AU2001259377A1 - Material transport system - Google Patents

Material transport system

Info

Publication number
AU2001259377A1
AU2001259377A1 AU2001259377A AU5937701A AU2001259377A1 AU 2001259377 A1 AU2001259377 A1 AU 2001259377A1 AU 2001259377 A AU2001259377 A AU 2001259377A AU 5937701 A AU5937701 A AU 5937701A AU 2001259377 A1 AU2001259377 A1 AU 2001259377A1
Authority
AU
Australia
Prior art keywords
transport system
material transport
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259377A
Inventor
Christopher Hofmeister
Glenn L. Sindledecker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Publication of AU2001259377A1 publication Critical patent/AU2001259377A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting
AU2001259377A 2000-06-06 2001-05-03 Material transport system Abandoned AU2001259377A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09588392 2000-06-06
US09/588,392 US6364593B1 (en) 2000-06-06 2000-06-06 Material transport system
PCT/US2001/014177 WO2001094245A1 (en) 2000-06-06 2001-05-03 Material transport system

Publications (1)

Publication Number Publication Date
AU2001259377A1 true AU2001259377A1 (en) 2001-12-17

Family

ID=24353655

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259377A Abandoned AU2001259377A1 (en) 2000-06-06 2001-05-03 Material transport system

Country Status (5)

Country Link
US (1) US6364593B1 (en)
JP (1) JP4729237B2 (en)
AU (1) AU2001259377A1 (en)
TW (1) TW514617B (en)
WO (1) WO2001094245A1 (en)

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US6799932B2 (en) * 1994-04-28 2004-10-05 Semitool, Inc. Semiconductor wafer processing apparatus
EP0735573B1 (en) * 1995-03-28 2004-09-08 BROOKS Automation GmbH Loading and unloading station for semiconductor treatment installations
US20020025244A1 (en) * 2000-04-12 2002-02-28 Kim Ki-Sang Transfer system and apparatus for workpiece containers and method of transferring the workpiece containers using the same
US6997664B1 (en) * 2000-07-19 2006-02-14 Industrial Technology Research Institute Apparatus for loading/unloading wafers to and from semiconductor fabrication equipment
KR100500230B1 (en) * 2000-07-26 2005-07-11 삼성전자주식회사 Automatic carrying system and controlling method
EP1193736A1 (en) * 2000-09-27 2002-04-03 Infineon Technologies SC300 GmbH & Co. KG Vehicle for transporting a semiconductor device carrier to a semiconductor processing tool
EP1202325A1 (en) * 2000-10-25 2002-05-02 Semiconductor300 GmbH & Co KG Arrangement for transporting a semiconductor wafer carrier
US6592318B2 (en) * 2001-07-13 2003-07-15 Asm America, Inc. Docking cart with integrated load port
US7100340B2 (en) * 2001-08-31 2006-09-05 Asyst Technologies, Inc. Unified frame for semiconductor material handling system
US7165927B2 (en) 2002-06-19 2007-01-23 Brooks Automation, Inc. Automated material handling system for semiconductor manufacturing based on a combination of vertical carousels and overhead hoists
FR2844258B1 (en) * 2002-09-06 2005-06-03 Recif Sa SYSTEM FOR TRANSPORTING AND STORING SEMICONDUCTOR PLATE CONTAINERS, AND TRANSFER MECHANISM
US20070092359A1 (en) * 2002-10-11 2007-04-26 Brooks Automation, Inc. Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
KR101446511B1 (en) * 2002-10-11 2014-10-07 무라다기카이가부시끼가이샤 Automated material handling system
US20040118659A1 (en) * 2002-12-20 2004-06-24 Clinton Haris Method and system for operating a semiconductor factory
US20050069399A1 (en) * 2003-08-12 2005-03-31 Chih-Ming Hsieh Apparatus and method for dry-loading of substrates in scrubber cleaner
US7101138B2 (en) * 2003-12-03 2006-09-05 Brooks Automation, Inc. Extractor/buffer
WO2006046580A1 (en) * 2004-10-25 2006-05-04 Tokyo Electron Limited Carrying system, substrate treating device, and carrying method
US7410340B2 (en) * 2005-02-24 2008-08-12 Asyst Technologies, Inc. Direct tool loading
WO2006115157A1 (en) * 2005-04-22 2006-11-02 Rorze Corporation Cassette conveyance system
US7771151B2 (en) * 2005-05-16 2010-08-10 Muratec Automation Co., Ltd. Interface between conveyor and semiconductor process tool load port
DE102005039453B4 (en) * 2005-08-18 2007-06-28 Asys Automatic Systems Gmbh & Co. Kg Machining plant of modular construction for flat substrates
US20070128010A1 (en) * 2005-12-06 2007-06-07 International Business Machines Corporation An apparatus for pod transportation within a semiconductor fabrication facility
TW200909318A (en) * 2006-08-25 2009-03-01 Aquest Systems Corp Conveyor transfer system
JP5003292B2 (en) * 2006-11-07 2012-08-15 シンフォニアテクノロジー株式会社 Transport system
US9834378B2 (en) * 2006-12-22 2017-12-05 Brooks Automation, Inc. Loader and buffer for reduced lot size
US8814488B2 (en) * 2007-04-02 2014-08-26 Hitachi Kokusai Electric Inc. Substrate processing apparatus and semiconductor device manufacturing method
KR20130022025A (en) * 2011-08-24 2013-03-06 삼성전자주식회사 Loader for substrate storage container
CN105789085B (en) * 2014-12-24 2018-08-14 上海微电子装备（集团）股份有限公司 A kind of material transmission system of compatible kinds of processes silicon chip
US10177020B2 (en) * 2015-02-07 2019-01-08 Kla-Tencor Corporation System and method for high throughput work-in-process buffer
US9666461B1 (en) * 2016-02-05 2017-05-30 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor process and semiconductor processing device using the same
JP6593287B2 (en) * 2016-09-09 2019-10-23 株式会社ダイフク Goods transport equipment
JP7400616B2 (en) * 2020-05-01 2023-12-19 株式会社ダイフク Transfer equipment and container transfer method
CN112736002B (en) * 2020-12-31 2022-06-07 至微半导体(上海)有限公司 Wafer high-speed loading method for wafer cleaning equipment
CN114496758B (en) * 2022-01-11 2022-10-11 厦门中能微电子有限公司 VDMOS (vertical double-diffused metal oxide semiconductor) process adopting polysilicon gate low-temperature oxidation
CN115338705A (en) * 2022-06-30 2022-11-15 杭州众硅电子科技有限公司 Continuous wafer polishing system

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US4758127A (en) 1983-06-24 1988-07-19 Canon Kabushiki Kaisha Original feeding apparatus and a cassette for containing the original
US4674939A (en) 1984-07-30 1987-06-23 Asyst Technologies Sealed standard interface apparatus
JPH01181617A (en) * 1988-01-12 1989-07-19 Sato Tekko Kk Lift and transfer device
JPH02153548A (en) * 1988-12-05 1990-06-13 Kokusai Electric Co Ltd Wafer cassette charging device
US4995430A (en) 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5203445A (en) * 1990-03-17 1993-04-20 Tokyo Electron Sagami Limited Carrier conveying apparatus
US5186594A (en) * 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
JP2525284B2 (en) 1990-10-22 1996-08-14 ティーディーケイ株式会社 Clean transfer method and device
JPH04360545A (en) 1991-06-07 1992-12-14 Sharp Corp Parts supplying equipment
JPH081923B2 (en) 1991-06-24 1996-01-10 ティーディーケイ株式会社 Clean transfer method and device
JPH0590384A (en) * 1991-09-27 1993-04-09 Tokyo Electron Yamanashi Kk Cassette chamber
FR2697003B1 (en) 1992-10-16 1994-11-18 Commissariat Energie Atomique System for handling and confining flat objects in individual boxes.
JPH05338728A (en) 1992-06-05 1993-12-21 Fujitsu Ltd Wafer carrying method and device thereof
US5291923A (en) 1992-09-24 1994-03-08 Internatinal Business Machines Corporation Door opening system and method
JP3275390B2 (en) 1992-10-06 2002-04-15 神鋼電機株式会社 Portable closed container circulation type automatic transfer system
JPH06244268A (en) 1993-02-16 1994-09-02 Tokyo Electron Tohoku Ltd Transfer equipment
KR100221983B1 (en) 1993-04-13 1999-09-15 히가시 데쓰로 A treating apparatus for semiconductor process
JPH0778794A (en) * 1993-06-22 1995-03-20 Disco Abrasive Syst Ltd Cassette table of dicing device
JPH07297260A (en) * 1994-04-26 1995-11-10 Kokusai Electric Co Ltd Cassette loading equipment
EP0735573B1 (en) 1995-03-28 2004-09-08 BROOKS Automation GmbH Loading and unloading station for semiconductor treatment installations
US5607276A (en) 1995-07-06 1997-03-04 Brooks Automation, Inc. Batchloader for substrate carrier on load lock
JPH09260461A (en) * 1996-03-26 1997-10-03 Canon Inc Semiconductor manufacture device
JP3508495B2 (en) * 1996-08-14 2004-03-22 東京エレクトロン株式会社 Cassette chamber
JPH10107122A (en) * 1996-10-01 1998-04-24 Tokyo Electron Ltd Device for carrying in cassette for substrate to be processed
JPH10231023A (en) * 1997-02-24 1998-09-02 Matsushita Electric Ind Co Ltd Substrate carrying method and substrate carrying cassette
JPH10256346A (en) * 1997-03-13 1998-09-25 Tokyo Electron Ltd Cassette transferring mechanism and semiconductor manufacturing apparatus
JP4048551B2 (en) * 1998-01-23 2008-02-20 株式会社安川電機 Wafer cassette lifting device
JPH11288991A (en) * 1998-04-03 1999-10-19 Shinko Electric Co Ltd Load port
US6120229A (en) * 1999-02-01 2000-09-19 Brooks Automation Inc. Substrate carrier as batchloader
JP2001073138A (en) * 1999-09-07 2001-03-21 Shimadzu Corp Substrate treating device

Also Published As

Publication number Publication date
WO2001094245A1 (en) 2001-12-13
JP2003536247A (en) 2003-12-02
US6364593B1 (en) 2002-04-02
TW514617B (en) 2002-12-21
JP4729237B2 (en) 2011-07-20

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