AU2001271795A1 - Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures - Google Patents

Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures

Info

Publication number
AU2001271795A1
AU2001271795A1 AU2001271795A AU7179501A AU2001271795A1 AU 2001271795 A1 AU2001271795 A1 AU 2001271795A1 AU 2001271795 A AU2001271795 A AU 2001271795A AU 7179501 A AU7179501 A AU 7179501A AU 2001271795 A1 AU2001271795 A1 AU 2001271795A1
Authority
AU
Australia
Prior art keywords
signatures
mechanical polishing
chemical mechanical
polishing tool
carrier head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001271795A
Other languages
English (en)
Inventor
William J. Campbell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001271795A1 publication Critical patent/AU2001271795A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2001271795A 2000-07-28 2001-07-03 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures Abandoned AU2001271795A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/627,737 US6592429B1 (en) 2000-07-28 2000-07-28 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures
US09627737 2000-07-28
PCT/US2001/021142 WO2002011198A2 (en) 2000-07-28 2001-07-03 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures

Publications (1)

Publication Number Publication Date
AU2001271795A1 true AU2001271795A1 (en) 2002-02-13

Family

ID=24515919

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001271795A Abandoned AU2001271795A1 (en) 2000-07-28 2001-07-03 Method and apparatus for controlling wafer uniformity in a chemical mechanical polishing tool using carrier head signatures

Country Status (5)

Country Link
US (1) US6592429B1 (de)
EP (1) EP1307909B1 (de)
AU (1) AU2001271795A1 (de)
DE (1) DE60125185T2 (de)
WO (1) WO2002011198A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7089782B2 (en) * 2003-01-09 2006-08-15 Applied Materials, Inc. Polishing head test station
DE10345376B4 (de) * 2003-09-30 2009-04-16 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum automatischen Steuern einer Stromverteilung einer Mehrfachanodenanordnung während des Plattierens eines Metalls auf eine Substratoberfläche
US7750657B2 (en) * 2007-03-15 2010-07-06 Applied Materials Inc. Polishing head testing with movable pedestal
DE102008009641A1 (de) * 2007-08-31 2009-03-05 Advanced Micro Devices, Inc., Sunnyvale Profilsteuerung in Ringanodenplattierkammern für Vielschrittrezepte
SG11201902651QA (en) * 2016-10-18 2019-05-30 Ebara Corp Substrate processing control system, substrate processing control method, and program

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753044A (en) 1995-02-15 1998-05-19 Applied Materials, Inc. RF plasma reactor with hybrid conductor and multi-radius dome ceiling
US5609719A (en) 1994-11-03 1997-03-11 Texas Instruments Incorporated Method for performing chemical mechanical polish (CMP) of a wafer
JPH1076464A (ja) 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
JPH11285968A (ja) * 1998-04-01 1999-10-19 Nikon Corp 研磨方法及び研磨装置
JPH11302878A (ja) 1998-04-21 1999-11-02 Speedfam-Ipec Co Ltd ウエハ平坦化方法，ウエハ平坦化システム及びウエハ
US6244935B1 (en) * 1999-02-04 2001-06-12 Applied Materials, Inc. Apparatus and methods for chemical mechanical polishing with an advanceable polishing sheet
US6241585B1 (en) * 1999-06-25 2001-06-05 Applied Materials, Inc. Apparatus and method for chemical mechanical polishing

Also Published As

Publication number Publication date
DE60125185D1 (de) 2007-01-25
WO2002011198A2 (en) 2002-02-07
US6592429B1 (en) 2003-07-15
EP1307909A2 (de) 2003-05-07
WO2002011198A3 (en) 2002-04-11
EP1307909B1 (de) 2006-12-13
DE60125185T2 (de) 2007-09-20

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