ATE538900T1 - Verbesserter haltering für wafer-träger - Google Patents
Verbesserter haltering für wafer-trägerInfo
- Publication number
- ATE538900T1 ATE538900T1 AT04794543T AT04794543T ATE538900T1 AT E538900 T1 ATE538900 T1 AT E538900T1 AT 04794543 T AT04794543 T AT 04794543T AT 04794543 T AT04794543 T AT 04794543T AT E538900 T1 ATE538900 T1 AT E538900T1
- Authority
- AT
- Austria
- Prior art keywords
- bladder
- retaining ring
- groove
- ridge
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Packaging Frangible Articles (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/680,995 US6869348B1 (en) | 2003-10-07 | 2003-10-07 | Retaining ring for wafer carriers |
PCT/US2004/033225 WO2005036605A2 (en) | 2003-10-07 | 2004-10-06 | Improved retaining ring for wafer carriers |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE538900T1 true ATE538900T1 (de) | 2012-01-15 |
Family
ID=34274793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04794543T ATE538900T1 (de) | 2003-10-07 | 2004-10-06 | Verbesserter haltering für wafer-träger |
Country Status (5)
Country | Link |
---|---|
US (2) | US6869348B1 (de) |
EP (1) | EP1678745B1 (de) |
AT (1) | ATE538900T1 (de) |
TW (1) | TWI289899B (de) |
WO (1) | WO2005036605A2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6869348B1 (en) * | 2003-10-07 | 2005-03-22 | Strasbaugh | Retaining ring for wafer carriers |
US7033252B2 (en) * | 2004-03-05 | 2006-04-25 | Strasbaugh | Wafer carrier with pressurized membrane and retaining ring actuator |
US20070010180A1 (en) * | 2005-07-06 | 2007-01-11 | Agere Systems, Inc. | Carrier employing snap-fitted membrane retainer |
US7520796B2 (en) * | 2007-01-31 | 2009-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to reduce slurry consumption |
US7520798B2 (en) * | 2007-01-31 | 2009-04-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with grooves to reduce slurry consumption |
US9272387B2 (en) | 2011-04-13 | 2016-03-01 | Applied Materials, Inc. | Carrier head with shims |
US20140174655A1 (en) * | 2012-12-21 | 2014-06-26 | HGST Netherlands B.V. | Polishing tool with diaphram for uniform polishing of a wafer |
US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
US9744640B2 (en) * | 2015-10-16 | 2017-08-29 | Applied Materials, Inc. | Corrosion resistant retaining rings |
US10651015B2 (en) | 2016-02-12 | 2020-05-12 | Lam Research Corporation | Variable depth edge ring for etch uniformity control |
US10438833B2 (en) * | 2016-02-16 | 2019-10-08 | Lam Research Corporation | Wafer lift ring system for wafer transfer |
US20230166382A1 (en) * | 2021-11-30 | 2023-06-01 | Texas Instruments Incorporated | Cmp polisher head over-rotation restrictor |
CN116175305B (zh) * | 2023-04-26 | 2023-07-04 | 北京特思迪半导体设备有限公司 | 用于加工扁平工件的压盘结构、设备及其姿态控制方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5310455A (en) * | 1992-07-10 | 1994-05-10 | Lsi Logic Corporation | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers |
JP3158934B2 (ja) * | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5795215A (en) * | 1995-06-09 | 1998-08-18 | Applied Materials, Inc. | Method and apparatus for using a retaining ring to control the edge effect |
JP2917992B1 (ja) * | 1998-04-10 | 1999-07-12 | 日本電気株式会社 | 研磨装置 |
US6206758B1 (en) * | 1998-04-21 | 2001-03-27 | United Microelectronics Corp. | Method for increasing working life of retaining ring in chemical-mechanical polishing machine |
US6390904B1 (en) * | 1998-05-21 | 2002-05-21 | Applied Materials, Inc. | Retainers and non-abrasive liners used in chemical mechanical polishing |
US6136710A (en) * | 1998-10-19 | 2000-10-24 | Chartered Semiconductor Manufacturing, Ltd. | Chemical mechanical polishing apparatus with improved substrate carrier head and method of use |
US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6206768B1 (en) * | 1999-07-29 | 2001-03-27 | Chartered Semiconductor Manufacturing, Ltd. | Adjustable and extended guide rings |
US6722963B1 (en) * | 1999-08-03 | 2004-04-20 | Micron Technology, Inc. | Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane |
SG90746A1 (en) * | 1999-10-15 | 2002-08-20 | Ebara Corp | Apparatus and method for polishing workpiece |
US6354927B1 (en) * | 2000-05-23 | 2002-03-12 | Speedfam-Ipec Corporation | Micro-adjustable wafer retaining apparatus |
US6540592B1 (en) * | 2000-06-29 | 2003-04-01 | Speedfam-Ipec Corporation | Carrier head with reduced moment wear ring |
US6579151B2 (en) * | 2001-08-02 | 2003-06-17 | Taiwan Semiconductor Manufacturing Co., Ltd | Retaining ring with active edge-profile control by piezoelectric actuator/sensors |
US6592437B1 (en) * | 2001-12-26 | 2003-07-15 | Lam Research Corporation | Active gimbal ring with internal gel and methods for making same |
US6869348B1 (en) * | 2003-10-07 | 2005-03-22 | Strasbaugh | Retaining ring for wafer carriers |
-
2003
- 2003-10-07 US US10/680,995 patent/US6869348B1/en not_active Expired - Lifetime
-
2004
- 2004-10-06 AT AT04794543T patent/ATE538900T1/de active
- 2004-10-06 EP EP04794543A patent/EP1678745B1/de not_active Not-in-force
- 2004-10-06 WO PCT/US2004/033225 patent/WO2005036605A2/en active Application Filing
- 2004-10-07 TW TW093130488A patent/TWI289899B/zh not_active IP Right Cessation
-
2005
- 2005-03-18 US US11/084,475 patent/US7063605B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2005036605A3 (en) | 2009-04-02 |
EP1678745A4 (de) | 2009-11-04 |
TW200520137A (en) | 2005-06-16 |
WO2005036605A2 (en) | 2005-04-21 |
EP1678745A2 (de) | 2006-07-12 |
US7063605B2 (en) | 2006-06-20 |
US20050164617A1 (en) | 2005-07-28 |
TWI289899B (en) | 2007-11-11 |
EP1678745B1 (de) | 2011-12-28 |
US6869348B1 (en) | 2005-03-22 |
US20050075062A1 (en) | 2005-04-07 |
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