AU2001241449A1 - Lateral dmos improved breakdown structure and method - Google Patents

Lateral dmos improved breakdown structure and method

Info

Publication number
AU2001241449A1
AU2001241449A1 AU2001241449A AU4144901A AU2001241449A1 AU 2001241449 A1 AU2001241449 A1 AU 2001241449A1 AU 2001241449 A AU2001241449 A AU 2001241449A AU 4144901 A AU4144901 A AU 4144901A AU 2001241449 A1 AU2001241449 A1 AU 2001241449A1
Authority
AU
Australia
Prior art keywords
lateral dmos
breakdown structure
improved breakdown
improved
dmos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001241449A
Inventor
James Beasom
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intersil Corp
Original Assignee
Intersil Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intersil Corp filed Critical Intersil Corp
Publication of AU2001241449A1 publication Critical patent/AU2001241449A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/402—Field plates
    • H01L29/405—Resistive arrangements, e.g. resistive or semi-insulating field plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
    • H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
    • H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
    • H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7831—Field effect transistors with field effect produced by an insulated gate with multiple gate structure
    • H01L29/7832—Field effect transistors with field effect produced by an insulated gate with multiple gate structure the structure comprising a MOS gate and at least one non-MOS gate, e.g. JFET or MESFET gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2001241449A 2000-02-18 2001-02-02 Lateral dmos improved breakdown structure and method Abandoned AU2001241449A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/506,711 US6614088B1 (en) 2000-02-18 2000-02-18 Breakdown improvement method and sturcture for lateral DMOS device
US09506711 2000-02-18
PCT/US2001/003701 WO2001061758A1 (en) 2000-02-18 2001-02-02 Lateral dmos improved breakdown structure and method

Publications (1)

Publication Number Publication Date
AU2001241449A1 true AU2001241449A1 (en) 2001-08-27

Family

ID=24015703

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001241449A Abandoned AU2001241449A1 (en) 2000-02-18 2001-02-02 Lateral dmos improved breakdown structure and method

Country Status (6)

Country Link
US (1) US6614088B1 (en)
EP (1) EP1183734A1 (en)
JP (1) JP2003523633A (en)
CN (1) CN1364316A (en)
AU (1) AU2001241449A1 (en)
WO (1) WO2001061758A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744117B2 (en) * 2002-02-28 2004-06-01 Motorola, Inc. High frequency semiconductor device and method of manufacture
US7485916B2 (en) * 2003-09-22 2009-02-03 Nxp, B.V. Dynamic control of capacitance elements in field effect structures
JP4757449B2 (en) * 2004-01-29 2011-08-24 三菱電機株式会社 Semiconductor device
US20050274985A1 (en) * 2004-05-26 2005-12-15 Adlerstein Michael G RF decoupled field plate for FETs
US7109562B2 (en) * 2005-02-07 2006-09-19 Leadtrend Technology Corp. High voltage laterally double-diffused metal oxide semiconductor
KR100734507B1 (en) 2005-05-12 2007-07-03 하이맥스 테크놀로지스, 인코포레이션 A structure for current leakage prevention of a high voltage device
US7382030B1 (en) 2006-07-25 2008-06-03 Rf Micro Devices, Inc. Integrated metal shield for a field effect transistor
DE102009038709B4 (en) 2009-08-25 2017-05-11 Infineon Technologies Austria Ag Semiconductor device with dielectric layer stack
DE102014005879B4 (en) * 2014-04-16 2021-12-16 Infineon Technologies Ag Vertical semiconductor device
CN104201207A (en) * 2014-09-16 2014-12-10 电子科技大学 High-voltage MOS (metal oxide semiconductor) device with adaptive bias field plates

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3922708A (en) 1974-03-04 1975-11-25 Ibm Method of producing high value ion implanted resistors
US4947232A (en) 1980-03-22 1990-08-07 Sharp Kabushiki Kaisha High voltage MOS transistor
GB2150746B (en) * 1983-12-02 1988-02-24 Habib Serag El Din El Sayed Mos transistor with surface accumulation region
JPS61168253A (en) 1985-01-19 1986-07-29 Sharp Corp High withstand voltage mos field effect semiconductor device
US4825278A (en) * 1985-10-17 1989-04-25 American Telephone And Telegraph Company At&T Bell Laboratories Radiation hardened semiconductor devices
US4823173A (en) 1986-01-07 1989-04-18 Harris Corporation High voltage lateral MOS structure with depleted top gate region
US5264719A (en) 1986-01-07 1993-11-23 Harris Corporation High voltage lateral semiconductor device
US4782460A (en) * 1987-04-06 1988-11-01 American Telephone And Telegraph Company, At&T Bell Laboratories Computing apparatus comprising a programmable resistor
JP2689703B2 (en) 1989-08-03 1997-12-10 富士電機株式会社 MOS type semiconductor device
US5329155A (en) * 1990-04-24 1994-07-12 Xerox Corporation Thin film integrated circuit resistor
US5040045A (en) * 1990-05-17 1991-08-13 U.S. Philips Corporation High voltage MOS transistor having shielded crossover path for a high voltage connection bus
JP2556175B2 (en) * 1990-06-12 1996-11-20 三菱電機株式会社 Structure for preventing electric field concentration in semiconductor devices
JP3207615B2 (en) * 1992-06-24 2001-09-10 株式会社東芝 Semiconductor device
DE4343140B4 (en) * 1993-12-17 2009-12-03 Robert Bosch Gmbh Semiconductor arrangement for influencing the breakdown voltage of transistors
US5466963A (en) 1994-01-13 1995-11-14 Harris Corporation Trench resistor architecture
JP2786104B2 (en) 1994-02-28 1998-08-13 日本電気株式会社 Semiconductor device
US5587329A (en) * 1994-08-24 1996-12-24 David Sarnoff Research Center, Inc. Method for fabricating a switching transistor having a capacitive network proximate a drift region
US6110804A (en) * 1996-12-02 2000-08-29 Semiconductor Components Industries, Llc Method of fabricating a semiconductor device having a floating field conductor

Also Published As

Publication number Publication date
CN1364316A (en) 2002-08-14
EP1183734A1 (en) 2002-03-06
WO2001061758A1 (en) 2001-08-23
JP2003523633A (en) 2003-08-05
US6614088B1 (en) 2003-09-02

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