ATE414674T1 - Kreisel und verfahren zur dessen herstellung - Google Patents

Kreisel und verfahren zur dessen herstellung

Info

Publication number
ATE414674T1
ATE414674T1 AT02711501T AT02711501T ATE414674T1 AT E414674 T1 ATE414674 T1 AT E414674T1 AT 02711501 T AT02711501 T AT 02711501T AT 02711501 T AT02711501 T AT 02711501T AT E414674 T1 ATE414674 T1 AT E414674T1
Authority
AT
Austria
Prior art keywords
electrode
driving
displacement
displaced
fixed
Prior art date
Application number
AT02711501T
Other languages
German (de)
English (en)
Inventor
Yong-Kweon Kim
Seong-Hyok Kim
Original Assignee
Intellimicrons Co Ltd
Yong-Kweon Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intellimicrons Co Ltd, Yong-Kweon Kim filed Critical Intellimicrons Co Ltd
Application granted granted Critical
Publication of ATE414674T1 publication Critical patent/ATE414674T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/02—Rotary gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0067—Mechanical properties
    • B81B3/0078—Constitution or structural means for improving mechanical properties not provided for in B81B3/007 - B81B3/0075
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0062—Devices moving in two or more dimensions, i.e. having special features which allow movement in more than one dimension
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G01C19/5755—Structural details or topology the devices having a single sensing mass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0136—Comb structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
AT02711501T 2001-02-12 2002-01-30 Kreisel und verfahren zur dessen herstellung ATE414674T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0006695A KR100418624B1 (ko) 2001-02-12 2001-02-12 자이로스코프 및 그 제조 방법

Publications (1)

Publication Number Publication Date
ATE414674T1 true ATE414674T1 (de) 2008-12-15

Family

ID=19705617

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02711501T ATE414674T1 (de) 2001-02-12 2002-01-30 Kreisel und verfahren zur dessen herstellung

Country Status (8)

Country Link
US (1) US6845668B2 (enExample)
EP (1) EP1360144B1 (enExample)
JP (1) JP3713019B2 (enExample)
KR (1) KR100418624B1 (enExample)
CN (1) CN1242913C (enExample)
AT (1) ATE414674T1 (enExample)
DE (1) DE60229919D1 (enExample)
WO (1) WO2002064497A1 (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6927098B2 (en) * 2003-05-07 2005-08-09 Honeywell International Inc. Methods and apparatus for attaching MEMS devices to housing
US7037805B2 (en) 2003-05-07 2006-05-02 Honeywell International Inc. Methods and apparatus for attaching a die to a substrate
SG112898A1 (en) * 2003-12-11 2005-07-28 Singapore Tech Dynamics Pte Sensing apparatus, system and method
JP2005326620A (ja) * 2004-05-14 2005-11-24 Fujitsu Ltd マイクロミラー素子
CN100338470C (zh) * 2005-03-25 2007-09-19 中北大学 单片双惯性参数加速度计陀螺仪
US7491567B2 (en) 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
JP5070778B2 (ja) * 2006-09-20 2012-11-14 株式会社デンソー 力学量センサ
US8061201B2 (en) * 2007-07-13 2011-11-22 Georgia Tech Research Corporation Readout method and electronic bandwidth control for a silicon in-plane tuning fork gyroscope
US8748206B2 (en) 2010-11-23 2014-06-10 Honeywell International Inc. Systems and methods for a four-layer chip-scale MEMS device
US8776601B2 (en) 2010-11-23 2014-07-15 Honeywell International Inc. MEMS sensor using multi-layer movable combs
US9171964B2 (en) 2010-11-23 2015-10-27 Honeywell International Inc. Systems and methods for a three-layer chip-scale MEMS device
US9493344B2 (en) 2010-11-23 2016-11-15 Honeywell International Inc. MEMS vertical comb structure with linear drive/pickoff
CN102507981B (zh) * 2011-11-02 2013-06-05 重庆理工大学 一种带耦合梁结构的单敏感质量元硅微二维加速度传感器
CN102633227B (zh) * 2012-03-16 2014-07-23 中北大学 一种mems惯性传感器结构压膜阻尼可调装置
US9581447B2 (en) * 2014-07-08 2017-02-28 Honeywell International Inc. MEMS gyro motor loop filter
US9903718B2 (en) * 2015-05-28 2018-02-27 Invensense, Inc. MEMS device mechanical amplitude control
US10514259B2 (en) 2016-08-31 2019-12-24 Analog Devices, Inc. Quad proof mass MEMS gyroscope with outer couplers and related methods
US10697774B2 (en) 2016-12-19 2020-06-30 Analog Devices, Inc. Balanced runners synchronizing motion of masses in micromachined devices
US10415968B2 (en) 2016-12-19 2019-09-17 Analog Devices, Inc. Synchronized mass gyroscope
US10627235B2 (en) 2016-12-19 2020-04-21 Analog Devices, Inc. Flexural couplers for microelectromechanical systems (MEMS) devices
FR3065800B1 (fr) * 2017-04-27 2019-08-02 Safran Resonateur configure pour etre integre a un capteur angulaire inertiel
US10948294B2 (en) 2018-04-05 2021-03-16 Analog Devices, Inc. MEMS gyroscopes with in-line springs and related systems and methods
US11193771B1 (en) 2020-06-05 2021-12-07 Analog Devices, Inc. 3-axis gyroscope with rotational vibration rejection
EP4162281A4 (en) 2020-06-08 2025-04-23 Analog Devices, Inc. MEMS STRESS REDUCTION GYROSCOPE
US11692825B2 (en) 2020-06-08 2023-07-04 Analog Devices, Inc. Drive and sense stress relief apparatus
CN111609844A (zh) * 2020-06-18 2020-09-01 中汽研汽车检验中心（天津）有限公司 一种陀螺仪安装固定装置及应用结构
US11698257B2 (en) 2020-08-24 2023-07-11 Analog Devices, Inc. Isotropic attenuated motion gyroscope
CN113135548B (zh) * 2021-04-20 2024-06-11 广州蜂鸟传感科技有限公司 一种压电微机械执行器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19530007C2 (de) * 1995-08-16 1998-11-26 Bosch Gmbh Robert Drehratensensor
US5945599A (en) * 1996-12-13 1999-08-31 Kabushiki Kaisha Toyota Chuo Kenkyusho Resonance type angular velocity sensor
US5914521A (en) * 1997-07-30 1999-06-22 Motorola, Inc. Sensor devices having a movable structure
US6122961A (en) * 1997-09-02 2000-09-26 Analog Devices, Inc. Micromachined gyros
KR100231715B1 (ko) 1997-11-25 1999-11-15 정선종 평면 진동형 마이크로 자이로스코프
KR100316774B1 (ko) * 1999-01-15 2001-12-12 이형도 마이크로 관성 센서의 제작 방법
US6481285B1 (en) * 1999-04-21 2002-11-19 Andrei M. Shkel Micro-machined angle-measuring gyroscope

Also Published As

Publication number Publication date
CN1457319A (zh) 2003-11-19
KR20020066486A (ko) 2002-08-19
CN1242913C (zh) 2006-02-22
KR100418624B1 (ko) 2004-02-11
JP2004518964A (ja) 2004-06-24
US6845668B2 (en) 2005-01-25
US20030159509A1 (en) 2003-08-28
JP3713019B2 (ja) 2005-11-02
WO2002064497A1 (en) 2002-08-22
DE60229919D1 (enExample) 2009-01-02
EP1360144A1 (en) 2003-11-12
EP1360144B1 (en) 2008-11-19

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