ATE531245T1 - Hardwaremodul und rückwandplatine für usbv - Google Patents
Hardwaremodul und rückwandplatine für usbvInfo
- Publication number
- ATE531245T1 ATE531245T1 AT09158551T AT09158551T ATE531245T1 AT E531245 T1 ATE531245 T1 AT E531245T1 AT 09158551 T AT09158551 T AT 09158551T AT 09158551 T AT09158551 T AT 09158551T AT E531245 T1 ATE531245 T1 AT E531245T1
- Authority
- AT
- Austria
- Prior art keywords
- ied
- slot
- backplane
- module
- rear side
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1439—Back panel mother boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1457—Power distribution arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1462—Mounting supporting structure in casing or on frame or rack for programmable logic controllers [PLC] for automation or industrial process control
- H05K7/1475—Bus assemblies for establishing communication between PLC modules
- H05K7/1477—Bus assemblies for establishing communication between PLC modules including backplanes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Power Engineering (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Structure Of Telephone Exchanges (AREA)
- Structure Of Printed Boards (AREA)
- Dc Digital Transmission (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09158551A EP2244544B1 (de) | 2009-04-23 | 2009-04-23 | Hardwaremodul und Rückwandplatine für USBV |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE531245T1 true ATE531245T1 (de) | 2011-11-15 |
Family
ID=41061107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT09158551T ATE531245T1 (de) | 2009-04-23 | 2009-04-23 | Hardwaremodul und rückwandplatine für usbv |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100271794A1 (de) |
| EP (1) | EP2244544B1 (de) |
| CN (1) | CN101873003B (de) |
| AT (1) | ATE531245T1 (de) |
| ES (1) | ES2375818T3 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8816155B2 (en) | 2008-01-25 | 2014-08-26 | Nunhems B.V. | Onions of variety i37853B, i37554A, i37554B, and progeny thereof with high storage ability, high soluble solids content and/or low pungency |
| SG192299A1 (en) * | 2012-01-12 | 2013-08-30 | Rockwell Automation Asia Pacific Business Ctr Pte Ltd | System and method for coupling an automation controller and scaleable module |
| US9451719B2 (en) * | 2013-08-29 | 2016-09-20 | Abb Technology Ag | U form-factor intelligent electronic device (IED) hardware platform with matching of IED wiring, from a non U form-factor IED hardware platform using adapter structure |
| KR101527674B1 (ko) * | 2014-01-07 | 2015-06-09 | 주식회사 포뉴텍 | 백플레인, 이를 이용한 제어 시스템 및 방법 |
| CN107608469B (zh) * | 2017-09-19 | 2023-09-12 | 中核控制系统工程有限公司 | 一种lvds高速通信背板 |
| EP3641514A1 (de) * | 2018-10-15 | 2020-04-22 | ABB Schweiz AG | Modulare ied |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4845592A (en) * | 1987-08-31 | 1989-07-04 | Amp Incorporated | Flexible bussing system for distributing power to printed circuit boards, backplanes or the like |
| US5038317A (en) * | 1988-07-25 | 1991-08-06 | Allen-Bradley Company, Inc. | Programmable controller module rack with a relative rack slot addressing mechanism |
| JPH0878869A (ja) * | 1994-09-06 | 1996-03-22 | Fujitsu Ltd | 電子装置の装着支援装置 |
| WO2000074454A1 (fr) * | 1999-05-31 | 2000-12-07 | Fujitsu Limited | Dispositif de communication et unite enfichable |
| US6650844B1 (en) * | 2000-02-28 | 2003-11-18 | Lucent Technologies Inc. | Interconnecting circuit boards using free space optics |
| US7463626B2 (en) * | 2000-11-21 | 2008-12-09 | Roy Subhash C | Phase and frequency drift and jitter compensation in a distributed telecommunications switch |
| US7382790B2 (en) * | 2002-07-02 | 2008-06-03 | Emulex Design & Manufacturing Corporation | Methods and apparatus for switching fibre channel arbitrated loop systems |
| DE102005033004A1 (de) * | 2005-07-14 | 2007-01-25 | Fujitsu Siemens Computers Gmbh | Steckerplatine zum Einsatz in einem Einschubrahmen für Peripheriegeräte |
| US8165111B2 (en) * | 2006-07-25 | 2012-04-24 | PSIMAST, Inc | Telecommunication and computing platforms with serial packet switched integrated memory access technology |
| US7848115B2 (en) * | 2006-10-26 | 2010-12-07 | Ici Networks, Llc | Systems for electrically connecting circuit board based electronic devices |
| EP1983812B1 (de) * | 2007-04-16 | 2013-11-20 | Abb Research Ltd. | Intelligente elektronische Vorrichtung für eine Substation oder Verteilungsautomatisierungssysteme |
| US8190699B2 (en) * | 2008-07-28 | 2012-05-29 | Crossfield Technology LLC | System and method of multi-path data communications |
-
2009
- 2009-04-23 AT AT09158551T patent/ATE531245T1/de not_active IP Right Cessation
- 2009-04-23 EP EP09158551A patent/EP2244544B1/de not_active Not-in-force
- 2009-04-23 ES ES09158551T patent/ES2375818T3/es active Active
-
2010
- 2010-04-22 US US12/765,166 patent/US20100271794A1/en not_active Abandoned
- 2010-04-23 CN CN201010199773.9A patent/CN101873003B/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2244544A1 (de) | 2010-10-27 |
| CN101873003B (zh) | 2013-03-27 |
| EP2244544B1 (de) | 2011-10-26 |
| ES2375818T3 (es) | 2012-03-06 |
| CN101873003A (zh) | 2010-10-27 |
| US20100271794A1 (en) | 2010-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |