ATE497637T1 - Halbleiterbauelement mit einem bipolaren transistor und herstellungsverfahren dafür - Google Patents

Halbleiterbauelement mit einem bipolaren transistor und herstellungsverfahren dafür

Info

Publication number
ATE497637T1
ATE497637T1 AT06821136T AT06821136T ATE497637T1 AT E497637 T1 ATE497637 T1 AT E497637T1 AT 06821136 T AT06821136 T AT 06821136T AT 06821136 T AT06821136 T AT 06821136T AT E497637 T1 ATE497637 T1 AT E497637T1
Authority
AT
Austria
Prior art keywords
region
silicon
bipolar transistor
emitter region
production method
Prior art date
Application number
AT06821136T
Other languages
English (en)
Inventor
Philippe Meunier-Beillard
Raymond Duffy
Prabhat Agarwal
Godefridus Hurkx
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE497637T1 publication Critical patent/ATE497637T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73Bipolar junction transistors
    • H01L29/737Hetero-junction transistors
    • H01L29/7371Vertical transistors
    • H01L29/7378Vertical transistors comprising lattice mismatched active layers, e.g. SiGe strained layer transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0804Emitter regions of bipolar transistors
    • H01L29/0817Emitter regions of bipolar transistors of heterojunction bipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/66242Heterojunction transistors [HBT]
AT06821136T 2005-09-30 2006-09-22 Halbleiterbauelement mit einem bipolaren transistor und herstellungsverfahren dafür ATE497637T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05109046 2005-09-30
PCT/IB2006/053446 WO2007036861A2 (en) 2005-09-30 2006-09-22 Semiconductor device with a bipolar transistor and method of manufacturing such a device

Publications (1)

Publication Number Publication Date
ATE497637T1 true ATE497637T1 (de) 2011-02-15

Family

ID=37900152

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06821136T ATE497637T1 (de) 2005-09-30 2006-09-22 Halbleiterbauelement mit einem bipolaren transistor und herstellungsverfahren dafür

Country Status (8)

Country Link
US (1) US7939854B2 (de)
EP (1) EP1935023B1 (de)
JP (1) JP2009510755A (de)
CN (1) CN100583447C (de)
AT (1) ATE497637T1 (de)
DE (1) DE602006019972D1 (de)
TW (1) TW200721483A (de)
WO (1) WO2007036861A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101459076B (zh) * 2007-12-13 2011-02-02 上海华虹Nec电子有限公司 SiGe HBT晶体管的制备方法
CN103137678B (zh) * 2011-11-30 2015-08-19 上海华虹宏力半导体制造有限公司 锗硅异质结双极晶体管及制造方法
CN103137673B (zh) * 2011-11-30 2015-06-03 上海华虹宏力半导体制造有限公司 自对准双极晶体管及其制造方法
US9887278B2 (en) * 2015-09-28 2018-02-06 International Business Machines Corporation Semiconductor-on-insulator lateral heterojunction bipolar transistor having epitaxially grown intrinsic base and deposited extrinsic base
CN109887843B (zh) * 2019-01-31 2022-03-08 上海华虹宏力半导体制造有限公司 采用非选择性外延的自对准锗硅hbt器件的制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3658745B2 (ja) * 1998-08-19 2005-06-08 株式会社ルネサステクノロジ バイポーラトランジスタ
DE10002364A1 (de) * 2000-01-20 2001-08-02 Infineon Technologies Ag Silizium-Germanium-Bipolartranistor mit optimiertem Germaniumprofil
US6649482B1 (en) * 2001-06-15 2003-11-18 National Semiconductor Corporation Bipolar transistor with a silicon germanium base and an ultra small self-aligned polysilicon emitter and method of forming the transistor
JP2004538645A (ja) * 2001-08-06 2004-12-24 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ バイポーラトランジスタ、半導体デバイス、及びその製造方法
JP2006179507A (ja) * 2003-02-26 2006-07-06 Matsushita Electric Ind Co Ltd 半導体装置

Also Published As

Publication number Publication date
TW200721483A (en) 2007-06-01
EP1935023A2 (de) 2008-06-25
WO2007036861A3 (en) 2007-09-27
DE602006019972D1 (de) 2011-03-17
JP2009510755A (ja) 2009-03-12
US20080203434A1 (en) 2008-08-28
EP1935023B1 (de) 2011-02-02
CN101278402A (zh) 2008-10-01
WO2007036861A2 (en) 2007-04-05
CN100583447C (zh) 2010-01-20
US7939854B2 (en) 2011-05-10

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Legal Events

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