ATE527478T1 - Metalllippendichtung und mit einer solchen dichtung ausgestattete maschine - Google Patents

Metalllippendichtung und mit einer solchen dichtung ausgestattete maschine

Info

Publication number
ATE527478T1
ATE527478T1 AT10305267T AT10305267T ATE527478T1 AT E527478 T1 ATE527478 T1 AT E527478T1 AT 10305267 T AT10305267 T AT 10305267T AT 10305267 T AT10305267 T AT 10305267T AT E527478 T1 ATE527478 T1 AT E527478T1
Authority
AT
Austria
Prior art keywords
elastic body
elements
leg
cavity
free end
Prior art date
Application number
AT10305267T
Other languages
English (en)
Inventor
Francois Marion
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE527478T1 publication Critical patent/ATE527478T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/08—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing
    • F16J15/0887—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with exclusively metal packing the sealing effect being obtained by elastic deformation of the packing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gasket Seals (AREA)
  • Sealing With Elastic Sealing Lips (AREA)
AT10305267T 2009-03-30 2010-03-18 Metalllippendichtung und mit einer solchen dichtung ausgestattete maschine ATE527478T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0951955A FR2943751B1 (fr) 2009-03-30 2009-03-30 Joint metallique a levre et machine equipee d'un tel joint

Publications (1)

Publication Number Publication Date
ATE527478T1 true ATE527478T1 (de) 2011-10-15

Family

ID=41413341

Family Applications (1)

Application Number Title Priority Date Filing Date
AT10305267T ATE527478T1 (de) 2009-03-30 2010-03-18 Metalllippendichtung und mit einer solchen dichtung ausgestattete maschine

Country Status (5)

Country Link
US (1) US8272556B2 (de)
EP (1) EP2236864B1 (de)
JP (1) JP5529601B2 (de)
AT (1) ATE527478T1 (de)
FR (1) FR2943751B1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9227261B2 (en) * 2013-08-06 2016-01-05 Globalfoundries Inc. Vacuum carriers for substrate bonding
US10718375B2 (en) 2016-05-16 2020-07-21 Roller Bearing Company Of America, Inc. Bearing system with self-lubrication features, seals, grooves and slots for maintenance-free operation
US11473626B2 (en) 2016-05-16 2022-10-18 Roller Bearing Company Of America, Inc. Bearing system with self-lubrication features, seals, grooves and slots for maintenance-free operation
CN105952891A (zh) * 2016-06-27 2016-09-21 上海默作精密仪器有限公司 弹性金属密封圈
US11377934B1 (en) * 2021-04-08 2022-07-05 Halliburton Energy Services, Inc. Downhole tool with compliant metal-to-metal seal

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2666723A (en) * 1951-12-19 1954-01-19 Associated Spring Corp Method of manufacturing helical coil compression springs
US3873166A (en) * 1973-04-18 1975-03-25 Caterpillar Tractor Co Sealed self-adjusting bearing
JPS5644957Y2 (de) * 1976-06-10 1981-10-21
EP0067403B1 (de) * 1981-06-13 1985-05-08 Klinger AG Hahn mit Kugelküken
FR2562630B1 (fr) * 1984-04-05 1988-11-25 Commissariat Energie Atomique Joint metallique flexible
JPH02125194A (ja) * 1988-11-02 1990-05-14 Toshiba Corp 接合部の漏洩防止装置
JPH04129966U (ja) * 1991-05-21 1992-11-30 日本バルカー工業株式会社 メタルリング
JP3413457B2 (ja) * 1994-08-05 2003-06-03 内山工業株式会社 ワッシャーシールの取付構造
DE19649458A1 (de) * 1996-03-14 1998-10-22 Tech Gmbh Antriebstechnik Und Lotmaterial zur Anbringung von großen Halbleiterchips
FR2746214B1 (fr) 1996-03-15 1998-04-24 Procede et machine d'hybridation par refusion
US6454015B1 (en) * 1999-07-15 2002-09-24 Abb Vetco Gray Inc. Shearing gate valve
US7478816B2 (en) * 2004-05-10 2009-01-20 Fisher Controls International, Llc Seal stiffener
JP2009038296A (ja) * 2007-08-03 2009-02-19 Nissan Motor Co Ltd カバー開閉検知装置

Also Published As

Publication number Publication date
US8272556B2 (en) 2012-09-25
JP5529601B2 (ja) 2014-06-25
EP2236864A1 (de) 2010-10-06
US20100243713A1 (en) 2010-09-30
FR2943751B1 (fr) 2012-03-09
EP2236864B1 (de) 2011-10-05
FR2943751A1 (fr) 2010-10-01
JP2010236694A (ja) 2010-10-21

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties