ATE461954T1 - Polymerisierbare zusammensetzung, thermoplastische harzzusammensetzung, vernetztes harz und vernetztes harz enthaltende verbundwerkstoffe - Google Patents

Polymerisierbare zusammensetzung, thermoplastische harzzusammensetzung, vernetztes harz und vernetztes harz enthaltende verbundwerkstoffe

Info

Publication number
ATE461954T1
ATE461954T1 AT04706864T AT04706864T ATE461954T1 AT E461954 T1 ATE461954 T1 AT E461954T1 AT 04706864 T AT04706864 T AT 04706864T AT 04706864 T AT04706864 T AT 04706864T AT E461954 T1 ATE461954 T1 AT E461954T1
Authority
AT
Austria
Prior art keywords
thermoplastic resin
resin composition
composition
composite materials
cross
Prior art date
Application number
AT04706864T
Other languages
English (en)
Inventor
Tomoo Sugawara
Original Assignee
Zeon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeon Corp filed Critical Zeon Corp
Application granted granted Critical
Publication of ATE461954T1 publication Critical patent/ATE461954T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/375—Thiols containing six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J165/00—Adhesives based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Adhesives based on derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/72—Cured, e.g. vulcanised, cross-linked
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Laminated Bodies (AREA)
  • Graft Or Block Polymers (AREA)
AT04706864T 2003-01-31 2004-01-30 Polymerisierbare zusammensetzung, thermoplastische harzzusammensetzung, vernetztes harz und vernetztes harz enthaltende verbundwerkstoffe ATE461954T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003023566 2003-01-31
PCT/JP2004/000902 WO2004067601A1 (ja) 2003-01-31 2004-01-30 重合性組成物、熱可塑性樹脂組成物、架橋樹脂及び架橋樹脂複合材料

Publications (1)

Publication Number Publication Date
ATE461954T1 true ATE461954T1 (de) 2010-04-15

Family

ID=32820731

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04706864T ATE461954T1 (de) 2003-01-31 2004-01-30 Polymerisierbare zusammensetzung, thermoplastische harzzusammensetzung, vernetztes harz und vernetztes harz enthaltende verbundwerkstoffe

Country Status (8)

Country Link
US (1) US20080125531A1 (de)
EP (1) EP1589054A4 (de)
JP (1) JP4285479B2 (de)
KR (1) KR20050106407A (de)
CN (1) CN100365039C (de)
AT (1) ATE461954T1 (de)
DE (1) DE602004026159D1 (de)
WO (1) WO2004067601A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8722828B2 (en) * 2003-01-31 2014-05-13 Zeon Corporation Process for continuous production of cycloolefin resins, and sheets or films thereof, using ring opening metathesis polymerization
CN1331578C (zh) * 2005-10-13 2007-08-15 中材科技股份有限公司 耐高温聚四氟乙烯覆膜过滤材料
JP4972958B2 (ja) * 2006-02-28 2012-07-11 住友ベークライト株式会社 樹脂組成物、樹脂層、積層体、配線板および配線板の製造方法
FR2900485B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
FR2900484B3 (fr) * 2006-04-28 2008-08-08 Ask Sa Support de dispositif d'identification radiofrequence et son procede de fabrication
JP4434248B2 (ja) 2007-08-22 2010-03-17 株式会社デンソー ピエゾアクチュエータ駆動装置
JP5194955B2 (ja) * 2008-03-31 2013-05-08 日本ゼオン株式会社 分子内に不飽和結合を２つ以上有し、そのうち少なくとも１つがメタセシス反応性であるシクロオレフィンモノマーを含む重合性組成物、プリプレグ及びそれを用いた積層体。
CN102186900B (zh) * 2008-10-21 2013-06-05 日本瑞翁株式会社 聚合性组合物、树脂成形体及叠层体
JP5278306B2 (ja) * 2009-12-25 2013-09-04 日本ゼオン株式会社 重合性組成物、樹脂成形体、及び積層体
JP5278305B2 (ja) * 2009-12-25 2013-09-04 日本ゼオン株式会社 重合性組成物、樹脂成形体、及び積層体
WO2012081691A1 (ja) * 2010-12-17 2012-06-21 日本ゼオン株式会社 架橋性樹脂成形体、架橋樹脂成形体、及び積層体
JP5361092B2 (ja) 2011-09-16 2013-12-04 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
CN102675831A (zh) * 2012-05-17 2012-09-19 镇江育达复合材料有限公司 高耐候、高强度smc材料及其制备方法及其应用
CN102757629B (zh) * 2012-07-30 2015-08-05 无锡新宏泰电器科技股份有限公司 户外用耐候性smc材料及其制备方法
CN102963071B (zh) * 2012-11-21 2014-02-19 深圳光启创新技术有限公司 一种复合板、超材料及制备方法
CN102963069B (zh) * 2012-11-21 2014-02-19 深圳光启创新技术有限公司 一种复合板、超材料及制备方法
CN102963072B (zh) * 2012-11-21 2014-02-19 深圳光启创新技术有限公司 一种复合板、超材料及制备方法
WO2016130742A1 (en) * 2015-02-14 2016-08-18 Materia, Inc. Romp polymers having improved resistance to hydrocarbon fluids
JPWO2017038620A1 (ja) * 2015-08-31 2018-06-14 日本ゼオン株式会社 樹脂組成物
EP3202813A1 (de) * 2016-02-05 2017-08-09 Telene SAS Härtbare zusammensetzung und geformter artikel mit der zusammensetzung
WO2018079603A1 (ja) * 2016-10-31 2018-05-03 日本ゼオン株式会社 架橋性組成物および架橋体
WO2019142570A1 (ja) * 2018-01-17 2019-07-25 京セラ株式会社 有機絶縁体、金属張積層板および配線基板
KR102839588B1 (ko) * 2018-12-26 2025-07-28 주식회사 쿠라레 도공성이 우수한 조성물
CN110527068B (zh) * 2019-08-15 2021-01-15 西安交通大学 一种有机自由基聚合物电介质材料及其合成方法
KR20230058002A (ko) * 2020-08-28 2023-05-02 세키스이가가쿠 고교가부시키가이샤 화합물, 화합물의 제조 방법, 점착제 조성물, 및, 점착 테이프

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50138050A (de) * 1974-04-23 1975-11-04
US5891951A (en) * 1987-09-14 1999-04-06 Idemitsu Kosan Co., Ltd. Styrene-based resin composition
US5274026A (en) * 1988-09-23 1993-12-28 The B. F. Goodrich Company Curable polycycloolefin resin solutions, their use in making printed circuit boards and the boards so made
US5395869A (en) * 1989-01-12 1995-03-07 Mitsui Petrochemical Industries, Ltd. Thermally stabilized thermoplastic cycloolefin in resin compositions
CA2277801C (en) * 1997-01-16 2002-10-15 Massachusetts Institute Of Technology Preparation of particles for inhalation
TW411348B (en) * 1997-05-28 2000-11-11 Mitsui Chemicals Inc Preparation of hydrogenated product of cyclic olefin ring-opening metathesis polymer
PT1107743E (pt) * 1998-08-25 2007-10-01 Advanced Inhalation Res Inc Formulações proteicas estáveis secas por pulverização
US20020015519A1 (en) * 1998-12-11 2002-02-07 Lord Corporation Fiber substrate adhesion and coatings by contact metathesis polymerization
US7025851B2 (en) * 1998-12-11 2006-04-11 Lord Corporation Contact metathesis polymerization
CA2382821A1 (en) * 1999-08-25 2001-03-01 Advanced Inhalation Research, Inc. Modulation of release from dry powder formulations
TWI300429B (en) * 2000-04-18 2008-09-01 Zeon Corp Photosensitive resin composition

Also Published As

Publication number Publication date
EP1589054A1 (de) 2005-10-26
CN1764681A (zh) 2006-04-26
EP1589054A4 (de) 2009-04-29
KR20050106407A (ko) 2005-11-09
JP4285479B2 (ja) 2009-06-24
WO2004067601A1 (ja) 2004-08-12
CN100365039C (zh) 2008-01-30
DE602004026159D1 (de) 2010-05-06
JPWO2004067601A1 (ja) 2006-05-18
US20080125531A1 (en) 2008-05-29

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