ATE403370T1 - Element zum tragen elektronsicher bauteile - Google Patents

Element zum tragen elektronsicher bauteile

Info

Publication number
ATE403370T1
ATE403370T1 AT05706817T AT05706817T ATE403370T1 AT E403370 T1 ATE403370 T1 AT E403370T1 AT 05706817 T AT05706817 T AT 05706817T AT 05706817 T AT05706817 T AT 05706817T AT E403370 T1 ATE403370 T1 AT E403370T1
Authority
AT
Austria
Prior art keywords
carrying electronic
electronic safe
safe components
electronic components
cells
Prior art date
Application number
AT05706817T
Other languages
English (en)
Inventor
Klaus Olesen
Original Assignee
Danfoss Silicon Power Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Danfoss Silicon Power Gmbh filed Critical Danfoss Silicon Power Gmbh
Application granted granted Critical
Publication of ATE403370T1 publication Critical patent/ATE403370T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Glass Compositions (AREA)
  • Battery Mounting, Suspending (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AT05706817T 2004-03-11 2005-03-09 Element zum tragen elektronsicher bauteile ATE403370T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DKPA200400392 2004-03-11

Publications (1)

Publication Number Publication Date
ATE403370T1 true ATE403370T1 (de) 2008-08-15

Family

ID=34961756

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05706817T ATE403370T1 (de) 2004-03-11 2005-03-09 Element zum tragen elektronsicher bauteile

Country Status (4)

Country Link
EP (1) EP1726197B1 (de)
AT (1) ATE403370T1 (de)
DE (1) DE602005008566D1 (de)
WO (1) WO2005089034A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2536051A (en) * 2015-03-06 2016-09-07 Hiflux Ltd Heatsink
US10874030B2 (en) 2018-12-26 2020-12-22 Quanta Computer Inc. Flexible cold plate with fluid distribution mechanism
GB2608996A (en) * 2021-07-15 2023-01-25 Yasa Ltd Cooling apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
FR2786658A1 (fr) * 1998-11-27 2000-06-02 Alstom Technology Structure composite pour composant electronique de puissance procede de fabrication de cette structure et composant electronique de puissance pourvu d'une telle structure
US6942019B2 (en) * 2002-03-25 2005-09-13 Ltx Corporation Apparatus and method for circuit board liquid cooling

Also Published As

Publication number Publication date
WO2005089034A3 (en) 2005-10-20
EP1726197A2 (de) 2006-11-29
EP1726197B1 (de) 2008-07-30
WO2005089034A2 (en) 2005-09-22
DE602005008566D1 (de) 2008-09-11

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties