ATE98542T1 - METHOD AND DEVICE FOR THE PROCESSING OF ELECTRONIC FLAT MODULES, IN PARTICULAR WITH COMPONENTS EQUIPPED PCBS. - Google Patents

METHOD AND DEVICE FOR THE PROCESSING OF ELECTRONIC FLAT MODULES, IN PARTICULAR WITH COMPONENTS EQUIPPED PCBS.

Info

Publication number
ATE98542T1
ATE98542T1 AT91118821T AT91118821T ATE98542T1 AT E98542 T1 ATE98542 T1 AT E98542T1 AT 91118821 T AT91118821 T AT 91118821T AT 91118821 T AT91118821 T AT 91118821T AT E98542 T1 ATE98542 T1 AT E98542T1
Authority
AT
Austria
Prior art keywords
defects
auxiliary substance
itself
oxide layers
soldering
Prior art date
Application number
AT91118821T
Other languages
German (de)
Inventor
Volker Liedke
Karl-Heinz Grasmann
Hans-Juergen Albrecht
Harald Wittrich
Wilfred John
Wolfgang Scheel
Original Assignee
Grasmann Karl Heinz Wls
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grasmann Karl Heinz Wls filed Critical Grasmann Karl Heinz Wls
Application granted granted Critical
Publication of ATE98542T1 publication Critical patent/ATE98542T1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/206—Cleaning
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Paper (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

During the pickling process in the novel method of soldering electronic printed circuit boards, in particular component-carrying printed circuit boards, a condensable auxiliary substance, for example water, is first adsorbed in defects in the oxide layers on the solder connection pads and at least partly condensed in the defects. The oxide layers are then subjected to such fast heating that the auxiliary substance condensed in the defects explosively evaporates and consequently breaks up the oxide layer, which detaches itself from the metallic base material in such a way that the solder connection pads are converted to a virgin state for the subsequent soldering process itself. In the case of wave soldering, the fast heating is preferably carried out by the solder wave itself. If nonoxidic passive layers have also to be removed by pickling, this is preferably done in a preceding step in the pickling process, during which the oxide layer is rendered hydrophilic. A plasma pretreatment is suitable for this purpose. The novel apparatus has a moistening chamber in which the condensable auxiliary substance is presented to the hydrophilic oxide layers and is adsorbed by the latter. <IMAGE>
AT91118821T 1990-12-21 1991-11-04 METHOD AND DEVICE FOR THE PROCESSING OF ELECTRONIC FLAT MODULES, IN PARTICULAR WITH COMPONENTS EQUIPPED PCBS. ATE98542T1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4041270A DE4041270A1 (en) 1990-12-21 1990-12-21 METHOD AND DEVICE FOR THE PROCESSING OF ELECTRONIC FLAT ASSEMBLIES, ESPECIALLY WITH CIRCUIT BOARDS

Publications (1)

Publication Number Publication Date
ATE98542T1 true ATE98542T1 (en) 1994-01-15

Family

ID=6421086

Family Applications (1)

Application Number Title Priority Date Filing Date
AT91118821T ATE98542T1 (en) 1990-12-21 1991-11-04 METHOD AND DEVICE FOR THE PROCESSING OF ELECTRONIC FLAT MODULES, IN PARTICULAR WITH COMPONENTS EQUIPPED PCBS.

Country Status (7)

Country Link
US (1) US5193739A (en)
EP (1) EP0492095B1 (en)
JP (1) JPH0851273A (en)
AT (1) ATE98542T1 (en)
DE (2) DE4041270A1 (en)
DK (1) DK0492095T3 (en)
ES (1) ES2049074T3 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4225378A1 (en) * 1992-03-20 1993-09-23 Linde Ag METHOD FOR SOLDERING PCBS UNDER LOW PRESSURE
FR2697456B1 (en) * 1992-10-30 1994-12-23 Air Liquide Dry fluxing method and device.
DE4338225A1 (en) * 1993-11-09 1995-05-11 Linde Ag Process for wave soldering using lead-free solders
US5499754A (en) * 1993-11-19 1996-03-19 Mcnc Fluxless soldering sample pretreating system
EP1378309B1 (en) * 1998-02-27 2008-07-09 Matsushita Electric Industrial Co., Ltd. Method for separating solder and solder oxides
DE10210217A1 (en) * 2002-03-08 2003-10-16 Behr Gmbh & Co Method of brazing aluminum
DE10342242A1 (en) * 2003-09-11 2005-04-07 Behr Gmbh & Co. Kg Soldering piece, soldering and heat exchanger
US8844793B2 (en) * 2010-11-05 2014-09-30 Raytheon Company Reducing formation of oxide on solder
CN117276086A (en) * 2023-09-20 2023-12-22 液化空气(中国)投资有限公司 a surface treatment method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2136392A (en) * 1936-06-08 1938-11-15 Murphy Daniel Francis Method for removing scale from boilers
DE1546174A1 (en) * 1965-03-19 1970-02-26 Otto & Co Gmbh Dr C Process for the continuous pickling of strand material
JPS5315010A (en) * 1976-07-27 1978-02-10 Nec Corp Bipolar pulse polarity error detection circuit
DE8520254U1 (en) * 1985-07-11 1985-10-31 Siemens AG, 1000 Berlin und 8000 München Soldering device for soldering electronic flat assemblies in a soldering chamber filled with inert gas
DE3824861A1 (en) * 1988-07-21 1990-01-25 Productech Gmbh METHOD FOR PRODUCING SOLDERED CONNECTIONS
GB8827933D0 (en) * 1988-11-30 1989-01-05 Plessey Co Plc Improvements relating to soldering processes
JPH02174190A (en) * 1988-12-26 1990-07-05 Hitachi Chem Co Ltd Mounting of electric parts
DE4032328A1 (en) * 1989-11-06 1991-09-19 Wls Karl Heinz Grasmann Weichl METHOD AND DEVICE FOR PROCESSING JOINT PARTNERS TO BE SOLDERED

Also Published As

Publication number Publication date
DK0492095T3 (en) 1994-01-24
EP0492095B1 (en) 1993-12-15
JPH0851273A (en) 1996-02-20
EP0492095A3 (en) 1992-08-26
DE59100736D1 (en) 1994-01-27
ES2049074T3 (en) 1994-04-01
DE4041270A1 (en) 1992-06-25
US5193739A (en) 1993-03-16
EP0492095A2 (en) 1992-07-01

Similar Documents

Publication Publication Date Title
JP3177211B2 (en) Method for filling holes in printed wiring boards
US5531838A (en) Flux composition and corresponding soldering method
ATE136834T1 (en) METHOD AND DEVICE FOR PROCESSING JOINING PARTNERS TO BE SOLDERED
ATE98542T1 (en) METHOD AND DEVICE FOR THE PROCESSING OF ELECTRONIC FLAT MODULES, IN PARTICULAR WITH COMPONENTS EQUIPPED PCBS.
ATE40627T1 (en) METHOD OF CLEANING HOLES IN PRINTED CIRCUIT BOARDS USING PERMANGANATE AND BASIC SOLUTIONS.
ATE7868T1 (en) DEVICE FOR DESOLDERING ELECTRONIC COMPONENTS FROM CIRCUIT BOARDS.
WO2001039922B1 (en) Soldering flux
ZA877006B (en) Process for preparing multilayer printed circuit boards
EP0513831B1 (en) Method for use of preflux, printed wiring board, and method for production thereof
US6838372B2 (en) Via interconnect forming process and electronic component product thereof
US5552579A (en) System for salvage and restoration on electrical components from a substrate
SE8702704D0 (en) SET FOR MANUFACTURING A SAMPLE CARD AND APPARATUS FOR USE IN IMPLEMENTATION OF THE SET
EP0675675B1 (en) Cleaning method
JPH01123499A (en) Electronic parts mounting method
JPH0799382A (en) Non-cleaning soldering method and apparatus
JP3982871B2 (en) Solder printing inspection processing method and solder printer
US5151299A (en) Method for forming a carbon resistance in a printed wiring board
Evans The Development of Soldering Methods for the Electronic Industry
JPH0936518A (en) Wiring board inspection method and device
JPS60165789A (en) Coating method
JP3279677B2 (en) Pretreatment method for fusing solder-plated printed wiring boards
JPH04197576A (en) Soldering method
JPH03211788A (en) Method of manufacturing printed wiring board
JPH05291314A (en) Soldering of bare chip
JPH1022644A (en) Method of drilling holes for via holes

Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee