AU2001271063A1 - Cleaning gas for semiconductor production equipment - Google Patents

Cleaning gas for semiconductor production equipment

Info

Publication number
AU2001271063A1
AU2001271063A1 AU2001271063A AU7106301A AU2001271063A1 AU 2001271063 A1 AU2001271063 A1 AU 2001271063A1 AU 2001271063 A AU2001271063 A AU 2001271063A AU 7106301 A AU7106301 A AU 7106301A AU 2001271063 A1 AU2001271063 A1 AU 2001271063A1
Authority
AU
Australia
Prior art keywords
production equipment
cleaning gas
semiconductor production
semiconductor
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001271063A
Inventor
Manabu Ohhira
Toshio Ohi
Hiromoto Ohno
Koutarou Tanaka
Shuji Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000397269A external-priority patent/JP2002198357A/en
Priority claimed from JP2001189388A external-priority patent/JP2002100618A/en
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of AU2001271063A1 publication Critical patent/AU2001271063A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Detergent Compositions (AREA)
AU2001271063A 2000-07-18 2001-07-17 Cleaning gas for semiconductor production equipment Abandoned AU2001271063A1 (en)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
JP2000-217610 2000-07-18
JP2000217610 2000-07-18
US23081100P 2000-09-07 2000-09-07
US60230811 2000-09-07
JP2000-397269 2000-12-21
JP2000397269A JP2002198357A (en) 2000-12-27 2000-12-27 Cleaning gas and cleaning method of semiconductor manufacturing apparatus
US26126501P 2001-01-16 2001-01-16
US60261265 2001-01-16
JP2001189388A JP2002100618A (en) 2000-07-18 2001-06-22 Cleaning gas for semiconductor manufacturing apparatus and its method of cleaning
JP2001-189388 2001-06-22
PCT/JP2001/006164 WO2002007194A2 (en) 2000-07-18 2001-07-17 Cleaning gas for semiconductor production equipment

Publications (1)

Publication Number Publication Date
AU2001271063A1 true AU2001271063A1 (en) 2002-01-30

Family

ID=27531608

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001271063A Abandoned AU2001271063A1 (en) 2000-07-18 2001-07-17 Cleaning gas for semiconductor production equipment

Country Status (3)

Country Link
KR (1) KR100485743B1 (en)
AU (1) AU2001271063A1 (en)
WO (1) WO2002007194A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234299A (en) * 2002-02-12 2003-08-22 Research Institute Of Innovative Technology For The Earth Cleaning gas and etching gas
US6886573B2 (en) 2002-09-06 2005-05-03 Air Products And Chemicals, Inc. Plasma cleaning gas with lower global warming potential than SF6
US20080110744A1 (en) * 2004-06-30 2008-05-15 Jean-Marc Girard Method for the Preparation of a Gas or Mixture of Gases Containing Molecular Fluorine
FR2887245B1 (en) * 2005-06-21 2007-11-02 Air Liquide PROCESS FOR THE PREPARATION OF A GAS OR MIXTURE OF GAS CONTAINING MOLECULAR FLUORINE
FR2872505B1 (en) * 2004-06-30 2007-02-02 Air Liquide FLUORINE GAS GENERATOR
US7581549B2 (en) 2004-07-23 2009-09-01 Air Products And Chemicals, Inc. Method for removing carbon-containing residues from a substrate
US20110073136A1 (en) 2009-09-10 2011-03-31 Matheson Tri-Gas, Inc. Removal of gallium and gallium containing materials
JP6661283B2 (en) * 2015-05-14 2020-03-11 東京エレクトロン株式会社 Cleaning method and plasma processing method
WO2021260869A1 (en) 2020-06-25 2021-12-30 株式会社日立ハイテク Vacuum process method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02129371A (en) * 1988-11-08 1990-05-17 Canon Inc Method for cleaning device for forming deposited film
JPH0729877A (en) * 1991-12-02 1995-01-31 Applied Materials Inc Dry method for removing undesired residual oxide and/or silicon from processed semiconductor wafer

Also Published As

Publication number Publication date
WO2002007194A2 (en) 2002-01-24
KR20020032581A (en) 2002-05-03
KR100485743B1 (en) 2005-04-28
WO2002007194A8 (en) 2002-05-30
WO2002007194A3 (en) 2002-04-18

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