ATE500001T1 - Mikroreplizierter gegenstand und herstellungsverfahren dafür - Google Patents
Mikroreplizierter gegenstand und herstellungsverfahren dafürInfo
- Publication number
- ATE500001T1 ATE500001T1 AT06737183T AT06737183T ATE500001T1 AT E500001 T1 ATE500001 T1 AT E500001T1 AT 06737183 T AT06737183 T AT 06737183T AT 06737183 T AT06737183 T AT 06737183T AT E500001 T1 ATE500001 T1 AT E500001T1
- Authority
- AT
- Austria
- Prior art keywords
- article
- micrreplicated
- production
- microreplicated
- features
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
- B29C35/0894—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds provided with masks or diaphragms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/10—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation for articles of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/14—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
- B29C59/046—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts for layered or coated substantially flat surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/44—Compression means for making articles of indefinite length
- B29C43/46—Rollers
- B29C2043/461—Rollers the rollers having specific surface features
- B29C2043/463—Rollers the rollers having specific surface features corrugated, patterned or embossed surface
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Coating Apparatus (AREA)
- Absorbent Articles And Supports Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66143105P | 2005-03-09 | 2005-03-09 | |
PCT/US2006/007975 WO2006098938A1 (en) | 2005-03-09 | 2006-03-06 | Microreplicated article and method for the production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE500001T1 true ATE500001T1 (de) | 2011-03-15 |
Family
ID=36571982
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06737183T ATE500001T1 (de) | 2005-03-09 | 2006-03-06 | Mikroreplizierter gegenstand und herstellungsverfahren dafür |
Country Status (10)
Country | Link |
---|---|
US (1) | US7931841B2 (de) |
EP (1) | EP1855815B1 (de) |
JP (1) | JP4988698B2 (de) |
KR (1) | KR101312140B1 (de) |
CN (1) | CN101137449B (de) |
AT (1) | ATE500001T1 (de) |
BR (1) | BRPI0608701A2 (de) |
DE (1) | DE602006020416D1 (de) |
MX (1) | MX2007010907A (de) |
WO (1) | WO2006098938A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7224529B2 (en) * | 2003-09-09 | 2007-05-29 | 3M Innovative Properties Company | Microreplicated article |
US7165959B2 (en) * | 2003-09-09 | 2007-01-23 | 3M Innovative Properties Company | Apparatus and method for producing two-sided patterned webs in registration |
US20050231809A1 (en) * | 2003-09-09 | 2005-10-20 | Carlson Daniel H | Microreplicated polarizing article |
US7804649B2 (en) * | 2003-09-09 | 2010-09-28 | 3M Innovative Properties Company | Microreplicated achromatic lens |
WO2006098958A1 (en) * | 2005-03-09 | 2006-09-21 | 3M Innovative Properties Company | Microreplicated article with defect-reducing surface |
KR101300866B1 (ko) | 2005-03-09 | 2013-08-27 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 정합 상태로 된 양면형의 패터닝된 웨브를 제조하는 장치및 방법 |
BRPI0609284A2 (pt) * | 2005-03-09 | 2010-09-08 | 3M Innovative Properties Co | artigo microrreplicado, método de produzir um artigo microrreplicado, e, monitor óptico |
CN101137493B (zh) * | 2005-03-09 | 2012-04-11 | 3M创新有限公司 | 用于制造微复制物品的设备和方法 |
US7976741B2 (en) * | 2007-02-12 | 2011-07-12 | Ichia Technologies, Inc. | Method of manufacturing light guide plate of keypad |
US20100252961A1 (en) * | 2009-04-06 | 2010-10-07 | 3M Innovative Properties Company | Optical film replication on low thermal diffusivity tooling with conformal coating |
CN102959492B (zh) | 2010-06-25 | 2016-03-16 | 诺基亚技术有限公司 | 用户界面和相关设备及方法 |
TW201202008A (en) * | 2010-07-12 | 2012-01-16 | Hon Hai Prec Ind Co Ltd | Device and method for making optical film |
KR20120067163A (ko) * | 2010-12-15 | 2012-06-25 | 삼성모바일디스플레이주식회사 | 박막 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
TWI552861B (zh) * | 2012-02-08 | 2016-10-11 | 鴻海精密工業股份有限公司 | 導光膜製造裝置及製造方法 |
CN103246006A (zh) * | 2012-02-10 | 2013-08-14 | 鸿富锦精密工业(深圳)有限公司 | 导光膜制造装置及制造方法 |
US9714083B2 (en) | 2015-05-06 | 2017-07-25 | The Boeing Company | Color applications for aerodynamic microstructures |
US9868135B2 (en) | 2015-05-06 | 2018-01-16 | The Boeing Company | Aerodynamic microstructures having sub-microstructures |
US9751618B2 (en) | 2015-05-06 | 2017-09-05 | The Boeing Company | Optical effects for aerodynamic microstructures |
US10105877B2 (en) | 2016-07-08 | 2018-10-23 | The Boeing Company | Multilayer riblet applique and methods of producing the same |
US11987021B2 (en) | 2021-09-01 | 2024-05-21 | The Boeing Company | Multilayer riblet appliques |
CN113692135B (zh) * | 2021-10-26 | 2022-01-14 | 武汉大学 | 一种提高蚀刻过程中fpcb平整性的装置及方法 |
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-
2006
- 2006-03-06 CN CN2006800077191A patent/CN101137449B/zh not_active Expired - Fee Related
- 2006-03-06 BR BRPI0608701-9A patent/BRPI0608701A2/pt not_active Application Discontinuation
- 2006-03-06 US US11/369,372 patent/US7931841B2/en active Active
- 2006-03-06 EP EP06737183A patent/EP1855815B1/de not_active Not-in-force
- 2006-03-06 WO PCT/US2006/007975 patent/WO2006098938A1/en active Application Filing
- 2006-03-06 MX MX2007010907A patent/MX2007010907A/es unknown
- 2006-03-06 JP JP2008500815A patent/JP4988698B2/ja not_active Expired - Fee Related
- 2006-03-06 AT AT06737183T patent/ATE500001T1/de not_active IP Right Cessation
- 2006-03-06 KR KR1020077020460A patent/KR101312140B1/ko active IP Right Grant
- 2006-03-06 DE DE602006020416T patent/DE602006020416D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
DE602006020416D1 (de) | 2011-04-14 |
WO2006098938A1 (en) | 2006-09-21 |
BRPI0608701A2 (pt) | 2010-01-19 |
US20060251803A1 (en) | 2006-11-09 |
JP2008532806A (ja) | 2008-08-21 |
CN101137449A (zh) | 2008-03-05 |
EP1855815A1 (de) | 2007-11-21 |
KR20070108234A (ko) | 2007-11-08 |
CN101137449B (zh) | 2012-08-29 |
KR101312140B1 (ko) | 2013-09-26 |
JP4988698B2 (ja) | 2012-08-01 |
EP1855815B1 (de) | 2011-03-02 |
US7931841B2 (en) | 2011-04-26 |
MX2007010907A (es) | 2007-12-05 |
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