ATE403370T1 - Element zum tragen elektronsicher bauteile - Google Patents
Element zum tragen elektronsicher bauteileInfo
- Publication number
- ATE403370T1 ATE403370T1 AT05706817T AT05706817T ATE403370T1 AT E403370 T1 ATE403370 T1 AT E403370T1 AT 05706817 T AT05706817 T AT 05706817T AT 05706817 T AT05706817 T AT 05706817T AT E403370 T1 ATE403370 T1 AT E403370T1
- Authority
- AT
- Austria
- Prior art keywords
- carrying electronic
- electronic safe
- safe components
- electronic components
- cells
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Battery Mounting, Suspending (AREA)
- Glass Compositions (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DKPA200400392 | 2004-03-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE403370T1 true ATE403370T1 (de) | 2008-08-15 |
Family
ID=34961756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05706817T ATE403370T1 (de) | 2004-03-11 | 2005-03-09 | Element zum tragen elektronsicher bauteile |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1726197B1 (de) |
AT (1) | ATE403370T1 (de) |
DE (1) | DE602005008566D1 (de) |
WO (1) | WO2005089034A2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2536051A (en) * | 2015-03-06 | 2016-09-07 | Hiflux Ltd | Heatsink |
US10874030B2 (en) * | 2018-12-26 | 2020-12-22 | Quanta Computer Inc. | Flexible cold plate with fluid distribution mechanism |
GB2608996A (en) * | 2021-07-15 | 2023-01-25 | Yasa Ltd | Cooling apparatus |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4573067A (en) * | 1981-03-02 | 1986-02-25 | The Board Of Trustees Of The Leland Stanford Junior University | Method and means for improved heat removal in compact semiconductor integrated circuits |
US6400012B1 (en) * | 1997-09-17 | 2002-06-04 | Advanced Energy Voorhees, Inc. | Heat sink for use in cooling an integrated circuit |
FR2786658A1 (fr) * | 1998-11-27 | 2000-06-02 | Alstom Technology | Structure composite pour composant electronique de puissance procede de fabrication de cette structure et composant electronique de puissance pourvu d'une telle structure |
US6942019B2 (en) * | 2002-03-25 | 2005-09-13 | Ltx Corporation | Apparatus and method for circuit board liquid cooling |
-
2005
- 2005-03-09 EP EP05706817A patent/EP1726197B1/de active Active
- 2005-03-09 WO PCT/DK2005/000156 patent/WO2005089034A2/en active IP Right Grant
- 2005-03-09 DE DE602005008566T patent/DE602005008566D1/de active Active
- 2005-03-09 AT AT05706817T patent/ATE403370T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2005089034A3 (en) | 2005-10-20 |
WO2005089034A2 (en) | 2005-09-22 |
DE602005008566D1 (de) | 2008-09-11 |
EP1726197A2 (de) | 2006-11-29 |
EP1726197B1 (de) | 2008-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |