ATE400894T1 - Gekühlte elektronische anordnung und methode zum kühlen einer leiterplatte - Google Patents

Gekühlte elektronische anordnung und methode zum kühlen einer leiterplatte

Info

Publication number
ATE400894T1
ATE400894T1 AT06076155T AT06076155T ATE400894T1 AT E400894 T1 ATE400894 T1 AT E400894T1 AT 06076155 T AT06076155 T AT 06076155T AT 06076155 T AT06076155 T AT 06076155T AT E400894 T1 ATE400894 T1 AT E400894T1
Authority
AT
Austria
Prior art keywords
circuit board
liquid pump
coolant
circuit
cooling
Prior art date
Application number
AT06076155T
Other languages
English (en)
Inventor
Scott D Brandenberg
Suresh K Chengalva
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE400894T1 publication Critical patent/ATE400894T1/de

Links

Classifications

    • H10W40/47—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AT06076155T 2005-06-17 2006-06-02 Gekühlte elektronische anordnung und methode zum kühlen einer leiterplatte ATE400894T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/155,371 US7230832B2 (en) 2005-06-17 2005-06-17 Cooled electronic assembly and method for cooling a printed circuit board

Publications (1)

Publication Number Publication Date
ATE400894T1 true ATE400894T1 (de) 2008-07-15

Family

ID=36608617

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06076155T ATE400894T1 (de) 2005-06-17 2006-06-02 Gekühlte elektronische anordnung und methode zum kühlen einer leiterplatte

Country Status (4)

Country Link
US (1) US7230832B2 (de)
EP (1) EP1734578B1 (de)
AT (1) ATE400894T1 (de)
DE (1) DE602006001691D1 (de)

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JP2008210007A (ja) * 2007-02-23 2008-09-11 Alps Electric Co Ltd 液冷システム
US20090207568A1 (en) * 2008-02-18 2009-08-20 Haveri Heikki Antti Mikael Method and apparatus for cooling in miniaturized electronics
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US10426037B2 (en) 2015-07-15 2019-09-24 International Business Machines Corporation Circuitized structure with 3-dimensional configuration
US9911012B2 (en) 2015-09-25 2018-03-06 International Business Machines Corporation Overlapping, discrete tamper-respondent sensors
US10172239B2 (en) 2015-09-25 2019-01-01 International Business Machines Corporation Tamper-respondent sensors with formed flexible layer(s)
US9924591B2 (en) 2015-09-25 2018-03-20 International Business Machines Corporation Tamper-respondent assemblies
US9578764B1 (en) 2015-09-25 2017-02-21 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
US9591776B1 (en) 2015-09-25 2017-03-07 International Business Machines Corporation Enclosure with inner tamper-respondent sensor(s)
US10098235B2 (en) 2015-09-25 2018-10-09 International Business Machines Corporation Tamper-respondent assemblies with region(s) of increased susceptibility to damage
US10175064B2 (en) 2015-09-25 2019-01-08 International Business Machines Corporation Circuit boards and electronic packages with embedded tamper-respondent sensor
US9894749B2 (en) 2015-09-25 2018-02-13 International Business Machines Corporation Tamper-respondent assemblies with bond protection
US10143090B2 (en) 2015-10-19 2018-11-27 International Business Machines Corporation Circuit layouts of tamper-respondent sensors
US9978231B2 (en) 2015-10-21 2018-05-22 International Business Machines Corporation Tamper-respondent assembly with protective wrap(s) over tamper-respondent sensor(s)
US9913389B2 (en) 2015-12-01 2018-03-06 International Business Corporation Corporation Tamper-respondent assembly with vent structure
US9555606B1 (en) 2015-12-09 2017-01-31 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US10327343B2 (en) 2015-12-09 2019-06-18 International Business Machines Corporation Applying pressure to adhesive using CTE mismatch between components
US9554477B1 (en) 2015-12-18 2017-01-24 International Business Machines Corporation Tamper-respondent assemblies with enclosure-to-board protection
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US20170325327A1 (en) * 2016-04-07 2017-11-09 Massachusetts Institute Of Technology Printed circuit board for high power components
US9904811B2 (en) 2016-04-27 2018-02-27 International Business Machines Corporation Tamper-proof electronic packages with two-phase dielectric fluid
US9881880B2 (en) 2016-05-13 2018-01-30 International Business Machines Corporation Tamper-proof electronic packages with stressed glass component substrate(s)
US9913370B2 (en) 2016-05-13 2018-03-06 International Business Machines Corporation Tamper-proof electronic packages formed with stressed glass
US9858776B1 (en) 2016-06-28 2018-01-02 International Business Machines Corporation Tamper-respondent assembly with nonlinearity monitoring
US10321589B2 (en) 2016-09-19 2019-06-11 International Business Machines Corporation Tamper-respondent assembly with sensor connection adapter
US10271424B2 (en) 2016-09-26 2019-04-23 International Business Machines Corporation Tamper-respondent assemblies with in situ vent structure(s)
US10299372B2 (en) 2016-09-26 2019-05-21 International Business Machines Corporation Vented tamper-respondent assemblies
US9999124B2 (en) 2016-11-02 2018-06-12 International Business Machines Corporation Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
US10327329B2 (en) 2017-02-13 2019-06-18 International Business Machines Corporation Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
US10306753B1 (en) 2018-02-22 2019-05-28 International Business Machines Corporation Enclosure-to-board interface with tamper-detect circuit(s)
US11122682B2 (en) 2018-04-04 2021-09-14 International Business Machines Corporation Tamper-respondent sensors with liquid crystal polymer layers
US10964625B2 (en) 2019-02-26 2021-03-30 Google Llc Device and method for direct liquid cooling via metal channels
US11735495B2 (en) * 2019-02-27 2023-08-22 Intel Corporation Active package cooling structures using molded substrate packaging technology
US11121058B2 (en) 2019-07-24 2021-09-14 Aptiv Technologies Limited Liquid cooled module with device heat spreader
US11315852B2 (en) 2019-10-11 2022-04-26 Aptiv Technologies Limited Thermal interface layer for electronic device
US10679770B1 (en) 2019-10-11 2020-06-09 Aptiv Technologies Limited Interface layer with mesh and sinter paste
US11095014B2 (en) 2020-01-07 2021-08-17 Aptiv Technologies Limited Waveguide antenna with integrated temperature management
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Also Published As

Publication number Publication date
EP1734578A1 (de) 2006-12-20
US7230832B2 (en) 2007-06-12
DE602006001691D1 (de) 2008-08-21
US20060285300A1 (en) 2006-12-21
EP1734578B1 (de) 2008-07-09

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