AU2000270373A1 - Reduction of false alarms in pcb inspection - Google Patents
Reduction of false alarms in pcb inspectionInfo
- Publication number
- AU2000270373A1 AU2000270373A1 AU2000270373A AU7037300A AU2000270373A1 AU 2000270373 A1 AU2000270373 A1 AU 2000270373A1 AU 2000270373 A AU2000270373 A AU 2000270373A AU 7037300 A AU7037300 A AU 7037300A AU 2000270373 A1 AU2000270373 A1 AU 2000270373A1
- Authority
- AU
- Australia
- Prior art keywords
- reduction
- false alarms
- pcb inspection
- pcb
- inspection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/20—Image preprocessing
- G06V10/22—Image preprocessing by selection of a specific region containing or referencing a pattern; Locating or processing of specific regions to guide the detection or recognition
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/44—Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersections; Connectivity analysis, e.g. of connected components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/40—Extraction of image or video features
- G06V10/56—Extraction of image or video features relating to colour
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10016—Video; Image sequence
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IL2000/000552 WO2002021105A1 (en) | 2000-09-10 | 2000-09-10 | Reduction of false alarms in pcb inspection |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000270373A1 true AU2000270373A1 (en) | 2002-03-22 |
Family
ID=11042995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000270373A Abandoned AU2000270373A1 (en) | 2000-09-10 | 2000-09-10 | Reduction of false alarms in pcb inspection |
Country Status (7)
Country | Link |
---|---|
US (2) | US7177458B1 (en) |
JP (1) | JP2004509325A (en) |
CN (2) | CN1955717B (en) |
AU (1) | AU2000270373A1 (en) |
GB (1) | GB2388428A (en) |
IL (1) | IL154445A0 (en) |
WO (1) | WO2002021105A1 (en) |
Families Citing this family (38)
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JP3866688B2 (en) * | 2003-06-13 | 2007-01-10 | 三井金属鉱業株式会社 | Inspection device for film carrier tape for mounting electronic components and method for checking pattern defects |
US7027934B2 (en) | 2003-09-24 | 2006-04-11 | 3M Innovative Properties Company | Apparatus and method for automated web inspection |
US7120515B2 (en) | 2003-12-31 | 2006-10-10 | 3M Innovative Properties Company | Inventory control for web-based articles |
KR20060128979A (en) | 2003-12-31 | 2006-12-14 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Maximization of yield for web-based articles |
JP2005291760A (en) * | 2004-03-31 | 2005-10-20 | Anritsu Corp | Printed circuit board inspection apparatus |
US7623699B2 (en) | 2004-04-19 | 2009-11-24 | 3M Innovative Properties Company | Apparatus and method for the automated marking of defects on webs of material |
GB2417073A (en) * | 2004-08-13 | 2006-02-15 | Mv Res Ltd | A machine vision analysis system and method |
JP5010207B2 (en) * | 2006-08-14 | 2012-08-29 | 株式会社日立ハイテクノロジーズ | Pattern inspection apparatus and semiconductor inspection system |
US7925074B2 (en) * | 2006-10-16 | 2011-04-12 | Teradyne, Inc. | Adaptive background propagation method and device therefor |
US7542821B2 (en) | 2007-07-26 | 2009-06-02 | 3M Innovative Properties Company | Multi-unit process spatial synchronization of image inspection systems |
US8175739B2 (en) | 2007-07-26 | 2012-05-08 | 3M Innovative Properties Company | Multi-unit process spatial synchronization |
JP5236241B2 (en) * | 2007-10-02 | 2013-07-17 | シャープ株式会社 | Defect inspection apparatus, defect inspection method, image processing apparatus, program, and computer-readable recording medium recording the program |
KR20090100615A (en) * | 2008-03-20 | 2009-09-24 | 삼성전자주식회사 | Method of detecting a defect on an object |
US7797133B2 (en) | 2008-09-10 | 2010-09-14 | 3M Innovative Properties Company | Multi-roller registered repeat defect detection of a web process line |
JP5251678B2 (en) | 2009-03-31 | 2013-07-31 | ソニー株式会社 | Illumination device for visual inspection and visual inspection device |
US9035673B2 (en) * | 2010-01-25 | 2015-05-19 | Palo Alto Research Center Incorporated | Method of in-process intralayer yield detection, interlayer shunt detection and correction |
US8866899B2 (en) | 2011-06-07 | 2014-10-21 | Photon Dynamics Inc. | Systems and methods for defect detection using a whole raw image |
US8773140B2 (en) * | 2011-07-26 | 2014-07-08 | Photon Dynamics, Inc | System and method for inspection of electrical circuits |
US20130071006A1 (en) * | 2011-09-19 | 2013-03-21 | International Business Machines Corporation | Image Analysis of Processor Device Features |
TWI493201B (en) | 2012-11-09 | 2015-07-21 | Ind Tech Res Inst | Method and system for pins detection and insertion of electrical component |
JP6510189B2 (en) * | 2014-06-23 | 2019-05-08 | キヤノンメディカルシステムズ株式会社 | Medical image processing device |
CN105806848B (en) * | 2014-12-31 | 2019-06-07 | 技嘉科技股份有限公司 | Printed circuit board detection system and its detection method |
US10586318B2 (en) * | 2016-10-07 | 2020-03-10 | Raytheon Company | Automated model-based inspection system for screening electronic components |
US10984294B2 (en) * | 2016-12-02 | 2021-04-20 | Koninklijke Philips N.V. | Apparatus for identifying objects from an object class |
US10438340B2 (en) * | 2017-03-21 | 2019-10-08 | Test Research, Inc. | Automatic optical inspection system and operating method thereof |
CN107980094B (en) * | 2017-03-31 | 2021-02-26 | 深圳配天智能技术研究院有限公司 | Visual detection system and method |
US11300521B2 (en) * | 2017-06-14 | 2022-04-12 | Camtek Ltd. | Automatic defect classification |
CN107228860B (en) * | 2017-06-28 | 2020-04-24 | 北京因时机器人科技有限公司 | Gear defect detection method based on image rotation period characteristics |
US11320385B2 (en) | 2018-10-16 | 2022-05-03 | Seagate Technology Llc | Intelligent defect identification system |
CN109540901A (en) * | 2018-11-02 | 2019-03-29 | 英业达(重庆)有限公司 | Automatic optics inspection flame feedback system and method |
CN109752392B (en) * | 2018-12-24 | 2021-08-03 | 苏州江奥光电科技有限公司 | PCB defect type detection system and method |
CN109767445B (en) * | 2019-02-01 | 2020-11-27 | 佛山市南海区广工大数控装备协同创新研究院 | High-precision PCB defect intelligent detection method |
CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
CN110793472B (en) * | 2019-11-11 | 2021-07-27 | 桂林理工大学 | Grinding surface roughness detection method based on quaternion singular value entropy index |
CN113378665A (en) | 2019-11-27 | 2021-09-10 | 奥特斯科技(重庆)有限公司 | Method for handling a component carrier, optical inspection apparatus and computer-readable medium |
US11599988B2 (en) * | 2020-09-11 | 2023-03-07 | Super Micro Computer, Inc. | Inspection of circuit boards for unauthorized modifications |
CN114152615A (en) * | 2021-10-12 | 2022-03-08 | 宏华胜精密电子(烟台)有限公司 | Detection method, device and equipment of circuit board detection equipment and storage medium |
CN116503401B (en) * | 2023-06-26 | 2023-09-22 | 成都数联云算科技有限公司 | PCB (printed circuit board) connection board target detection method, device, equipment and medium |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1406146A (en) * | 1973-05-21 | 1975-09-17 | Mullard Ltd | Level sensor |
JPS59157505A (en) * | 1983-02-28 | 1984-09-06 | Hitachi Ltd | Pattern inspecting device |
US5774572A (en) | 1984-12-20 | 1998-06-30 | Orbotech Ltd. | Automatic visual inspection system |
US5774573A (en) * | 1984-12-20 | 1998-06-30 | Orbotech Ltd. | Automatic visual inspection system |
JPS62247478A (en) * | 1986-04-21 | 1987-10-28 | Hitachi Ltd | Pattern inspection instrument |
EP0246145B1 (en) * | 1986-05-10 | 1993-07-28 | Fujitsu Limited | Pattern inspection system |
US4758888A (en) | 1987-02-17 | 1988-07-19 | Orbot Systems, Ltd. | Method of and means for inspecting workpieces traveling along a production line |
JPH0317785A (en) * | 1989-06-14 | 1991-01-25 | Fujitsu Ltd | Pattern reading device |
JPH0357241A (en) * | 1989-07-26 | 1991-03-12 | Hitachi Ltd | Automatic external-appearance inspection apparatus |
JP3132565B2 (en) * | 1989-08-30 | 2001-02-05 | 株式会社日立製作所 | Defect inspection method and apparatus |
JPH03233349A (en) * | 1990-02-07 | 1991-10-17 | Nippon Seiko Kk | Pattern inspecting method and device |
US5272763A (en) * | 1990-03-02 | 1993-12-21 | Matsushita Electric Industrial Co., Ltd. | Apparatus for inspecting wiring pattern formed on a board |
JP2745763B2 (en) * | 1990-03-02 | 1998-04-28 | 松下電器産業株式会社 | Wiring pattern inspection equipment |
IL125216A (en) | 1990-12-04 | 2001-07-24 | Orbot Instr Ltd | Apparatus and method for microscopic inspection of articles |
US5586058A (en) * | 1990-12-04 | 1996-12-17 | Orbot Instruments Ltd. | Apparatus and method for inspection of a patterned object by comparison thereof to a reference |
US5204910A (en) | 1991-05-24 | 1993-04-20 | Motorola, Inc. | Method for detection of defects lacking distinct edges |
DE69331433T2 (en) * | 1992-10-22 | 2002-10-02 | Advanced Interconnection Tech | Device for the automatic optical inspection of printed circuit boards with wires laid therein |
JP3255562B2 (en) * | 1994-08-12 | 2002-02-12 | 株式会社東芝 | Surface inspection equipment |
JPH08189904A (en) * | 1995-01-06 | 1996-07-23 | Kawasaki Steel Corp | Surface defect detector |
JP3544237B2 (en) * | 1995-02-09 | 2004-07-21 | 独立行政法人 科学技術振興機構 | Production method of giant fullerene |
JPH08247960A (en) * | 1995-03-14 | 1996-09-27 | Adtec Eng:Kk | Visual inspection device |
JPH0992692A (en) * | 1995-07-13 | 1997-04-04 | Toray Ind Inc | Apparatus and method for inspecting tab tape, method and apparatus for manufacturing mounting tap tape |
JP3536884B2 (en) * | 1995-10-09 | 2004-06-14 | 株式会社神戸製鋼所 | Semiconductor wafer defect classification method and apparatus |
SG42307A1 (en) * | 1996-01-09 | 1997-08-15 | Peng Seng Toh | Measurement and inspection of leads on integrated circuit packages |
JP3752849B2 (en) * | 1997-07-04 | 2006-03-08 | 株式会社日立製作所 | Pattern defect inspection apparatus and pattern defect inspection method |
JPH11248641A (en) * | 1998-03-03 | 1999-09-17 | Sumitomo Metal Ind Ltd | Device and method for inspecting surface defect |
JPH11271232A (en) * | 1998-03-23 | 1999-10-05 | Hitachi Eng & Service Co Ltd | Method and device for detecting defect in wiring on printed board |
GB2357577B (en) | 1998-06-16 | 2003-08-20 | Orbotech Ltd | Illuminator for inspecting substantially flat surfaces |
JP4104213B2 (en) * | 1998-07-08 | 2008-06-18 | 松下電器産業株式会社 | Defect detection method |
JP4270604B2 (en) * | 1998-07-14 | 2009-06-03 | オリンパス株式会社 | Image input device |
JP2000028334A (en) * | 1998-07-15 | 2000-01-28 | Hitachi Ltd | Method and apparatus for inspecting pattern fault |
JP2000058601A (en) * | 1998-08-07 | 2000-02-25 | Nippon Inter Connection Systems Kk | Device and method of detecting defect in of tape carrier |
EP1105716B1 (en) | 1998-08-18 | 2005-10-26 | Orbotech Ltd. | Inspection of printed circuit boards using color |
WO2000019372A1 (en) | 1998-09-28 | 2000-04-06 | Orbotech Ltd. | Pixel coding and image processing method |
US6850636B1 (en) * | 1999-05-25 | 2005-02-01 | Nichiha Corporation | Surface inspection system |
IL131092A (en) | 1999-07-25 | 2006-08-01 | Orbotech Ltd | Optical inspection system |
-
2000
- 2000-09-10 WO PCT/IL2000/000552 patent/WO2002021105A1/en active Application Filing
- 2000-09-10 IL IL15444500A patent/IL154445A0/en active IP Right Grant
- 2000-09-10 CN CN2006101318267A patent/CN1955717B/en not_active Expired - Fee Related
- 2000-09-10 AU AU2000270373A patent/AU2000270373A1/en not_active Abandoned
- 2000-09-10 JP JP2002525473A patent/JP2004509325A/en active Pending
- 2000-09-10 CN CNB008198810A patent/CN1289901C/en not_active Expired - Fee Related
- 2000-09-10 US US10/363,982 patent/US7177458B1/en not_active Expired - Fee Related
- 2000-09-10 GB GB0305457A patent/GB2388428A/en not_active Withdrawn
-
2006
- 2006-12-29 US US11/618,471 patent/US20070165939A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
GB0305457D0 (en) | 2003-04-16 |
JP2004509325A (en) | 2004-03-25 |
CN1468371A (en) | 2004-01-14 |
CN1955717B (en) | 2011-04-20 |
CN1955717A (en) | 2007-05-02 |
IL154445A0 (en) | 2003-09-17 |
GB2388428A (en) | 2003-11-12 |
US7177458B1 (en) | 2007-02-13 |
CN1289901C (en) | 2006-12-13 |
US20070165939A1 (en) | 2007-07-19 |
WO2002021105A1 (en) | 2002-03-14 |
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