ATE429030T1 - Drahtbondierungserfahren und vorrichtung - Google Patents

Drahtbondierungserfahren und vorrichtung

Info

Publication number
ATE429030T1
ATE429030T1 AT03813211T AT03813211T ATE429030T1 AT E429030 T1 ATE429030 T1 AT E429030T1 AT 03813211 T AT03813211 T AT 03813211T AT 03813211 T AT03813211 T AT 03813211T AT E429030 T1 ATE429030 T1 AT E429030T1
Authority
AT
Austria
Prior art keywords
wirebonding
semiconductor products
movable clamp
wire bonding
bonding method
Prior art date
Application number
AT03813211T
Other languages
English (en)
Inventor
Thomas Kampschreur
Joep Stokkermans
Arjan Bakker
Rens Piet Van
Vet Arnoldus De
Der Meer Piet Van
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE429030T1 publication Critical patent/ATE429030T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Wire Bonding (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
AT03813211T 2002-12-18 2003-11-17 Drahtbondierungserfahren und vorrichtung ATE429030T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02080360 2002-12-18
PCT/IB2003/005244 WO2004055870A1 (en) 2002-12-18 2003-11-17 Wirebonding method and apparatus

Publications (1)

Publication Number Publication Date
ATE429030T1 true ATE429030T1 (de) 2009-05-15

Family

ID=32524045

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03813211T ATE429030T1 (de) 2002-12-18 2003-11-17 Drahtbondierungserfahren und vorrichtung

Country Status (9)

Country Link
US (2) US7578425B2 (de)
EP (1) EP1586111B1 (de)
JP (1) JP2006511066A (de)
KR (1) KR20050084355A (de)
AT (1) ATE429030T1 (de)
AU (1) AU2003276600A1 (de)
DE (1) DE60327258D1 (de)
TW (1) TW200414386A (de)
WO (1) WO2004055870A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7216794B2 (en) * 2005-06-09 2007-05-15 Texas Instruments Incorporated Bond capillary design for ribbon wire bonding
CN101379605B (zh) 2006-02-10 2011-04-20 Nxp股份有限公司 具有包括对准光学装置和目标的设备的光学仪器的半导体加工系统
JP2010182911A (ja) * 2009-02-06 2010-08-19 Renesas Electronics Corp 半導体装置の製造方法及びワイヤボンダ
SG177604A1 (en) * 2009-07-20 2012-02-28 Kulicke & Soffa Ind Inc Method of operating a clamping system of a wire bonding machine
WO2012092058A2 (en) * 2010-12-29 2012-07-05 Orthodyne Electroncis Corporation Methods and systems for aligning tooling elements of ultrasonic bonding systems
MY183541A (en) * 2016-03-01 2021-02-25 Carsem M Sdn Bhd Flexible window clamp

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5238174A (en) * 1991-11-15 1993-08-24 Kulicke And Soffa Investments, Inc. Smart indexing head for universal lead frame work station
US6068174A (en) * 1996-12-13 2000-05-30 Micro)N Technology, Inc. Device and method for clamping and wire-bonding the leads of a lead frame one set at a time
US6062459A (en) * 1998-04-29 2000-05-16 Advanced Micro Devices, Inc. Wire bond clamp

Also Published As

Publication number Publication date
US8474680B2 (en) 2013-07-02
KR20050084355A (ko) 2005-08-26
WO2004055870A1 (en) 2004-07-01
US20060016860A1 (en) 2006-01-26
US20090277950A1 (en) 2009-11-12
US7578425B2 (en) 2009-08-25
JP2006511066A (ja) 2006-03-30
EP1586111A1 (de) 2005-10-19
EP1586111B1 (de) 2009-04-15
DE60327258D1 (de) 2009-05-28
TW200414386A (en) 2004-08-01
AU2003276600A1 (en) 2004-07-09

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties