ATE511938T1 - Drahtverbindungs-kapillarwerkzeug mit mehreren äusseren absätzen - Google Patents
Drahtverbindungs-kapillarwerkzeug mit mehreren äusseren absätzenInfo
- Publication number
- ATE511938T1 ATE511938T1 AT07794234T AT07794234T ATE511938T1 AT E511938 T1 ATE511938 T1 AT E511938T1 AT 07794234 T AT07794234 T AT 07794234T AT 07794234 T AT07794234 T AT 07794234T AT E511938 T1 ATE511938 T1 AT E511938T1
- Authority
- AT
- Austria
- Prior art keywords
- cylindrical portion
- wire connection
- multiple outer
- capillary tool
- tip
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/SG2007/000220 WO2009014494A1 (en) | 2007-07-24 | 2007-07-24 | Wire bonding capillary tool having multiple outer steps |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE511938T1 true ATE511938T1 (de) | 2011-06-15 |
Family
ID=39268002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT07794234T ATE511938T1 (de) | 2007-07-24 | 2007-07-24 | Drahtverbindungs-kapillarwerkzeug mit mehreren äusseren absätzen |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2167269B1 (de) |
KR (1) | KR101221928B1 (de) |
CN (1) | CN101730605A (de) |
AT (1) | ATE511938T1 (de) |
WO (1) | WO2009014494A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101295948B1 (ko) * | 2011-11-30 | 2013-08-13 | 김선희 | 초음파 용착기의 공구혼 |
TWI511826B (zh) * | 2013-01-25 | 2015-12-11 | Toto Ltd | Welding needle |
CN103909185B (zh) * | 2014-03-28 | 2015-06-10 | 木林森股份有限公司 | 一种铜线焊接设备及焊接铜线的工艺 |
WO2017132027A1 (en) * | 2016-01-26 | 2017-08-03 | Orthodyne Electronics Corporation | Wedge bonding tools, wedge bonding systems, and related methods |
CN109860067B (zh) * | 2019-02-03 | 2020-12-08 | 潮州三环(集团)股份有限公司 | 一种焊接陶瓷劈刀 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2727970B2 (ja) * | 1993-10-07 | 1998-03-18 | 日本電気株式会社 | ボンディングツール |
GB2285943B (en) * | 1994-01-28 | 1996-09-11 | Hewlett Packard Co | Bonding tool for electronic device |
JP3086158B2 (ja) * | 1995-07-26 | 2000-09-11 | 株式会社日立製作所 | 超音波ボンディング方法 |
US6497356B2 (en) * | 2000-04-28 | 2002-12-24 | Kulicke & Soffa Investments, Inc. | Controlled attenuation capillary with planar surface |
KR20030066348A (ko) * | 2002-02-01 | 2003-08-09 | 에섹 트레이딩 에스에이 | 와이어본더의 보정을 위한 방법 |
JP2004221257A (ja) * | 2003-01-14 | 2004-08-05 | Seiko Epson Corp | ワイヤボンディング方法及びワイヤボンディング装置 |
US7320425B2 (en) | 2004-05-12 | 2008-01-22 | Kulicke And Soffa Industries, Inc. | Low-profile capillary for wire bonding |
US20050275073A1 (en) * | 2004-06-09 | 2005-12-15 | Texas Instruments Incorporated | Method and system for improved wire bonding |
-
2007
- 2007-07-24 EP EP07794234A patent/EP2167269B1/de active Active
- 2007-07-24 WO PCT/SG2007/000220 patent/WO2009014494A1/en active Application Filing
- 2007-07-24 KR KR1020097025935A patent/KR101221928B1/ko active IP Right Grant
- 2007-07-24 CN CN200780053680A patent/CN101730605A/zh active Pending
- 2007-07-24 AT AT07794234T patent/ATE511938T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2167269A1 (de) | 2010-03-31 |
CN101730605A (zh) | 2010-06-09 |
KR101221928B1 (ko) | 2013-01-14 |
WO2009014494A1 (en) | 2009-01-29 |
EP2167269B1 (de) | 2011-06-08 |
KR20100044733A (ko) | 2010-04-30 |
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