AU2001240090A1 - Process for the manufacture of printed circuit boards with plated resistors - Google Patents
Process for the manufacture of printed circuit boards with plated resistorsInfo
- Publication number
- AU2001240090A1 AU2001240090A1 AU2001240090A AU4009001A AU2001240090A1 AU 2001240090 A1 AU2001240090 A1 AU 2001240090A1 AU 2001240090 A AU2001240090 A AU 2001240090A AU 4009001 A AU4009001 A AU 4009001A AU 2001240090 A1 AU2001240090 A1 AU 2001240090A1
- Authority
- AU
- Australia
- Prior art keywords
- manufacture
- printed circuit
- circuit boards
- plated resistors
- resistors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/14—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition
- H01C17/18—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by chemical deposition without using electric current
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09603978 | 2000-06-27 | ||
US09/603,978 US6281090B1 (en) | 1996-10-16 | 2000-06-27 | Method for the manufacture of printed circuit boards with plated resistors |
PCT/US2001/007279 WO2002001636A1 (fr) | 2000-06-27 | 2001-03-07 | Procede de fabrication de cartes de circuits imprimes a resistances metallisees |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001240090A1 true AU2001240090A1 (en) | 2002-01-08 |
Family
ID=24417674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001240090A Abandoned AU2001240090A1 (en) | 2000-06-27 | 2001-03-07 | Process for the manufacture of printed circuit boards with plated resistors |
Country Status (8)
Country | Link |
---|---|
US (1) | US6281090B1 (fr) |
EP (1) | EP1295337A4 (fr) |
JP (1) | JP2004502304A (fr) |
CN (1) | CN1209814C (fr) |
AU (1) | AU2001240090A1 (fr) |
CA (1) | CA2405830C (fr) |
TW (1) | TWI221757B (fr) |
WO (1) | WO2002001636A1 (fr) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6830627B1 (en) * | 1999-03-23 | 2004-12-14 | International Business Machines Corporation | Copper cleaning compositions, processes and products derived therefrom |
US6585904B2 (en) * | 2001-02-15 | 2003-07-01 | Peter Kukanskis | Method for the manufacture of printed circuit boards with plated resistors |
US20050146025A1 (en) * | 2001-02-26 | 2005-07-07 | John Gregory | Method of forming an opening or cavity in a substrate for receiving an electronic component |
US20020170897A1 (en) * | 2001-05-21 | 2002-11-21 | Hall Frank L. | Methods for preparing ball grid array substrates via use of a laser |
US6667090B2 (en) | 2001-09-26 | 2003-12-23 | Intel Corporation | Coupon registration mechanism and method |
US6825564B2 (en) | 2002-08-21 | 2004-11-30 | Micron Technology, Inc. | Nickel bonding cap over copper metalized bondpads |
US6767445B2 (en) * | 2002-10-16 | 2004-07-27 | Peter Kukanskis | Method for the manufacture of printed circuit boards with integral plated resistors |
US6897761B2 (en) | 2002-12-04 | 2005-05-24 | Cts Corporation | Ball grid array resistor network |
US20040245210A1 (en) * | 2003-06-09 | 2004-12-09 | Peter Kukanskis | Method for the manufacture of printed circuit boards with embedded resistors |
WO2005002303A1 (fr) * | 2003-06-30 | 2005-01-06 | Ibiden Co.,Ltd. | Carte imprimee |
JP4585807B2 (ja) * | 2003-12-05 | 2010-11-24 | 三井金属鉱業株式会社 | プリント配線基板の製造方法 |
TWI266568B (en) * | 2004-03-08 | 2006-11-11 | Brain Power Co | Method for manufacturing embedded thin film resistor on printed circuit board |
DE102004030800B4 (de) * | 2004-06-25 | 2017-05-18 | Epcos Ag | Verfahren zur Herstellung einer keramischen Leiterplatte |
US7342804B2 (en) | 2004-08-09 | 2008-03-11 | Cts Corporation | Ball grid array resistor capacitor network |
US7022464B2 (en) * | 2004-08-25 | 2006-04-04 | Peter Kukanskis | Integral plated resistor and method for the manufacture of printed circuit boards comprising the same |
US7596842B2 (en) * | 2005-02-22 | 2009-10-06 | Oak-Mitsui Inc. | Method of making multilayered construction for use in resistors and capacitors |
US7375021B2 (en) * | 2006-04-04 | 2008-05-20 | International Business Machines Corporation | Method and structure for eliminating aluminum terminal pad material in semiconductor devices |
TWI381792B (zh) * | 2007-08-31 | 2013-01-01 | Chi Mei Comm Systems Inc | 印刷電路板堆疊結構 |
US8242876B2 (en) | 2008-09-17 | 2012-08-14 | Stmicroelectronics, Inc. | Dual thin film precision resistance trimming |
US8042261B2 (en) * | 2009-01-20 | 2011-10-25 | Sung-Ling Su | Method for fabricating embedded thin film resistors of printed circuit board |
TWI394496B (zh) * | 2009-02-27 | 2013-04-21 | Ind Tech Res Inst | 具有電阻層的線路基板的製造方法 |
US8400257B2 (en) * | 2010-08-24 | 2013-03-19 | Stmicroelectronics Pte Ltd | Via-less thin film resistor with a dielectric cap |
US8659085B2 (en) | 2010-08-24 | 2014-02-25 | Stmicroelectronics Pte Ltd. | Lateral connection for a via-less thin film resistor |
US8436426B2 (en) | 2010-08-24 | 2013-05-07 | Stmicroelectronics Pte Ltd. | Multi-layer via-less thin film resistor |
US8927909B2 (en) | 2010-10-11 | 2015-01-06 | Stmicroelectronics, Inc. | Closed loop temperature controlled circuit to improve device stability |
US8809861B2 (en) | 2010-12-29 | 2014-08-19 | Stmicroelectronics Pte Ltd. | Thin film metal-dielectric-metal transistor |
US9159413B2 (en) | 2010-12-29 | 2015-10-13 | Stmicroelectronics Pte Ltd. | Thermo programmable resistor based ROM |
US8981527B2 (en) * | 2011-08-23 | 2015-03-17 | United Microelectronics Corp. | Resistor and manufacturing method thereof |
US8526214B2 (en) | 2011-11-15 | 2013-09-03 | Stmicroelectronics Pte Ltd. | Resistor thin film MTP memory |
US9603258B2 (en) | 2015-08-05 | 2017-03-21 | Uyemura International Corporation | Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom |
CN107743341A (zh) * | 2017-09-28 | 2018-02-27 | 衢州顺络电路板有限公司 | 提高内埋电阻信赖性的印制线路板及其制造方法 |
TWI780935B (zh) * | 2021-09-29 | 2022-10-11 | 欣興電子股份有限公司 | 於電路板上形成電阻的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3857683A (en) * | 1973-07-27 | 1974-12-31 | Mica Corp | Printed circuit board material incorporating binary alloys |
US4888574A (en) * | 1985-05-29 | 1989-12-19 | 501 Ohmega Electronics, Inc. | Circuit board material and method of making |
US4777718A (en) * | 1986-06-30 | 1988-10-18 | Motorola, Inc. | Method of forming and connecting a resistive layer on a pc board |
EP1011111A1 (fr) * | 1988-02-26 | 2000-06-21 | Gould Electronics Inc. | Couches métalliques résistantes et leur procédé de fabrication |
EP0837623B1 (fr) * | 1996-10-16 | 2004-08-18 | Macdermid Incorporated | Procédé de fabrication de panneaux à circuit imprimé avec des résistances plaquées |
US5945257A (en) | 1997-10-29 | 1999-08-31 | Sequent Computer Systems, Inc. | Method of forming resistors |
-
2000
- 2000-06-27 US US09/603,978 patent/US6281090B1/en not_active Expired - Lifetime
-
2001
- 2001-03-07 AU AU2001240090A patent/AU2001240090A1/en not_active Abandoned
- 2001-03-07 CN CNB018117228A patent/CN1209814C/zh not_active Expired - Fee Related
- 2001-03-07 JP JP2002505682A patent/JP2004502304A/ja active Pending
- 2001-03-07 CA CA002405830A patent/CA2405830C/fr not_active Expired - Fee Related
- 2001-03-07 EP EP01914736A patent/EP1295337A4/fr not_active Withdrawn
- 2001-03-07 WO PCT/US2001/007279 patent/WO2002001636A1/fr not_active Application Discontinuation
- 2001-03-28 TW TW090107355A patent/TWI221757B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6281090B1 (en) | 2001-08-28 |
EP1295337A1 (fr) | 2003-03-26 |
CA2405830A1 (fr) | 2002-01-03 |
WO2002001636A1 (fr) | 2002-01-03 |
EP1295337A4 (fr) | 2004-08-18 |
TWI221757B (en) | 2004-10-01 |
CN1209814C (zh) | 2005-07-06 |
CN1439174A (zh) | 2003-08-27 |
CA2405830C (fr) | 2007-05-22 |
JP2004502304A (ja) | 2004-01-22 |
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