AU1938897A - System for realising connection jumpers between the tracks of double-sided printed circuit boards - Google Patents

System for realising connection jumpers between the tracks of double-sided printed circuit boards

Info

Publication number
AU1938897A
AU1938897A AU19388/97A AU1938897A AU1938897A AU 1938897 A AU1938897 A AU 1938897A AU 19388/97 A AU19388/97 A AU 19388/97A AU 1938897 A AU1938897 A AU 1938897A AU 1938897 A AU1938897 A AU 1938897A
Authority
AU
Australia
Prior art keywords
realising
tracks
double
printed circuit
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU19388/97A
Other languages
English (en)
Inventor
Pierluigi Volpi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Somacis - SpA
Original Assignee
SO MA CI S SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SO MA CI S SpA filed Critical SO MA CI S SpA
Publication of AU1938897A publication Critical patent/AU1938897A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Dc Digital Transmission (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
AU19388/97A 1996-03-13 1997-03-06 System for realising connection jumpers between the tracks of double-sided printed circuit boards Abandoned AU1938897A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IT96MC000032A IT1289327B1 (it) 1996-03-13 1996-03-13 Sistema per l'attuazione dei ponticelli di connessione fra le piste dei circuiti stampati a doppia faccia
ITMC96A0032 1996-03-13
PCT/IT1997/000049 WO1997034451A1 (en) 1996-03-13 1997-03-06 System for realising connection jumpers between the tracks of double-sided printed circuit boards

Publications (1)

Publication Number Publication Date
AU1938897A true AU1938897A (en) 1997-10-01

Family

ID=11357175

Family Applications (1)

Application Number Title Priority Date Filing Date
AU19388/97A Abandoned AU1938897A (en) 1996-03-13 1997-03-06 System for realising connection jumpers between the tracks of double-sided printed circuit boards

Country Status (3)

Country Link
AU (1) AU1938897A (en, 2012)
IT (1) IT1289327B1 (en, 2012)
WO (1) WO1997034451A1 (en, 2012)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1094447A (en) * 1965-11-19 1967-12-13 Telas A method of electrically interconnecting double-sided printed circuits
US3576669A (en) * 1968-08-15 1971-04-27 Nasa Method for coating through-holes
US4383495A (en) * 1980-06-02 1983-05-17 Western Electric Company, Inc. Apparatus for coating surfaces of a substrate
SE453708B (sv) * 1985-03-05 1988-02-22 Svecia Silkscreen Maskiner Ab Stenciltryckmaskin for att bilda ett materialskikt pa ett inre veggparti for ett genomgaende hal i en platta

Also Published As

Publication number Publication date
WO1997034451A1 (en) 1997-09-18
ITMC960032A1 (it) 1997-09-13
ITMC960032A0 (en, 2012) 1996-03-13
IT1289327B1 (it) 1998-10-02

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