ATE524833T1 - Isolierende sperrschicht - Google Patents

Isolierende sperrschicht

Info

Publication number
ATE524833T1
ATE524833T1 AT05108290T AT05108290T ATE524833T1 AT E524833 T1 ATE524833 T1 AT E524833T1 AT 05108290 T AT05108290 T AT 05108290T AT 05108290 T AT05108290 T AT 05108290T AT E524833 T1 ATE524833 T1 AT E524833T1
Authority
AT
Austria
Prior art keywords
region
dielectric
insulating barrier
barrier layer
contacting
Prior art date
Application number
AT05108290T
Other languages
English (en)
Inventor
Pieter Blomme
Bogdan Govoreanu
Maarten Rosmeulen
Original Assignee
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec filed Critical Imec
Application granted granted Critical
Publication of ATE524833T1 publication Critical patent/ATE524833T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/51—Insulating materials associated therewith
    • H01L29/511—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures
    • H01L29/513—Insulating materials associated therewith with a compositional variation, e.g. multilayer structures the variation being perpendicular to the channel plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158—Making the insulator
    • H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/401—Multistep manufacturing processes
    • H01L29/4011—Multistep manufacturing processes for data storage electrodes
    • H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/51—Insulating materials associated therewith
    • H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/51—Insulating materials associated therewith
    • H01L29/518—Insulating materials associated therewith the insulating material containing nitrogen, e.g. nitride, oxynitride, nitrogen-doped material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H01L29/7883—Programmable transistors with only two possible levels of programmation charging by tunnelling of carriers, e.g. Fowler-Nordheim tunnelling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
    • H01L29/7881—Programmable transistors with only two possible levels of programmation
    • H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
    • H01L29/7885—Hot carrier injection from the channel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158—Making the insulator
    • H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • H01L21/28202—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation in a nitrogen-containing ambient, e.g. nitride deposition, growth, oxynitridation, NH3 nitridation, N2O oxidation, thermal nitridation, RTN, plasma nitridation, RPN

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
AT05108290T 2001-04-27 2001-10-19 Isolierende sperrschicht ATE524833T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US28719201P 2001-04-27 2001-04-27

Publications (1)

Publication Number Publication Date
ATE524833T1 true ATE524833T1 (de) 2011-09-15

Family

ID=23101841

Family Applications (2)

Application Number Title Priority Date Filing Date
AT05108290T ATE524833T1 (de) 2001-04-27 2001-10-19 Isolierende sperrschicht
AT01204106T ATE524832T1 (de) 2001-04-27 2001-10-19 Isolierende sperrschicht für nichtflüchtige speicheranordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
AT01204106T ATE524832T1 (de) 2001-04-27 2001-10-19 Isolierende sperrschicht für nichtflüchtige speicheranordnung

Country Status (3)

Country Link
US (2) US6784484B2 (de)
EP (2) EP1253646B1 (de)
AT (2) ATE524833T1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7332768B2 (en) * 2001-04-27 2008-02-19 Interuniversitair Microelektronica Centrum (Imec) Non-volatile memory devices
US6563185B2 (en) * 2001-05-21 2003-05-13 The Regents Of The University Of Colorado High speed electron tunneling device and applications
DE10158019C2 (de) * 2001-11-27 2003-09-18 Infineon Technologies Ag Floatinggate-Feldeffekttransistor
US6645882B1 (en) 2002-01-17 2003-11-11 Advanced Micro Devices, Inc. Preparation of composite high-K/standard-K dielectrics for semiconductor devices
US6586349B1 (en) 2002-02-21 2003-07-01 Advanced Micro Devices, Inc. Integrated process for fabrication of graded composite dielectric material layers for semiconductor devices
US6642573B1 (en) 2002-03-13 2003-11-04 Advanced Micro Devices, Inc. Use of high-K dielectric material in modified ONO structure for semiconductor devices
US6617639B1 (en) * 2002-06-21 2003-09-09 Advanced Micro Devices, Inc. Use of high-K dielectric material for ONO and tunnel oxide to improve floating gate flash memory coupling
US7154779B2 (en) * 2004-01-21 2006-12-26 Sandisk Corporation Non-volatile memory cell using high-k material inter-gate programming
US8264028B2 (en) * 2005-01-03 2012-09-11 Macronix International Co., Ltd. Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays
US7612403B2 (en) 2005-05-17 2009-11-03 Micron Technology, Inc. Low power non-volatile memory and gate stack
US7402850B2 (en) * 2005-06-21 2008-07-22 Micron Technology, Inc. Back-side trapped non-volatile memory device
US7829938B2 (en) * 2005-07-14 2010-11-09 Micron Technology, Inc. High density NAND non-volatile memory device
EP1903602A3 (de) 2005-07-28 2009-04-01 Interuniversitair Microelektronica Centrum Vzw Nichtflüchtiger Speichertransistor
EP1748473A3 (de) * 2005-07-28 2009-04-01 INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM vzw (IMEC) Nichtflüchtiger Speichertransistor mit verteilten Ladungsspeicherstellen
EP1748472A1 (de) 2005-07-28 2007-01-31 Interuniversitair Microelektronica Centrum Vzw Nichtflüchtiger Speichertransistor
US7629641B2 (en) * 2005-08-31 2009-12-08 Micron Technology, Inc. Band engineered nano-crystal non-volatile memory device utilizing enhanced gate injection
US20070059945A1 (en) * 2005-09-12 2007-03-15 Nima Mohklesi Atomic layer deposition with nitridation and oxidation
EP1969619A1 (de) 2005-10-20 2008-09-17 INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM vzw (IMEC) Verfahren zum herstellen einer dielektrischen schicht mit hohem k
DE102005053718B8 (de) * 2005-11-10 2014-04-30 Infineon Technologies Ag Floating-Gate-Speicherzelle und Verfahren zum Herstellen einer Floating-Gate-Speicherzelle
JP4907999B2 (ja) * 2006-01-20 2012-04-04 株式会社東芝 半導体装置の製造方法
US20100024732A1 (en) * 2006-06-02 2010-02-04 Nima Mokhlesi Systems for Flash Heating in Atomic Layer Deposition
US20070277735A1 (en) * 2006-06-02 2007-12-06 Nima Mokhlesi Systems for Atomic Layer Deposition of Oxides Using Krypton as an Ion Generating Feeding Gas
US20070281105A1 (en) * 2006-06-02 2007-12-06 Nima Mokhlesi Atomic Layer Deposition of Oxides Using Krypton as an Ion Generating Feeding Gas
US20070281082A1 (en) * 2006-06-02 2007-12-06 Nima Mokhlesi Flash Heating in Atomic Layer Deposition
KR100762390B1 (ko) 2006-08-08 2007-10-02 세종대학교산학협력단 다층 절연박막
JP4997872B2 (ja) * 2006-08-22 2012-08-08 ソニー株式会社 不揮発性半導体メモリデバイスおよびその製造方法
EP2081232B1 (de) 2007-12-27 2013-07-17 Imec Interpoly-Dielektrikumstapel mit verbesserter Immunität
KR101435588B1 (ko) * 2008-06-23 2014-09-25 삼성전자주식회사 불휘발성 메모리 소자 및 그 제조방법
EP2284870B1 (de) 2009-08-12 2012-02-22 Imec Verfahren zur Herstellung einer nichtflüchtigen Floating-Gate-Speicherzelle
JP5547217B2 (ja) 2012-01-25 2014-07-09 株式会社東芝 増幅回路

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4015281A (en) * 1970-03-30 1977-03-29 Hitachi, Ltd. MIS-FETs isolated on common substrate
US3731163A (en) * 1972-03-22 1973-05-01 United Aircraft Corp Low voltage charge storage memory element
US5583810A (en) 1991-01-31 1996-12-10 Interuniversitair Micro-Elektronica Centrum Vzw Method for programming a semiconductor memory device
JPH05121764A (ja) * 1991-10-30 1993-05-18 Rohm Co Ltd 半導体記憶装置
JP3600326B2 (ja) * 1994-09-29 2004-12-15 旺宏電子股▲ふん▼有限公司 不揮発性半導体メモリ装置およびその製造方法
US6121654A (en) * 1997-10-10 2000-09-19 The Research Foundation Of State University Of New York Memory device having a crested tunnel barrier

Also Published As

Publication number Publication date
EP1253646A1 (de) 2002-10-30
US7026686B2 (en) 2006-04-11
EP1605517B1 (de) 2011-09-14
US20050017288A1 (en) 2005-01-27
EP1253646B1 (de) 2011-09-14
EP1605517A3 (de) 2006-04-26
EP1605517A8 (de) 2006-07-05
US6784484B2 (en) 2004-08-31
ATE524832T1 (de) 2011-09-15
EP1605517A2 (de) 2005-12-14
EP1605517A9 (de) 2006-10-18
US20020190311A1 (en) 2002-12-19

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