ATE429030T1 - Drahtbondierungserfahren und vorrichtung - Google Patents

Drahtbondierungserfahren und vorrichtung

Info

Publication number
ATE429030T1
ATE429030T1 AT03813211T AT03813211T ATE429030T1 AT E429030 T1 ATE429030 T1 AT E429030T1 AT 03813211 T AT03813211 T AT 03813211T AT 03813211 T AT03813211 T AT 03813211T AT E429030 T1 ATE429030 T1 AT E429030T1
Authority
AT
Austria
Prior art keywords
wirebonding
semiconductor products
movable clamp
wire bonding
bonding method
Prior art date
Application number
AT03813211T
Other languages
English (en)
Inventor
Thomas Kampschreur
Joep Stokkermans
Arjan Bakker
Rens Piet Van
Vet Arnoldus De
Der Meer Piet Van
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE429030T1 publication Critical patent/ATE429030T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
AT03813211T 2002-12-18 2003-11-17 Drahtbondierungserfahren und vorrichtung ATE429030T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02080360 2002-12-18
PCT/IB2003/005244 WO2004055870A1 (en) 2002-12-18 2003-11-17 Wirebonding method and apparatus

Publications (1)

Publication Number Publication Date
ATE429030T1 true ATE429030T1 (de) 2009-05-15

Family

ID=32524045

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03813211T ATE429030T1 (de) 2002-12-18 2003-11-17 Drahtbondierungserfahren und vorrichtung

Country Status (9)

Country Link
US (2) US7578425B2 (de)
EP (1) EP1586111B1 (de)
JP (1) JP2006511066A (de)
KR (1) KR20050084355A (de)
AT (1) ATE429030T1 (de)
AU (1) AU2003276600A1 (de)
DE (1) DE60327258D1 (de)
TW (1) TW200414386A (de)
WO (1) WO2004055870A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7216794B2 (en) * 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
EP1984945A2 (de) 2006-02-10 2008-10-29 Nxp B.V. Halbleiter-prozesssystem mit einem optischen instrument mit einer vorrichtung zur ausrichtung einer optischen vorrichtung an einem objekt
JP2010182911A (ja) * 2009-02-06 2010-08-19 Renesas Electronics Corp 半導体装置の製造方法及びワイヤボンダ
CN102473698B (zh) * 2009-07-20 2015-07-01 库利克和索夫工业公司 操作引线接合机的夹持系统的方法
SG190962A1 (en) 2010-12-29 2013-07-31 Orthodyne Electronics Corp Methods and systems for aligning tooling elements of ultrasonic bonding systems
MY183541A (en) * 2016-03-01 2021-02-25 Carsem M Sdn Bhd Flexible window clamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5238174A (en) * 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6062459A (en) * 1998-04-29 2000-05-16 Advanced Micro Devices, Inc. Wire bond clamp

Also Published As

Publication number Publication date
US7578425B2 (en) 2009-08-25
EP1586111A1 (de) 2005-10-19
US20060016860A1 (en) 2006-01-26
DE60327258D1 (de) 2009-05-28
TW200414386A (en) 2004-08-01
US20090277950A1 (en) 2009-11-12
AU2003276600A1 (en) 2004-07-09
JP2006511066A (ja) 2006-03-30
EP1586111B1 (de) 2009-04-15
KR20050084355A (ko) 2005-08-26
US8474680B2 (en) 2013-07-02
WO2004055870A1 (en) 2004-07-01

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Legal Events

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