ATE41177T1 - Verfahren zur stromlosen plattierung. - Google Patents

Verfahren zur stromlosen plattierung.

Info

Publication number
ATE41177T1
ATE41177T1 AT85106819T AT85106819T ATE41177T1 AT E41177 T1 ATE41177 T1 AT E41177T1 AT 85106819 T AT85106819 T AT 85106819T AT 85106819 T AT85106819 T AT 85106819T AT E41177 T1 ATE41177 T1 AT E41177T1
Authority
AT
Austria
Prior art keywords
plating
bath
temperature
plating process
electrical plating
Prior art date
Application number
AT85106819T
Other languages
German (de)
English (en)
Inventor
Michael James Canestaro
Ronald Anthony Kaschak
Donald Gene Mcbride
Donald Philip Seraphim
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE41177T1 publication Critical patent/ATE41177T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1676—Heating of the solution
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/168—Control of temperature, e.g. temperature of bath, substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AT85106819T 1984-07-02 1985-06-03 Verfahren zur stromlosen plattierung. ATE41177T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/626,961 US4554184A (en) 1984-07-02 1984-07-02 Method for plating from an electroless plating bath
EP85106819A EP0173003B1 (en) 1984-07-02 1985-06-03 Method for plating from an electroless plating bath

Publications (1)

Publication Number Publication Date
ATE41177T1 true ATE41177T1 (de) 1989-03-15

Family

ID=24512589

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85106819T ATE41177T1 (de) 1984-07-02 1985-06-03 Verfahren zur stromlosen plattierung.

Country Status (5)

Country Link
US (1) US4554184A (en:Method)
EP (1) EP0173003B1 (en:Method)
JP (1) JPS6115979A (en:Method)
AT (1) ATE41177T1 (en:Method)
DE (1) DE3568594D1 (en:Method)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4684545A (en) * 1986-02-10 1987-08-04 International Business Machines Corporation Electroless plating with bi-level control of dissolved oxygen
US4967690A (en) * 1986-02-10 1990-11-06 International Business Machines Corporation Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means
US4808431A (en) * 1987-12-08 1989-02-28 International Business Machines Corp. Method for controlling plating on seeded surfaces
JPH069309B2 (ja) * 1989-09-22 1994-02-02 株式会社日立製作所 プリント回路板、その製造方法および製造装置
US5419821A (en) * 1993-06-04 1995-05-30 Vaughan; Daniel J. Process and equipment for reforming and maintaining electroless metal baths
JP4482744B2 (ja) * 2001-02-23 2010-06-16 株式会社日立製作所 無電解銅めっき液、無電解銅めっき方法、配線板の製造方法
US6875691B2 (en) * 2002-06-21 2005-04-05 Mattson Technology, Inc. Temperature control sequence of electroless plating baths
JP3985864B2 (ja) * 2002-08-27 2007-10-03 株式会社荏原製作所 無電解めっき装置及び方法
US20050016201A1 (en) * 2003-07-22 2005-01-27 Ivanov Igor C. Multi-staged heating system for fabricating microelectronic devices
US20160040292A1 (en) * 2014-08-08 2016-02-11 Gary P. Wainwright Roll-to-roll electroless plating system with low dissolved oxygen content
CN104785328A (zh) * 2015-04-28 2015-07-22 铜陵海源超微粉体有限公司 一种矿渣立磨的耐磨磨盘和磨辊
TWI846928B (zh) * 2019-08-27 2024-07-01 日商東京威力科創股份有限公司 基板液處理方法、基板液處理裝置、及電腦可讀取記錄媒體

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2658839A (en) * 1951-04-21 1953-11-10 Gen Am Transport Process of chemical nickel plating
US2717218A (en) * 1952-07-19 1955-09-06 Gen Am Transport Chemical nickel plating methods and apparatus
US2872353A (en) * 1954-01-12 1959-02-03 Gen Am Transport Processes of continuous chemical nickel plating
US2819188A (en) * 1954-05-18 1958-01-07 Gen Am Transport Processes of chemical nickel plating
US2872354A (en) * 1954-12-31 1959-02-03 Gen Am Transport Processes of continuous chemical nickel plating
US2941902A (en) * 1957-07-02 1960-06-21 Gen Am Transport Chemical nickel plating methods and systems
US2955959A (en) * 1958-09-22 1960-10-11 Rose Arthur H Du Chemical nickel plating
US4152467A (en) * 1978-03-10 1979-05-01 International Business Machines Corporation Electroless copper plating process with dissolved oxygen maintained in bath

Also Published As

Publication number Publication date
EP0173003A2 (en) 1986-03-05
JPH0218388B2 (en:Method) 1990-04-25
JPS6115979A (ja) 1986-01-24
DE3568594D1 (en) 1989-04-13
EP0173003A3 (en) 1986-11-26
EP0173003B1 (en) 1989-03-08
US4554184A (en) 1985-11-19

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