AU1408497A - Infrared radiation detector having a reduced active area - Google Patents
Infrared radiation detector having a reduced active areaInfo
- Publication number
- AU1408497A AU1408497A AU14084/97A AU1408497A AU1408497A AU 1408497 A AU1408497 A AU 1408497A AU 14084/97 A AU14084/97 A AU 14084/97A AU 1408497 A AU1408497 A AU 1408497A AU 1408497 A AU1408497 A AU 1408497A
- Authority
- AU
- Australia
- Prior art keywords
- active area
- infrared radiation
- radiation detector
- reduced active
- reduced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/023—Particular leg structure or construction or shape; Nanotubes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/026—Control of working procedures of a pyrometer, other than calibration; Bandwidth calculation; Gain control
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0801—Means for wavelength selection or discrimination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0815—Light concentrators, collectors or condensers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/085—Optical arrangements having a through-hole enabling the optical elements to fulfil an additional optical function, e.g. mirrors or gratings having a through-hole for a light collecting or light injecting optical fiber
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0859—Sighting arrangements, e.g. cameras
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
- H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US790995P | 1995-12-04 | 1995-12-04 | |
| US007909 | 1995-12-04 | ||
| PCT/US1996/019261 WO1997021250A1 (en) | 1995-12-04 | 1996-12-04 | Infrared radiation detector having a reduced active area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU1408497A true AU1408497A (en) | 1997-06-27 |
Family
ID=21728755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU14084/97A Abandoned AU1408497A (en) | 1995-12-04 | 1996-12-04 | Infrared radiation detector having a reduced active area |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5760398A (enExample) |
| EP (1) | EP0865672B1 (enExample) |
| JP (1) | JP4091979B2 (enExample) |
| AU (1) | AU1408497A (enExample) |
| DE (1) | DE69610118T2 (enExample) |
| IL (1) | IL124691A (enExample) |
| WO (1) | WO1997021250A1 (enExample) |
Families Citing this family (62)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7495220B2 (en) | 1995-10-24 | 2009-02-24 | Bae Systems Information And Electronics Systems Integration Inc. | Uncooled infrared sensor |
| US5811815A (en) * | 1995-11-15 | 1998-09-22 | Lockheed-Martin Ir Imaging Systems, Inc. | Dual-band multi-level microbridge detector |
| US6515285B1 (en) * | 1995-10-24 | 2003-02-04 | Lockheed-Martin Ir Imaging Systems, Inc. | Method and apparatus for compensating a radiation sensor for ambient temperature variations |
| US6271802B1 (en) * | 1997-04-14 | 2001-08-07 | Mems Optical, Inc. | Three dimensional micromachined electromagnetic device and associated methods |
| US6459084B1 (en) | 1997-05-30 | 2002-10-01 | University Of Central Florida | Area receiver with antenna-coupled infrared sensors |
| JP3529596B2 (ja) * | 1997-08-06 | 2004-05-24 | 株式会社東芝 | 赤外線固体撮像装置及びその製造方法 |
| US6144030A (en) * | 1997-10-28 | 2000-11-07 | Raytheon Company | Advanced small pixel high fill factor uncooled focal plane array |
| GB2335077B (en) * | 1998-03-04 | 2003-05-28 | Marconi Gec Ltd | Radiation detectors |
| WO2000012985A1 (en) * | 1998-08-31 | 2000-03-09 | Daewoo Electronics Co., Ltd. | Bolometer including an absorber made of a material having a low deposition-temperature and a low heat-conductivity |
| WO2000012986A1 (en) * | 1998-08-31 | 2000-03-09 | Daewoo Electronics Co., Ltd. | Bolometer including a reflective layer |
| WO2000012984A1 (en) * | 1998-08-31 | 2000-03-09 | Daewoo Electronics Co., Ltd. | Bolometer with a serpentine stress balancing member |
| FR2788129B1 (fr) | 1998-12-30 | 2001-02-16 | Commissariat Energie Atomique | Detecteur bolometrique a antenne |
| GB2353428A (en) * | 1999-08-20 | 2001-02-21 | Bayerische Motoren Werke Ag | Monitoring system for a vehicle |
| JP2001264441A (ja) * | 2000-01-14 | 2001-09-26 | Seiko Instruments Inc | カロリーメーターとその製造方法 |
| AU2001262915A1 (en) * | 2000-02-24 | 2001-09-03 | University Of Virginia Patent Foundation | High sensitivity infrared sensing apparatus and related method thereof |
| US6690014B1 (en) | 2000-04-25 | 2004-02-10 | Raytheon Company | Microbolometer and method for forming |
| EP1279011A2 (en) | 2000-05-01 | 2003-01-29 | BAE SYSTEMS Information and Electronic Systems Integration, Inc. | Methods and apparatus for compensating a radiation sensor for temperature variations of the sensor |
| JP4612932B2 (ja) * | 2000-06-01 | 2011-01-12 | ホーチキ株式会社 | 赤外線検出素子および赤外線2次元イメージセンサ |
| JP3415817B2 (ja) * | 2000-08-28 | 2003-06-09 | アーベル・システムズ株式会社 | 太陽電池 |
| US6777681B1 (en) | 2001-04-25 | 2004-08-17 | Raytheon Company | Infrared detector with amorphous silicon detector elements, and a method of making it |
| US6476392B1 (en) * | 2001-05-11 | 2002-11-05 | Irvine Sensors Corporation | Method and apparatus for temperature compensation of an uncooled focal plane array |
| US8174694B2 (en) * | 2001-12-21 | 2012-05-08 | Bodkin Design And Engineering Llc | Hyperspectral imaging systems |
| US7796316B2 (en) * | 2001-12-21 | 2010-09-14 | Bodkin Design And Engineering Llc | Micro-optic shutter |
| US7049597B2 (en) * | 2001-12-21 | 2006-05-23 | Andrew Bodkin | Multi-mode optical imager |
| US20060072109A1 (en) * | 2004-09-03 | 2006-04-06 | Andrew Bodkin | Hyperspectral imaging systems |
| US6815659B2 (en) * | 2002-01-14 | 2004-11-09 | Palantyr Research, Llc | Optical system and method of making same |
| JP2004062938A (ja) * | 2002-07-25 | 2004-02-26 | Pioneer Electronic Corp | 球面収差補正装置及び球面収差補正方法 |
| US6689628B1 (en) | 2002-08-15 | 2004-02-10 | Bae Systems Information And Electronic Systems Integration Inc. | Method for dense pixel fabrication |
| JP3944465B2 (ja) | 2003-04-11 | 2007-07-11 | 三菱電機株式会社 | 熱型赤外線検出器及び赤外線フォーカルプレーンアレイ |
| US7013570B2 (en) * | 2003-06-18 | 2006-03-21 | Irwin-Industrial Tool Company | Stud finder |
| US7030378B2 (en) * | 2003-08-05 | 2006-04-18 | Bae Systems Information And Electronic Systems Integration, Inc. | Real-time radiation sensor calibration |
| US6974219B1 (en) | 2004-07-09 | 2005-12-13 | Bae Systems Information And Electronic Systems Integration Inc | Zero reflectance design for tilted devices |
| FR2883417B1 (fr) * | 2005-03-16 | 2007-05-11 | Ulis Soc Par Actions Simplifie | Detecteur bolometrique, dispositif de detection infrarouge mettant en oeuvre un tel detecteur et procede de fabrication de ce detecteur |
| FR2884608B1 (fr) * | 2005-04-18 | 2007-05-25 | Commissariat Energie Atomique | Detecteur bolometrique, dispositif de detection d'ondes electromagnetiques submillimetriques et millimetriques mettant en oeuvre un tel detecteur |
| DE102005018965B3 (de) * | 2005-04-23 | 2006-10-12 | HAWK Hochschule für angewandte Wissenschaft und Kunst | Bildwandler mit einer beheizbaren Wandlerschicht |
| US7439513B2 (en) * | 2005-08-16 | 2008-10-21 | Institut National D'optique | Fast microbolometer pixels with integrated micro-optical focusing elements |
| US7462831B2 (en) * | 2006-01-26 | 2008-12-09 | L-3 Communications Corporation | Systems and methods for bonding |
| US7459686B2 (en) * | 2006-01-26 | 2008-12-02 | L-3 Communications Corporation | Systems and methods for integrating focal plane arrays |
| US7655909B2 (en) * | 2006-01-26 | 2010-02-02 | L-3 Communications Corporation | Infrared detector elements and methods of forming same |
| US7718965B1 (en) | 2006-08-03 | 2010-05-18 | L-3 Communications Corporation | Microbolometer infrared detector elements and methods for forming same |
| US8153980B1 (en) | 2006-11-30 | 2012-04-10 | L-3 Communications Corp. | Color correction for radiation detectors |
| DE102008005167A1 (de) | 2008-01-19 | 2009-07-23 | Testo Ag | Wärmebildkamera |
| US8063370B2 (en) * | 2009-01-16 | 2011-11-22 | Hanvision Co., Ltd. | Semiconductor device and method of manufacturing the same |
| DE102009032486A1 (de) * | 2009-07-09 | 2011-01-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US8546757B2 (en) * | 2010-04-28 | 2013-10-01 | L-3 Communications Corporation | Pixel structure for microbolometer detector |
| CN103229320B (zh) * | 2010-05-30 | 2016-12-21 | 泰克尼昂研究开发基金有限公司 | 具有热天线的感测器件和用于感测电磁辐射的方法 |
| DE102010027679A1 (de) | 2010-07-20 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| JP5644257B2 (ja) * | 2010-08-20 | 2014-12-24 | Tdk株式会社 | 温度センサ |
| US8808888B2 (en) | 2010-08-25 | 2014-08-19 | Applied Materials, Inc. | Flow battery systems |
| US8765514B1 (en) | 2010-11-12 | 2014-07-01 | L-3 Communications Corp. | Transitioned film growth for conductive semiconductor materials |
| JP5706174B2 (ja) * | 2011-01-26 | 2015-04-22 | 三菱電機株式会社 | 赤外線センサおよび赤外線センサアレイ |
| FR2977937B1 (fr) * | 2011-07-15 | 2013-08-16 | Centre Nat Rech Scient | Detecteur bolometrique a performances ameliorees |
| CN102931201A (zh) * | 2011-08-11 | 2013-02-13 | 中国科学院微电子研究所 | 基于红外焦平面阵列的聚能微镜阵列及其制作方法 |
| KR101850520B1 (ko) * | 2011-10-10 | 2018-04-19 | 삼성전자주식회사 | 적외선 열상 감지기 및 그 제조 방법 |
| EP2581721B1 (en) | 2011-10-10 | 2019-05-08 | Samsung Electronics Co., Ltd | Infrared thermal detector and method of manufacturing the same |
| US9606016B2 (en) | 2012-12-31 | 2017-03-28 | Flir Systems, Inc. | Devices and methods for determining vacuum pressure levels |
| US10677656B2 (en) | 2012-12-31 | 2020-06-09 | Flir Systems, Inc. | Devices and methods for infrared reference pixels |
| JP2014235146A (ja) * | 2013-06-05 | 2014-12-15 | セイコーエプソン株式会社 | テラヘルツ波検出装置、カメラ、イメージング装置および計測装置 |
| FR3016997B1 (fr) * | 2014-01-30 | 2016-03-04 | Commissariat Energie Atomique | Detecteur de rayonnement photonique comportant un reseau d'antennes et un support resistif en spirale |
| KR101570445B1 (ko) * | 2014-02-27 | 2015-11-20 | 한국과학기술원 | 적외선 검출기 |
| US10218921B2 (en) * | 2016-09-15 | 2019-02-26 | Sensors Unlimited, Inc. | Imaging systems and methods |
| WO2022141188A1 (zh) * | 2020-12-30 | 2022-07-07 | 深圳市大疆创新科技有限公司 | 基于热辐射探测器的测温方法、装置及热辐射探测器 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130274A (ja) * | 1983-12-19 | 1985-07-11 | Toshiba Corp | 固体撮像装置 |
| JPH0682813B2 (ja) * | 1984-07-13 | 1994-10-19 | 日本電気株式会社 | 赤外線検出固体撮像素子の製造方法 |
| US4754139A (en) * | 1986-04-10 | 1988-06-28 | Aerojet-General Corporation | Uncooled high resolution infrared imaging plane |
| US5300915A (en) * | 1986-07-16 | 1994-04-05 | Honeywell Inc. | Thermal sensor |
| US5534111A (en) * | 1988-02-29 | 1996-07-09 | Honeywell Inc. | Thermal isolation microstructure |
| US5010251A (en) * | 1988-08-04 | 1991-04-23 | Hughes Aircraft Company | Radiation detector array using radiation sensitive bridges |
| US4922116A (en) * | 1988-08-04 | 1990-05-01 | Hughes Aircraft Company | Flicker free infrared simulator with resistor bridges |
| US5021663B1 (en) * | 1988-08-12 | 1997-07-01 | Texas Instruments Inc | Infrared detector |
| US5286976A (en) * | 1988-11-07 | 1994-02-15 | Honeywell Inc. | Microstructure design for high IR sensitivity |
| US4961626A (en) * | 1989-02-21 | 1990-10-09 | United Techologies Corporation | Direct incorporation of night vision in a helmet mounted display |
| US5113076A (en) * | 1989-12-19 | 1992-05-12 | Santa Barbara Research Center | Two terminal multi-band infrared radiation detector |
| US5401968A (en) * | 1989-12-29 | 1995-03-28 | Honeywell Inc. | Binary optical microlens detector array |
| CA2081306C (en) * | 1990-04-26 | 2000-07-18 | Kevin Charles Liddiard | Semiconductor film bolometer thermal infrared detector |
| GB2248964A (en) * | 1990-10-17 | 1992-04-22 | Philips Electronic Associated | Plural-wavelength infrared detector devices |
| US5171733A (en) * | 1990-12-04 | 1992-12-15 | The Regents Of The University Of California | Antenna-coupled high Tc superconducting microbolometer |
| US5288649A (en) * | 1991-09-30 | 1994-02-22 | Texas Instruments Incorporated | Method for forming uncooled infrared detector |
| WO1993009414A1 (en) * | 1991-11-04 | 1993-05-13 | Honeywell Inc. | Thin film pyroelectric imaging array |
| WO1993026050A1 (en) * | 1992-06-11 | 1993-12-23 | Honeywell Inc. | Two-level microbridge bolometer imaging array and method of making same |
| EP0649517B1 (en) * | 1992-07-08 | 1997-08-27 | Honeywell Inc. | Microstructure design for high ir sensitivity |
| US5399897A (en) * | 1993-11-29 | 1995-03-21 | Raytheon Company | Microstructure and method of making such structure |
| US5446284A (en) * | 1994-01-25 | 1995-08-29 | Loral Infrared & Imaging Systems, Inc. | Monolithic detector array apparatus |
| US5486698A (en) * | 1994-04-19 | 1996-01-23 | Texas Instruments Incorporated | Thermal imaging system with integrated thermal chopper |
| US5512748A (en) * | 1994-07-26 | 1996-04-30 | Texas Instruments Incorporated | Thermal imaging system with a monolithic focal plane array and method |
| US5603848A (en) * | 1995-01-03 | 1997-02-18 | Texas Instruments Incorporated | Method for etching through a substrate to an attached coating |
| US5626773A (en) * | 1995-01-03 | 1997-05-06 | Texas Instruments Incorporated | Structure and method including dry etching techniques for forming an array of thermal sensitive elements |
| US5572060A (en) * | 1995-02-01 | 1996-11-05 | Southern Methodist University | Uncooled YBaCuO thin film infrared detector |
| US5627082A (en) * | 1995-03-29 | 1997-05-06 | Texas Instruments Incorporated | High thermal resistance backfill material for hybrid UFPA's |
| JP3287173B2 (ja) * | 1995-04-07 | 2002-05-27 | 三菱電機株式会社 | 赤外線検出素子 |
| US5602393A (en) * | 1995-06-07 | 1997-02-11 | Hughes Aircraft Company | Microbolometer detector element with enhanced sensitivity |
-
1996
- 1996-12-04 JP JP52137897A patent/JP4091979B2/ja not_active Expired - Lifetime
- 1996-12-04 IL IL12469196A patent/IL124691A/en not_active IP Right Cessation
- 1996-12-04 EP EP96944222A patent/EP0865672B1/en not_active Expired - Lifetime
- 1996-12-04 AU AU14084/97A patent/AU1408497A/en not_active Abandoned
- 1996-12-04 WO PCT/US1996/019261 patent/WO1997021250A1/en not_active Ceased
- 1996-12-04 US US08/760,240 patent/US5760398A/en not_active Expired - Lifetime
- 1996-12-04 DE DE69610118T patent/DE69610118T2/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000501832A (ja) | 2000-02-15 |
| IL124691A0 (en) | 1998-12-06 |
| DE69610118T2 (de) | 2001-02-01 |
| JP4091979B2 (ja) | 2008-05-28 |
| US5760398A (en) | 1998-06-02 |
| EP0865672B1 (en) | 2000-08-30 |
| IL124691A (en) | 2001-06-14 |
| WO1997021250A1 (en) | 1997-06-12 |
| EP0865672A1 (en) | 1998-09-23 |
| DE69610118D1 (de) | 2000-10-05 |
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