ATE400893T1 - Eine aufnahme- und ablagemontage um einen film zu transportieren - Google Patents

Eine aufnahme- und ablagemontage um einen film zu transportieren

Info

Publication number
ATE400893T1
ATE400893T1 AT04076592T AT04076592T ATE400893T1 AT E400893 T1 ATE400893 T1 AT E400893T1 AT 04076592 T AT04076592 T AT 04076592T AT 04076592 T AT04076592 T AT 04076592T AT E400893 T1 ATE400893 T1 AT E400893T1
Authority
AT
Austria
Prior art keywords
film
collection
transport
file assembly
collet
Prior art date
Application number
AT04076592T
Other languages
English (en)
Inventor
Yiu Ming Cheung
Chi Ming Chong
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Application granted granted Critical
Publication of ATE400893T1 publication Critical patent/ATE400893T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1705—Lamina transferred to base from adhered flexible web or sheet type carrier
    • Y10T156/1707—Discrete spaced laminae on adhered carrier
    • Y10T156/171—Means serially presenting discrete base articles or separate portions of a single article
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photographic Developing Apparatuses (AREA)
AT04076592T 2003-06-02 2004-05-28 Eine aufnahme- und ablagemontage um einen film zu transportieren ATE400893T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/452,993 US7182118B2 (en) 2003-06-02 2003-06-02 Pick and place assembly for transporting a film of material

Publications (1)

Publication Number Publication Date
ATE400893T1 true ATE400893T1 (de) 2008-07-15

Family

ID=33418057

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04076592T ATE400893T1 (de) 2003-06-02 2004-05-28 Eine aufnahme- und ablagemontage um einen film zu transportieren

Country Status (4)

Country Link
US (1) US7182118B2 (de)
EP (1) EP1489655B1 (de)
AT (1) ATE400893T1 (de)
DE (1) DE602004014853D1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060003548A1 (en) * 2004-06-30 2006-01-05 Kobrinsky Mauro J Highly compliant plate for wafer bonding
AT413385B (de) * 2004-09-13 2006-02-15 Amag Rolling Gmbh Verfahren zum aufbringen einer schutzleiste auf ein kathodenblech zur elektrolytischen gewinnung eines metalls aus einer elektrolytflüssigkeit
CH697496B1 (de) * 2005-12-23 2008-11-14 Alphasem Gmbh Werkzeug zum Aufnehmen, Absetzen oder Anpressen eines flächigen Objektes und Verwendung des Werkzeugs.
US7790507B2 (en) * 2007-03-24 2010-09-07 Texas Instruments Incorporated Semiconductor die collet and method
TW200947641A (en) * 2008-05-15 2009-11-16 Gio Optoelectronics Corp Die bonding apparatus
US20100024968A1 (en) * 2008-07-30 2010-02-04 United Technologies Corporation Adhesive installation tool
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
US8432679B2 (en) 2010-06-15 2013-04-30 Apple Inc. Silicone barrier for drive window
US8632363B2 (en) 2010-08-31 2014-01-21 Apple Inc. Heat sealed connector assembly
DE102011013369A1 (de) * 2010-12-30 2012-07-05 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Mehrzahl von Halbleiterbauelementen
JP2013033925A (ja) * 2011-07-01 2013-02-14 Tokyo Electron Ltd 洗浄方法、プログラム、コンピュータ記憶媒体、洗浄装置及び剥離システム
US9079351B2 (en) * 2012-06-22 2015-07-14 Wisconsin Alumni Research Foundation System for transfer of nanomembrane elements with improved preservation of spatial integrity
DE102013220118A1 (de) 2013-10-04 2015-04-23 Robert Bosch Gmbh Vorrichtung und Verfahren zum Transportieren zumindest eines folienartigen Bauteils
US10446728B2 (en) * 2014-10-31 2019-10-15 eLux, Inc. Pick-and remove system and method for emissive display repair
DE102015224885B4 (de) 2015-12-10 2024-11-07 Adidas Ag Verfahren für die Platzierung von Patches und hergestellte Artikel
TWI567011B (zh) * 2016-06-15 2017-01-21 萬潤科技股份有限公司 Method and device for conveying the components of the bonding process
CN118737998A (zh) * 2017-03-02 2024-10-01 Ev 集团 E·索尔纳有限责任公司 用于键合芯片的方法和装置
GB2576774A (en) * 2018-09-01 2020-03-04 Vps Group Ltd Apparatus for vehicle registration plate assembly
KR102724556B1 (ko) 2019-06-04 2024-10-30 삼성전자주식회사 본딩 장치 및 그를 포함하는 반도체 패키지의 제조 설비

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2646121B2 (ja) * 1988-09-29 1997-08-25 株式会社日立製作所 薄板部品用の真空吸着器、薄板部品の取扱方法、薄板部品取扱装置、半導体ウエハ移し替え装置
GB8829196D0 (en) * 1988-12-14 1989-01-25 Du Pont Canada Heat-sealing device for thermoplastic films
DE3912242A1 (de) * 1989-04-14 1990-10-18 Gurit Essex Ag Vorrichtungen zum maschinellen aufbringen von flexiblen, einseitig klebbaren schichtkoerpern auf werkstuecke und verwendung derselben
US5405487A (en) * 1992-06-30 1995-04-11 Cms Gilbreth Packaging Systems, Inc. Apparatus and method for applying labels onto small cylindrical articles and web and adhesive delivery mechanism
JPH06104300A (ja) 1992-09-24 1994-04-15 Fujitsu Ltd ダイボンドテープ貼付けの装置及び方法
JPH0766092A (ja) 1993-08-23 1995-03-10 Sumitomo Sitix Corp 半導体ウエーハの接着方法および接着治具
US5733410A (en) * 1996-06-03 1998-03-31 Motorola, Inc. Labeling apparatus for applying labels with a rolling motion
US6248441B1 (en) * 1999-03-24 2001-06-19 Custom-Pak, Inc. Method for enhancing the three-dimensional effect of a raised plastic surface using in-mold labeling and the label used therewith
KR100317648B1 (ko) 1998-08-26 2002-02-19 윤종용 절연접착테이프에의하여다이접착되는반도체소자및다이접착방법그리고그장치
JP3520820B2 (ja) 1999-10-22 2004-04-19 松下電工株式会社 接着剤の転写方法
JP2001334891A (ja) 2000-05-24 2001-12-04 Sumitomo Wiring Syst Ltd 自動車用ドアヒンジ
JP2002334891A (ja) * 2001-05-09 2002-11-22 Canon Inc 接着剤の転写ピンユニット及び転写方法
TWI283906B (en) * 2001-12-21 2007-07-11 Esec Trading Sa Pick-up tool for mounting semiconductor chips

Also Published As

Publication number Publication date
US7182118B2 (en) 2007-02-27
EP1489655B1 (de) 2008-07-09
EP1489655A1 (de) 2004-12-22
DE602004014853D1 (de) 2008-08-21
US20040238112A1 (en) 2004-12-02

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