ATE533341T1 - Verfahrensinterne ausrichtung von partikeln in einer direktschreibtinte zur steuerung der elektrischen merkmale einer elektrischen komponente, die gerade hergestellt wird - Google Patents

Verfahrensinterne ausrichtung von partikeln in einer direktschreibtinte zur steuerung der elektrischen merkmale einer elektrischen komponente, die gerade hergestellt wird

Info

Publication number
ATE533341T1
ATE533341T1 AT10171801T AT10171801T ATE533341T1 AT E533341 T1 ATE533341 T1 AT E533341T1 AT 10171801 T AT10171801 T AT 10171801T AT 10171801 T AT10171801 T AT 10171801T AT E533341 T1 ATE533341 T1 AT E533341T1
Authority
AT
Austria
Prior art keywords
particles
production
control
direct
direct writing
Prior art date
Application number
AT10171801T
Other languages
English (en)
Inventor
Jonathan B Vance
Scott Johnston
Original Assignee
Boeing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boeing Co filed Critical Boeing Co
Application granted granted Critical
Publication of ATE533341T1 publication Critical patent/ATE533341T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/025—Discharge apparatus, e.g. electrostatic spray guns
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/026—Nanotubes or nanowires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Electrostatic Spraying Apparatus (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT10171801T 2009-08-04 2010-08-03 Verfahrensinterne ausrichtung von partikeln in einer direktschreibtinte zur steuerung der elektrischen merkmale einer elektrischen komponente, die gerade hergestellt wird ATE533341T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/534,886 US8529987B2 (en) 2009-08-04 2009-08-04 In-process orientation of particles in a direct-write ink to control electrical characteristics of an electrical component being fabricated

Publications (1)

Publication Number Publication Date
ATE533341T1 true ATE533341T1 (de) 2011-11-15

Family

ID=42937162

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10171801T ATE533341T1 (de) 2009-08-04 2010-08-03 Verfahrensinterne ausrichtung von partikeln in einer direktschreibtinte zur steuerung der elektrischen merkmale einer elektrischen komponente, die gerade hergestellt wird

Country Status (4)

Country Link
US (2) US8529987B2 (de)
EP (1) EP2282621B1 (de)
KR (1) KR101758370B1 (de)
AT (1) ATE533341T1 (de)

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US8610377B2 (en) * 2008-04-14 2013-12-17 Digital Lumens, Incorporated Methods, apparatus, and systems for prediction of lighting module performance
US8339069B2 (en) 2008-04-14 2012-12-25 Digital Lumens Incorporated Power management unit with power metering
US8754589B2 (en) * 2008-04-14 2014-06-17 Digtial Lumens Incorporated Power management unit with temperature protection
US8373362B2 (en) * 2008-04-14 2013-02-12 Digital Lumens Incorporated Methods, systems, and apparatus for commissioning an LED lighting fixture with remote reporting
US8841859B2 (en) * 2008-04-14 2014-09-23 Digital Lumens Incorporated LED lighting methods, apparatus, and systems including rules-based sensor data logging
US8368321B2 (en) * 2008-04-14 2013-02-05 Digital Lumens Incorporated Power management unit with rules-based power consumption management
US8805550B2 (en) 2008-04-14 2014-08-12 Digital Lumens Incorporated Power management unit with power source arbitration
WO2009129232A1 (en) * 2008-04-14 2009-10-22 Digital Lumens Incorporated Modular lighting systems
US8866408B2 (en) 2008-04-14 2014-10-21 Digital Lumens Incorporated Methods, apparatus, and systems for automatic power adjustment based on energy demand information
US8543249B2 (en) * 2008-04-14 2013-09-24 Digital Lumens Incorporated Power management unit with modular sensor bus
US8610376B2 (en) * 2008-04-14 2013-12-17 Digital Lumens Incorporated LED lighting methods, apparatus, and systems including historic sensor data logging
US8552664B2 (en) * 2008-04-14 2013-10-08 Digital Lumens Incorporated Power management unit with ballast interface
US8823277B2 (en) 2008-04-14 2014-09-02 Digital Lumens Incorporated Methods, systems, and apparatus for mapping a network of lighting fixtures with light module identification
US10539311B2 (en) 2008-04-14 2020-01-21 Digital Lumens Incorporated Sensor-based lighting methods, apparatus, and systems
US8531134B2 (en) * 2008-04-14 2013-09-10 Digital Lumens Incorporated LED-based lighting methods, apparatus, and systems employing LED light bars, occupancy sensing, local state machine, and time-based tracking of operational modes
US8954170B2 (en) * 2009-04-14 2015-02-10 Digital Lumens Incorporated Power management unit with multi-input arbitration
US8536802B2 (en) * 2009-04-14 2013-09-17 Digital Lumens Incorporated LED-based lighting methods, apparatus, and systems employing LED light bars, occupancy sensing, and local state machine
US8593135B2 (en) 2009-04-14 2013-11-26 Digital Lumens Incorporated Low-cost power measurement circuit
US8529987B2 (en) 2009-08-04 2013-09-10 The Boeing Company In-process orientation of particles in a direct-write ink to control electrical characteristics of an electrical component being fabricated
JP5857344B2 (ja) * 2010-07-27 2016-02-10 株式会社ユーテック プラズマポーリング装置及び圧電体の製造方法
CA3084936A1 (en) 2010-11-04 2012-05-10 Digital Lumens Incorporated Method, apparatus, and system for occupancy sensing
WO2012129243A1 (en) 2011-03-21 2012-09-27 Digital Lumens Incorporated Methods, apparatus and systems for providing occupancy-based variable lighting
US10118712B2 (en) * 2011-08-17 2018-11-06 The Boeing Company Electrical conductor pathway system and method of making the same
EP2774459B1 (de) 2011-11-03 2021-01-06 Digital Lumens Incorporated Verfahren, systeme und vorrichtung für intelligente beleuchtung
WO2013142292A1 (en) 2012-03-19 2013-09-26 Digital Lumens Incorporated Methods, systems, and apparatus for providing variable illumination
US8658256B2 (en) 2012-06-20 2014-02-25 The Boeing Company Methods of coating substrates with electrically charged conductive materials, electrically conductive coated substrates, and associated apparatuses
EP2992395B1 (de) 2013-04-30 2018-03-07 Digital Lumens Incorporated Betrieb von leuchtdioden bei niedriger temperatur
CN103464319B (zh) * 2013-09-05 2016-06-08 顾文华 二段电场结构静电喷射系统及阵列与使用方法
AU2014331746A1 (en) 2013-10-10 2016-05-05 Digital Lumens Incorporated Methods, systems, and apparatus for intelligent lighting
US10752794B2 (en) 2016-11-18 2020-08-25 Saint Louis University Mask free methods of depositing compositions to form heterostructures
KR102592426B1 (ko) * 2019-01-02 2023-10-23 삼성디스플레이 주식회사 잉크젯 프린팅 장치, 쌍극자 정렬 방법 및 표시 장치의 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1581171A (en) * 1976-04-08 1980-12-10 Bison North America Inc Alignment plate construction for electrostatic particle orientation
JP4597675B2 (ja) 2002-08-24 2010-12-15 マスクレス・リソグラフィー・インコーポレーテッド 連続直接書込み光リソグラフィ
US20040151978A1 (en) * 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
RU2005136875A (ru) * 2003-04-28 2006-04-10 Конинклейке Филипс Электроникс Н.В. (Nl) Способ изготовления автоэмиссионного электрода
US7326380B2 (en) 2003-07-18 2008-02-05 Northwestern University Surface and site-specific polymerization by direct-write lithography
JP2005262108A (ja) * 2004-03-19 2005-09-29 Fuji Photo Film Co Ltd 成膜装置及び圧電材料の製造方法
US7444934B2 (en) * 2005-05-24 2008-11-04 Micron Technology, Inc. Supercritical fluid-assisted direct write for printing integrated circuits
US8529987B2 (en) 2009-08-04 2013-09-10 The Boeing Company In-process orientation of particles in a direct-write ink to control electrical characteristics of an electrical component being fabricated

Also Published As

Publication number Publication date
KR101758370B1 (ko) 2017-07-14
EP2282621A1 (de) 2011-02-09
US20130319327A1 (en) 2013-12-05
US20110033632A1 (en) 2011-02-10
US8529987B2 (en) 2013-09-10
EP2282621B1 (de) 2011-11-09
KR20110014106A (ko) 2011-02-10
US8800479B2 (en) 2014-08-12

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