ATE435503T1 - Angepasster bildsensor für eine packung in chip- grösse - Google Patents

Angepasster bildsensor für eine packung in chip- grösse

Info

Publication number
ATE435503T1
ATE435503T1 AT03256671T AT03256671T ATE435503T1 AT E435503 T1 ATE435503 T1 AT E435503T1 AT 03256671 T AT03256671 T AT 03256671T AT 03256671 T AT03256671 T AT 03256671T AT E435503 T1 ATE435503 T1 AT E435503T1
Authority
AT
Austria
Prior art keywords
image sensor
chip size
sensor die
customized image
size pack
Prior art date
Application number
AT03256671T
Other languages
English (en)
Inventor
Katsumi Yamamoto
Original Assignee
Omnivision Internat Holding Lt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omnivision Internat Holding Lt filed Critical Omnivision Internat Holding Lt
Application granted granted Critical
Publication of ATE435503T1 publication Critical patent/ATE435503T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
AT03256671T 2002-12-26 2003-10-23 Angepasster bildsensor für eine packung in chip- grösse ATE435503T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/330,824 US20040124486A1 (en) 2002-12-26 2002-12-26 Image sensor adapted for reduced component chip scale packaging

Publications (1)

Publication Number Publication Date
ATE435503T1 true ATE435503T1 (de) 2009-07-15

Family

ID=32469049

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03256671T ATE435503T1 (de) 2002-12-26 2003-10-23 Angepasster bildsensor für eine packung in chip- grösse

Country Status (6)

Country Link
US (1) US20040124486A1 (de)
EP (1) EP1434276B1 (de)
CN (1) CN100373628C (de)
AT (1) ATE435503T1 (de)
DE (1) DE60328159D1 (de)
TW (1) TWI240409B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7365442B2 (en) * 2003-03-31 2008-04-29 Osram Opto Semiconductors Gmbh Encapsulation of thin-film electronic devices
JP4551638B2 (ja) * 2003-08-01 2010-09-29 富士フイルム株式会社 固体撮像装置の製造方法
JP2005056998A (ja) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd 固体撮像装置およびその製造方法
US7288757B2 (en) 2005-09-01 2007-10-30 Micron Technology, Inc. Microelectronic imaging devices and associated methods for attaching transmissive elements
JP2007142042A (ja) * 2005-11-16 2007-06-07 Sharp Corp 半導体パッケージとその製造方法，半導体モジュール，および電子機器
CN101627450B (zh) * 2007-03-08 2013-10-30 日本电气株式会社 电容元件、印刷布线板、半导体封装以及半导体电路
CN101369591B (zh) * 2007-08-17 2010-07-07 精材科技股份有限公司 影像感测元件封装体及其制作方法
KR101711007B1 (ko) 2010-04-29 2017-03-02 삼성전자주식회사 이미지 센서 패키지를 갖는 이미지 센서 모듈
JP2018093290A (ja) * 2016-11-30 2018-06-14 キヤノン・コンポーネンツ株式会社 イメージセンサユニット、画像読取装置および画像形成装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09232551A (ja) * 1996-02-26 1997-09-05 Toshiba Corp 光電変換装置
US6037609A (en) * 1997-01-17 2000-03-14 General Electric Company Corrosion resistant imager
JPH11121653A (ja) 1997-07-31 1999-04-30 Fuji Film Microdevices Co Ltd 半導体装置とその製造方法
EP1041628A3 (de) 1999-03-29 2008-05-28 Interuniversitair Microelektronica Centrum Vzw BGA-Bildsensor-Verpackung und deren Herstellungsmethode
WO2001061994A1 (en) * 2000-02-18 2001-08-23 Intelligent Pixels, Inc. Very low-power parallel video processor pixel circuit
US6396116B1 (en) * 2000-02-25 2002-05-28 Agilent Technologies, Inc. Integrated circuit packaging for optical sensor devices
US6285064B1 (en) * 2000-03-28 2001-09-04 Omnivision Technologies, Inc. Chip scale packaging technique for optical image sensing integrated circuits
TW454323B (en) * 2000-08-10 2001-09-11 Uincent Lin Image sensor package structure and substrate thereof
US20030111588A1 (en) * 2001-12-18 2003-06-19 Pao-Jung Chen Near-contact optical touch-screen sensor module

Also Published As

Publication number Publication date
CN1512593A (zh) 2004-07-14
DE60328159D1 (de) 2009-08-13
CN100373628C (zh) 2008-03-05
TW200514243A (en) 2005-04-16
EP1434276B1 (de) 2009-07-01
TWI240409B (en) 2005-09-21
EP1434276A3 (de) 2004-07-14
US20040124486A1 (en) 2004-07-01
EP1434276A2 (de) 2004-06-30

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