ATE472933T1 - Verfahren zur anpassung einer elektronischen komponente für oberflächenanbringung - Google Patents

Verfahren zur anpassung einer elektronischen komponente für oberflächenanbringung

Info

Publication number
ATE472933T1
ATE472933T1 AT07847919T AT07847919T ATE472933T1 AT E472933 T1 ATE472933 T1 AT E472933T1 AT 07847919 T AT07847919 T AT 07847919T AT 07847919 T AT07847919 T AT 07847919T AT E472933 T1 ATE472933 T1 AT E472933T1
Authority
AT
Austria
Prior art keywords
electronic component
leads
adjusting
surface mount
electrical circuit
Prior art date
Application number
AT07847919T
Other languages
English (en)
Inventor
Pierre Bertram
Olivier Ruffenach
Georges Peyresoubes
Original Assignee
Thales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales Sa filed Critical Thales Sa
Application granted granted Critical
Publication of ATE472933T1 publication Critical patent/ATE472933T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT07847919T 2006-12-08 2007-12-06 Verfahren zur anpassung einer elektronischen komponente für oberflächenanbringung ATE472933T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0610725A FR2909832A1 (fr) 2006-12-08 2006-12-08 Procede d'adaptation d'un composant electronique au montage en surface
PCT/EP2007/063446 WO2008068313A2 (fr) 2006-12-08 2007-12-06 Procede d'adaptation d'un composant electronique au montage en surface

Publications (1)

Publication Number Publication Date
ATE472933T1 true ATE472933T1 (de) 2010-07-15

Family

ID=38112069

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07847919T ATE472933T1 (de) 2006-12-08 2007-12-06 Verfahren zur anpassung einer elektronischen komponente für oberflächenanbringung

Country Status (7)

Country Link
US (1) US8316538B2 (de)
EP (1) EP2103201B1 (de)
AT (1) ATE472933T1 (de)
DE (1) DE602007007521D1 (de)
ES (1) ES2347989T3 (de)
FR (1) FR2909832A1 (de)
WO (1) WO2008068313A2 (de)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128834A (en) * 1990-08-20 1992-07-07 Motorola, Inc. Surface mount receptacle for leaded components
JPH06104374A (ja) * 1991-01-04 1994-04-15 Internatl Business Mach Corp <Ibm> 電子回路パッケージ並びにその導体の成形加工装置及び成形加工方法
US5493259A (en) * 1992-10-13 1996-02-20 The Whitaker Corporation High voltage, low pass filtering connector with multiple ground planes
DE19581837T1 (de) * 1994-11-10 1997-10-02 Micron Technology Inc Mehrlagiger Leitungsrahmen für eine Halbleitervorrichtung
SE516207C2 (sv) * 1996-11-26 2001-12-03 Ericsson Telefon Ab L M Förfarande och anordning för att ytmontera en komponent stående på en bärare
DE29901093U1 (de) * 1999-01-22 1999-04-08 Chu Mao Precision Industry Co., Ltd., Shen Kang Hsiang, Taichung Fotoabtastelement-Leuchtdiode für SMD

Also Published As

Publication number Publication date
WO2008068313A3 (fr) 2008-07-24
US20100115768A1 (en) 2010-05-13
EP2103201A2 (de) 2009-09-23
WO2008068313A2 (fr) 2008-06-12
EP2103201B1 (de) 2010-06-30
ES2347989T3 (es) 2010-11-26
FR2909832A1 (fr) 2008-06-13
DE602007007521D1 (de) 2010-08-12
US8316538B2 (en) 2012-11-27

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Legal Events

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