ATE540563T1 - Verfahren zur ausrichtung und installierung flexibler schaltverbindungen - Google Patents
Verfahren zur ausrichtung und installierung flexibler schaltverbindungenInfo
- Publication number
- ATE540563T1 ATE540563T1 AT08075541T AT08075541T ATE540563T1 AT E540563 T1 ATE540563 T1 AT E540563T1 AT 08075541 T AT08075541 T AT 08075541T AT 08075541 T AT08075541 T AT 08075541T AT E540563 T1 ATE540563 T1 AT E540563T1
- Authority
- AT
- Austria
- Prior art keywords
- alignment
- installation
- flexible circuit
- module
- flexible switching
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09127—PCB or component having an integral separable or breakable part
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
- Y10T29/49179—Assembling terminal to elongated conductor by metal fusion bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structure Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/763,879 US7690107B2 (en) | 2007-06-15 | 2007-06-15 | Method for aligning and installing flexible circuit interconnects |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE540563T1 true ATE540563T1 (de) | 2012-01-15 |
Family
ID=39876729
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08075541T ATE540563T1 (de) | 2007-06-15 | 2008-06-06 | Verfahren zur ausrichtung und installierung flexibler schaltverbindungen |
Country Status (3)
Country | Link |
---|---|
US (2) | US7690107B2 (de) |
EP (1) | EP2003943B1 (de) |
AT (1) | ATE540563T1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7690107B2 (en) * | 2007-06-15 | 2010-04-06 | The Boeing Company | Method for aligning and installing flexible circuit interconnects |
US7868830B2 (en) * | 2008-05-13 | 2011-01-11 | The Boeing Company | Dual beam dual selectable polarization antenna |
TWI598721B (zh) * | 2015-07-13 | 2017-09-11 | 鴻騰精密科技股份有限公司 | 電子裝置 |
Family Cites Families (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS592786B2 (ja) * | 1977-07-06 | 1984-01-20 | 日本ピストンリング株式会社 | スタ−リングエンジン用ポンプ |
US4439169A (en) * | 1982-08-06 | 1984-03-27 | Stirling Thermal Motors, Inc. | Pressure containment device |
US4481771A (en) * | 1982-08-06 | 1984-11-13 | Stirling Thermal Motors, Inc. | Heat exchanger stack apparatus |
US4489999A (en) * | 1983-02-15 | 1984-12-25 | Motorola, Inc. | Socket and flexible PC board assembly and method for making |
US4554505A (en) * | 1983-06-10 | 1985-11-19 | Rockwell International Corporation | Test socket for a leadless chip carrier |
US4532855A (en) * | 1984-04-04 | 1985-08-06 | Stirling Thermal Motors, Inc. | Two-part drive shaft for thermal engine |
JPS60219438A (ja) * | 1984-04-13 | 1985-11-02 | Mitsubishi Electric Corp | スタ−リング機関 |
US4615261A (en) * | 1984-10-29 | 1986-10-07 | Stirling Thermal Motors, Inc. | Stirling engine with improved piston ring assembly |
US4579046A (en) * | 1984-10-29 | 1986-04-01 | Stirling Thermal Motors, Inc. | Yieldably mounted lubricant control assemblies for piston rods |
JPS62105501A (ja) | 1985-11-01 | 1987-05-16 | Mitsubishi Electric Corp | 電子走査アンテナ |
US4669736A (en) * | 1985-12-27 | 1987-06-02 | Stirling Thermal Motors, Inc. | Stirling engine with improved sealing piston ring assembly |
US4707990A (en) * | 1987-02-27 | 1987-11-24 | Stirling Thermal Motors, Inc. | Solar powered Stirling engine |
US5159535A (en) * | 1987-03-11 | 1992-10-27 | International Business Machines Corporation | Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate |
US4836094A (en) * | 1988-03-10 | 1989-06-06 | Stirling Thermal Motors, Inc. | Yieldably mounted lubricant control assemblies for piston rods |
US4885980A (en) * | 1988-03-10 | 1989-12-12 | Stirling Thermal Motors, Inc. | Hydrodynamic bearing |
US4994004A (en) * | 1988-11-30 | 1991-02-19 | Stirling Thermal Motors, Inc. | Electric actuator for swashplate |
US5019829A (en) | 1989-02-08 | 1991-05-28 | Heckman Douglas E | Plug-in package for microwave integrated circuit having cover-mounted antenna |
US4977742A (en) * | 1989-04-21 | 1990-12-18 | Stirling Thermal Motors, Inc. | Stirling engine with integrated gas combustor |
US4996841A (en) * | 1989-08-02 | 1991-03-05 | Stirling Thermal Motors, Inc. | Stirling cycle heat pump for heating and/or cooling systems |
JPH03151546A (ja) * | 1989-11-07 | 1991-06-27 | Aisin Seiki Co Ltd | スターリングエンジンのロツドシール装置 |
US5074114A (en) * | 1990-05-14 | 1991-12-24 | Stirling Thermal Motors, Inc. | Congeneration system with a stirling engine |
DE9014860U1 (de) * | 1990-10-26 | 1991-11-28 | Marker Deutschland GmbH, 8116 Eschenlohe | Traggerät für eine zur Zurschaustellung vorgesehene Skibindung |
US5276455A (en) * | 1991-05-24 | 1994-01-04 | The Boeing Company | Packaging architecture for phased arrays |
US5163837A (en) * | 1991-06-26 | 1992-11-17 | Amp Incorporated | Ordered area array connector |
US5468996A (en) * | 1994-03-25 | 1995-11-21 | International Business Machines Corporation | Electronic package assembly and connector for use therewith |
US5722239A (en) * | 1994-09-29 | 1998-03-03 | Stirling Thermal Motors, Inc. | Stirling engine |
JP2899543B2 (ja) * | 1995-06-08 | 1999-06-02 | 信越ポリマー株式会社 | 半導体パッケージ接続用ソケット |
US5611201A (en) * | 1995-09-29 | 1997-03-18 | Stirling Thermal Motors, Inc. | Stirling engine |
US5632650A (en) * | 1995-11-08 | 1997-05-27 | Minnesota Mining And Manufacturing Company | Connector break-off locator tab |
US5886671A (en) | 1995-12-21 | 1999-03-23 | The Boeing Company | Low-cost communication phased-array antenna |
US5777855A (en) * | 1996-06-18 | 1998-07-07 | Eastman Kodak Company | Method and apparatus for connecting flexible circuits to printed circuit boards |
US5813229A (en) * | 1996-10-02 | 1998-09-29 | Gaiser; Randall Robert | Pressure relief system for stirling engine |
US5917709A (en) * | 1997-06-16 | 1999-06-29 | Eastman Kodak Company | Multiple circuit board assembly having an interconnect mechanism that includes a flex connector |
US6020848A (en) * | 1998-01-27 | 2000-02-01 | The Boeing Company | Monolithic microwave integrated circuits for use in low-cost dual polarization phased-array antennas |
US6424313B1 (en) * | 2000-08-29 | 2002-07-23 | The Boeing Company | Three dimensional packaging architecture for phased array antenna elements |
US6469909B2 (en) * | 2001-01-09 | 2002-10-22 | 3M Innovative Properties Company | MEMS package with flexible circuit interconnect |
US6469671B1 (en) | 2001-07-13 | 2002-10-22 | Lockheed Martin Corporation | Low-temperature-difference TR module mounting, and antenna array using such mounting |
US7446261B2 (en) * | 2001-09-06 | 2008-11-04 | Finisar Corporation | Flexible circuit boards with tooling cutouts for optoelectronic modules |
US7093987B2 (en) * | 2001-09-20 | 2006-08-22 | Brezina Johnny R | Mounting a lens array in a fiber optic transceiver |
US6670930B2 (en) * | 2001-12-05 | 2003-12-30 | The Boeing Company | Antenna-integrated printed wiring board assembly for a phased array antenna system |
US6989791B2 (en) * | 2002-07-19 | 2006-01-24 | The Boeing Company | Antenna-integrated printed wiring board assembly for a phased array antenna system |
US6768471B2 (en) * | 2002-07-25 | 2004-07-27 | The Boeing Company | Comformal phased array antenna and method for repair |
BG107973A (en) | 2003-07-07 | 2005-01-31 | Raysat Cyprus Limited | Flat microwave antenna |
US6900765B2 (en) * | 2003-07-23 | 2005-05-31 | The Boeing Company | Method and apparatus for forming millimeter wave phased array antenna |
US7187342B2 (en) * | 2003-12-23 | 2007-03-06 | The Boeing Company | Antenna apparatus and method |
JP4060810B2 (ja) * | 2004-02-27 | 2008-03-12 | 富士通株式会社 | 記録ディスク駆動装置並びにフレキシブルプリント基板ユニットおよびフレキシブルプリント基板 |
US7342801B2 (en) | 2004-04-29 | 2008-03-11 | Harris Corporation | Printed wiring board with enhanced structural integrity |
US20060109366A1 (en) * | 2004-05-04 | 2006-05-25 | Tessera, Inc. | Compact lens turret assembly |
GB0426319D0 (en) | 2004-12-01 | 2005-01-05 | Finglas Technologies Ltd | Remote control of antenna line device |
JP2006253953A (ja) | 2005-03-09 | 2006-09-21 | Fujitsu Ltd | 通信用高周波モジュールおよびその製造方法 |
US7287987B2 (en) * | 2005-05-31 | 2007-10-30 | The Boeing Company | Electrical connector apparatus and method |
US7580003B1 (en) | 2006-11-07 | 2009-08-25 | The Boeing Company | Submarine qualified antenna aperture |
US7884768B2 (en) | 2006-11-08 | 2011-02-08 | The Boeing Company | Compact, dual-beam phased array antenna architecture |
US7629538B2 (en) | 2006-11-10 | 2009-12-08 | The Boeing Company | Stripline flex circuit |
US7515013B2 (en) * | 2006-12-07 | 2009-04-07 | The Boeing Company | Rectangular waveguide cavity launch |
US7388756B1 (en) * | 2006-12-12 | 2008-06-17 | The Boeing Company | Method and system for angled RF connection using a flexible substrate |
US7690107B2 (en) | 2007-06-15 | 2010-04-06 | The Boeing Company | Method for aligning and installing flexible circuit interconnects |
US7889135B2 (en) * | 2007-06-19 | 2011-02-15 | The Boeing Company | Phased array antenna architecture |
US7868830B2 (en) | 2008-05-13 | 2011-01-11 | The Boeing Company | Dual beam dual selectable polarization antenna |
-
2007
- 2007-06-15 US US11/763,879 patent/US7690107B2/en active Active
-
2008
- 2008-06-06 AT AT08075541T patent/ATE540563T1/de active
- 2008-06-06 EP EP08075541A patent/EP2003943B1/de active Active
-
2010
- 2010-02-10 US US12/703,477 patent/US8294032B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20080310125A1 (en) | 2008-12-18 |
US20110024161A1 (en) | 2011-02-03 |
EP2003943A2 (de) | 2008-12-17 |
US7690107B2 (en) | 2010-04-06 |
EP2003943A3 (de) | 2010-04-28 |
US8294032B2 (en) | 2012-10-23 |
EP2003943B1 (de) | 2012-01-04 |
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