designed as a rod made of UV-absorbing material. By means of the invention, such strip, wire or rod-shaped materials can be processed in a particularly simple manner and with high precision into (three-dimensional) objects. In this case, a smaller scale (in particular up to ten times smaller scale) can be achieved, than in conventional generative layer construction method. Also according to this embodiment, the object is in particular produced in layers of the form-neutral material.

Preferably, a 3D printing method, a selective laser sintering, a laser micro-sintering, a selective laser melting and / or a laser lithography are used as the generative layer construction method for producing an object.

In laser lithography, the (in particular liquid) material is cured by means of the laser beam. The material used is in particular light-curing plastic (photopolymer), for example epoxy resin. The thickness of the layers is usually between 50 microns and 250 microns.

The laser lithography is carried out in particular in a bath of the (liquid) material. After curing each layer, the object in the bath is lowered by the thickness of the layer. The liquid material over the object can be evenly distributed by means of a suitable wiper. The laser beam is moved by means of the laser microdissection device over the current layer to be cured.

In contrast to laser lithography, selective laser sintering (SLS) or laser micro-sintering, in particular, does not use liquid but powdery materials. By means of the laser beam, no photochemical reaction of the material is triggered during selective laser sintering or laser microsinternation, but grains or particles of the material are sintered or fused together. A new layer of the material is applied to the object, for example by means of a doctor blade or a roller. The thickness of the layers is usually between 1 .mu.m and 20 .mu.m. In particular, metals, ceramics, plastics and / or foundry sand are used as material in laser sintering or laser microsinternating.

In a selective laser melting of the material (especially as a powder) is not sintered, but melted by the laser beam. This makes it possible to build a pore-free and crack-free structure. The material is applied for each layer and melted or remelted by means of the laser beam. The melted up or remelted material solidifies and forms a solid material layer of the object. Subsequently, the object is lowered by the thickness of this layer and a new layer of the material is applied, melted or solidified and solidified. This cycle is repeated until the object has emerged in layers. The finished object is cleaned of excess (powdered) workpieces and (re) processed as required with the laser. The layers of the object in particular have a thickness of between 50 μm and 300 μm.

Preferably, by means of the device for laser microdissection, a laser frequency, a laser energy, a laser speed, a laser aperture and / or a laser focus of the laser beam are adjusted or varied or controlled. In particular, these laser parameters, that is to say the laser frequency, the laser energy, the laser aperture and / or the laser speed, are set in order to optimize the production or the processing of the object depending on the respective material and the object structures. In particular, the laser microdissection device comprises a laser control unit which controls these laser parameters. The laser microdissection device may comprise an auto-focus device for the laser beam, which automatically performs the best possible focusing of the laser beam. For example, the laser focus can be set via an optical system or the at least one second optical component of the laser microdissection device or a corresponding microscope. Such a device for laser microdissection is in the EP 1 186 879 B1 the same applicant described.

In particular, the laser aperture of the laser radiation is adjusted appropriately, as for example in the DE 100 18 255 A1 the same applicant is described. By reducing the laser aperture, the light beam of the laser beam becomes slimmer, resulting in an increase in the depth of field. As a result of this increased depth of field, the requirements on the focusing accuracy can be reduced.

In this case, a laser focus of the laser beam of the laser microdissection device with a diameter of 0.4 μm to 20 μm is preferably set. In particular, while a lens with a fourfold to 150-fold magnification is used. With such a laser focus, the object can be manufactured and processed much more precisely than in conventional methods.

In an advantageous embodiment of the invention, roughness values of the object are reduced for processing the object, impurities are eliminated and / or subtleties are added. Thus, the object can be refined, reworked and / or decorated in particular by means of the laser beam. For example, such subtleties may be added in a possible range of resolution. Such subtleties may be, for example, holes, especially holes in the micrometer range. Furthermore, for example, specific surface structures can be generated. Furthermore, compounds of subcomponents, for example by thermo-voltage-induced predetermined breaking points, can be achieved. In particular, the object can be refined or reworked or decorated in such a way that a lotus effect of the object is generated, for example, by appropriately changing the surface texture or the roughness of the object.

Preferably, the laser beam of the laser microdissection device is used as an optical tweezer (Laser Tweezer). Such optical tweezers serve to hold or move smallest, microscopic objects. Thus, particularly precise (micro) functional components or microstructured components can be manufactured or processed as objects. Furthermore, such microfunction components can be moved by means of such optical tweezers so as to be used as tools for producing even smaller components.

The function of optical tweezers is based on the fact that light exerts force on microscopic objects and these are drawn to the focus of the (highly focused) laser beam. The laser beam is focused on the object by the device for laser microdissection. The object is transparent in particular in the region of the wavelength of the laser beam. When the laser beam is focused on the object, any deviation in the position of the laser beam causes the object to be retracted into focus.

The invention further relates to a device for producing an object from a material and / or for processing an object and to a use of a device for laser microdissection for a method for producing an object from a material and / or for processing objects and a use of a Device for laser microdissection for a generative layer construction method for producing an object from a material and / or for processing objects. Embodiments of this device according to the invention and these uses according to the invention will become apparent from the above description of the method according to the invention in an analogous manner.

Further advantages and embodiments of the invention will become apparent from the description and the accompanying drawings.

It is understood that the features mentioned above and those yet to be explained below can be used not only in the particular combination given, but also in other combinations or in isolation, without departing from the scope of the present invention.

The invention is illustrated schematically with reference to an embodiment in the drawing and will be described in detail below with reference to the drawing.

figure description

1 schematically shows a preferred embodiment of a device according to the invention for producing and / or processing an object in the course of a generative layer construction process.

In the only one 1 a preferred embodiment of a device according to the invention for producing and / or processing an object is shown schematically and with 1 designated. The device 1 is adapted to perform a preferred embodiment of a method according to the invention.

The device 1 has on the one hand a device 200 to create an object using a generative manufacturing process. In doing so, the device performs 200 in this example, a selective laser sintering (SLS) as a generative manufacturing process by. The device 200 is therefore hereinafter referred to as SLS device 200 designated.

The SLS device 200 has a material feed unit 202 on. By means of this material supply unit 202 becomes a material, in particular a suitable powder, an object layer assembly 201 fed. In the object layer assembly 201 becomes an object 210 produced by a generative layer construction process.

The material feed unit 202 has a piston 202a on, with which the powdery material 205 on a plane 203 can be promoted. The piston 202a is in the vertical direction movable up and down, indicated by the double arrow 202b , A squeegee 206 is in horizontal direction across the plane 203 movable, indicated by the double arrow 206a , The one from the piston 202a subsidized material 205 is done by the squeegee 206 to a recess 207 in the plane 203 transported.

The object layer assembly 201 also has a piston 201 on, also in the vertical direction movable up and down, indicated by the double arrow 201b , The object 210 lies on this piston 201 on. The piston is suitably moved so that the surface of the object 210 in the recess 207 located. By the horizontal movement of the squeegee 206 is thus on the surface of the object 210 a layer 211 of the material 205 applied.

This layer 211 of the material 205 is now using a laser beam 107 applied. By means of the laser beam 107 becomes the layer 211 of the material 205 sintered.

For generating the laser beam 107 has the device 1 a device for laser microdissection 100 on. By means of the device for laser microdissection 100 can the laser beam 107 be focused with high precision and precisely over the object 210 or over the layer 211 of the material 205 to be moved.

The device for laser microdissection 100 has a microscope 101 on. From a laser 106 , in this example a UV laser, goes a laser beam 107 out into an incident-light illumination beam path 120 is coupled. The laser beam 107 goes through the laser scanning device 131 and passes through a beam splitter 113 to a lens 109 that the laser beam 107 on the object 210 focused. One of the object 210 through the lens 109 outgoing imaging beam path 121 passes through the beam splitter 113 to an eyepiece 112 ,

The setting of the laser scanning device 131 and thus the adjustment of the laser beam 107 on the object 210 takes place in this example with one of the laser scanning device 131 associated engine 132 , a control unit 133 and a calculator 116 , The control unit 133 and the calculator 116 are used as a control means to a sequence of positions on the object 210 or on a layer 211 of the material 205 to define in advance, which then successively with the laser beam 107 be approached. The layered production of the object 210 For this necessary positions are from the computer 116 certainly. The computer 116 in turn controls the control unit 133 of the motor 132 the laser scanning device 131 at. The motor 132 adjusted (not shown) glass wedge plates to the angle of the laser beam 107 opposite the optical axis of the lens 109 to vary. This causes a shift of the point of impact of the laser beam 107 in the horizontal direction, ie perpendicular to the optical axis of the lens 109 , scored. In order to adjust the point of impact of the laser beam in the vertical direction, it may be useful to have an axially displaceable lens in the laser beam 107 to arrange, which in turn can be adjusted deferred to the point of impact of the laser beam 107 in the direction of the optical axis of the lens 109 to move. In the event that the respectively acted upon layer 211 should lie in the laser beam focus, can be a known autofocus unit for the laser beam 107 to be available.

The motor 132 is with the control unit 133 connected to the control signals for controlling the motor 132 supplies. The control unit 133 is with the calculator 116 connected to the a monitor 118 connected. On the monitor 118 This is done by a camera 117 taken picture of the object 210 shown. The computer 116 is especially with the laser light source 106 connected and controls them with a convenient trigger signal to trigger laser pulses.

By the described control of the laser scanning device 131 the laser beam appears 107 at the output of the laser scanning device 131 under different deflection angles. In this case, the laser beam 107 by varying the deflection angle to any positions on the object 210 be guided. In this way it is possible to apply a newly applied layer on the object 210 by means of the laser beam 107 to sinter and in this way to build the object in layers.

LIST OF REFERENCE NUMBERS

1

Device for producing and / or processing an object

100

Device for laser microdissection

101

microscope

106

laser

107

laser beam

109

lens

112

eyepiece

113

beamsplitter

116

Calculator, control means

117

camera

118

monitor

120

Illumination beam path

121

Imaging beam path

131

Laser scanning device

132

engine

133

Control unit, control means

200

Device for selective laser sintering

201

Objektschichtbaueinheit

201

piston

201b

double arrow

202

Werkstoffzuführeinheit

202a

piston

202b

double arrow

203

level

205

material

206

doctor

206a

double arrow

207

recess

210

object

211

Layer of the material

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 10018255 A1 [0012, 0034]
• EP 1186879 B1 [0012, 0013, 0033]

Claims (17)

Method for producing an object ( 210 ) of a material ( 205 ) and / or for editing an object ( 210 ), where the object ( 210 ) in the course of production and / or processing by means of a laser beam ( 107 ) is acted upon, characterized in that the laser beam ( 107 ) by a laser microdissection device ( 100 ) is produced. Method according to claim 1, characterized in that the laser beam ( 107 ) of a laser ( 106 ) in a microscope ( 101 ) with at least one lens ( 109 ) is coupled, wherein the laser beam ( 107 ) means of a laser scanning device ( 131 ) at variable angles through the lens ( 109 ) on the material ( 205 ) and / or on the object ( 210 ) is directed to preselected positions, whereby a structure of the material ( 205 ) and / or a structure of the object ( 210 ) on a microscopic scale and thereby the object ( 210 ) is produced or processed. Method according to claim 1 or 2, characterized in that by means of control means ( 116 . 133 ) a sequence of positions on the material ( 205 ) and / or on the object ( 210 ) is selected, these positions successively with the laser beam ( 107 ) and thus the object ( 210 ) is produced or processed step by step. Method according to claim 3, characterized in that with the control means ( 166 . 133 ) at least a first optical component is adjusted, with which an angle of the laser beam ( 107 ) with respect to an optical axis of the objective ( 109 ) and thus a horizontal impact point of the laser beam ( 107 ) on the material ( 205 ) or on the object ( 210 ) is set. Method according to claim 3 or 4, characterized in that with the control means ( 166 . 133 ) at least a second optical component is adjusted, with which a distance of a laser focus of the laser beam ( 107 ) relative to the lens ( 109 ) and thus a vertical point of incidence of the laser beam ( 107 ) on the material ( 205 ) or on the object ( 210 ) is set. Method according to one of claims 3 to 5, characterized in that the sequence of positions a two-dimensional or a three-dimensional structure on the material ( 205 ) and / or on the object ( 210 ). Method according to one of the preceding claims, characterized in that the object ( 210 ) by means of a generative manufacturing process layer by layer from the material ( 205 ) is joined together. Method according to claim 7, characterized in that the material ( 205 ) by means of the laser beam ( 107 ) or the material ( 205 ) in the liquid state and by means of the laser beam ( 107 ) or where the material ( 205 ) by means of the laser beam ( 107 ) is sintered. Method according to one of the preceding claims, characterized in that the object ( 210 ) is made of a shape-neutral material, in particular of a band, wire or rod-shaped material. Method according to one of the preceding claims, characterized in that for the production of the object ( 210 ), a 3D printing process, a selective laser sintering, a laser microsintern, a selective laser melting and / or a laser lithography are performed. Method according to one of the preceding claims, characterized in that by means of the device for laser microdissection ( 100 ) a laser frequency, a laser energy, a laser speed, a laser aperture and / or a laser focus of the laser beam ( 107 ). Method according to claim 11, characterized in that the laser focus of the laser beam ( 107 ) is set with a diameter of 0.4 .mu.m to 20 .mu.m. Method according to one of the preceding claims, characterized in that for processing the object ( 210 ) Roughness values of the object ( 210 ), remove impurities and / or add subtleties. Method according to one of the preceding claims, characterized in that the laser beam ( 107 ) of the laser microdissection device ( 100 ) is used as an optical tweezers. Contraption ( 1 ) for producing and / or editing an object ( 210 ) with a device for laser microdissection ( 100 ), adapted to perform a method according to any one of the preceding claims. Use of a device for laser microdissection ( 100 ) for a method of manufacturing an object ( 210 ) of a material ( 205 ) and / or for editing an object ( 210 ), where - the object ( 210 ) in the course of production and / or processing by means of a laser beam ( 107 ) and The laser beam ( 107 ) by the laser microdissection device ( 100 ) is produced. Use of a device for laser microdissection ( 100 ) for a generative layer construction method for producing an object ( 210 ) of a material ( 205 ) and / or for editing an object ( 210 ), where - the object ( 210 ) in layers of a material ( 205 ), - the object ( 210 ) in the course of production and / or processing by means of a laser beam ( 107 ) and - the laser beam ( 107 ) by the laser microdissection device ( 100 ) is produced.

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