ATE39598T1 - Mehrschichtige leiterlatte mit gleichmaessig verteilten fuellmaterial-teilchen und verfahren zu ihrer herstellung. - Google Patents
Mehrschichtige leiterlatte mit gleichmaessig verteilten fuellmaterial-teilchen und verfahren zu ihrer herstellung.Info
- Publication number
- ATE39598T1 ATE39598T1 AT85110227T AT85110227T ATE39598T1 AT E39598 T1 ATE39598 T1 AT E39598T1 AT 85110227 T AT85110227 T AT 85110227T AT 85110227 T AT85110227 T AT 85110227T AT E39598 T1 ATE39598 T1 AT E39598T1
- Authority
- AT
- Austria
- Prior art keywords
- manufacture
- circuit board
- evenly distributed
- multilayer circuit
- filling particles
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0254—Microballoons or hollow filler particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S264/00—Plastic and nonmetallic article shaping or treating: processes
- Y10S264/06—Molding microballoons and binder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP85110227A EP0211979B2 (de) | 1985-08-14 | 1985-08-14 | Mehrschichtige Leiterplatte mit gleichmässig verteilten Füllmaterial-Teilchen und Verfahren zu ihrer Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE39598T1 true ATE39598T1 (de) | 1989-01-15 |
Family
ID=8193684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT85110227T ATE39598T1 (de) | 1985-08-14 | 1985-08-14 | Mehrschichtige leiterlatte mit gleichmaessig verteilten fuellmaterial-teilchen und verfahren zu ihrer herstellung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4661301A (de) |
EP (1) | EP0211979B2 (de) |
AT (1) | ATE39598T1 (de) |
DE (1) | DE3567140D1 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2617964A1 (fr) * | 1987-07-08 | 1989-01-13 | Jaeger | Accessoire pour vehicule automobile destine a etre plonge au moins partiellement dans du carburol |
US4867935A (en) * | 1988-02-26 | 1989-09-19 | E. I. Du Pont De Nemours And Company | Method for preparing ceramic tape compositions |
US4868350A (en) * | 1988-03-07 | 1989-09-19 | International Business Machines Corporation | High performance circuit boards |
US4864722A (en) * | 1988-03-16 | 1989-09-12 | International Business Machines Corporation | Low dielectric printed circuit boards |
US4854038A (en) * | 1988-03-16 | 1989-08-08 | International Business Machines Corporation | Modularized fabrication of high performance printed circuit boards |
GB8815083D0 (en) * | 1988-06-24 | 1988-08-03 | Rasmussen O B | Method & apparatus for helical cutting of lay-flat flexible tubular sheet of polymer material |
DE3826522A1 (de) * | 1988-08-04 | 1990-02-08 | Teldix Gmbh | Leiterplatte |
GB8828519D0 (en) * | 1988-12-07 | 1989-01-11 | Lucas Ind Plc | Electro-chemical cells |
US5126192A (en) * | 1990-01-26 | 1992-06-30 | International Business Machines Corporation | Flame retardant, low dielectric constant microsphere filled laminate |
US5055342A (en) * | 1990-02-16 | 1991-10-08 | International Business Machines Corporation | Fluorinated polymeric composition, fabrication thereof and use thereof |
US4960634A (en) * | 1990-03-14 | 1990-10-02 | International Business Machines Corporation | Epoxy composition of increased thermal conductivity and use thereof |
JP2906282B2 (ja) * | 1990-09-20 | 1999-06-14 | 富士通株式会社 | ガラスセラミック・グリーンシートと多層基板、及び、その製造方法 |
US5098781A (en) * | 1990-12-28 | 1992-03-24 | General Electric Company | Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates |
US5785789A (en) * | 1993-03-18 | 1998-07-28 | Digital Equipment Corporation | Low dielectric constant microsphere filled layers for multilayer electrical structures |
US5665295A (en) * | 1994-08-04 | 1997-09-09 | Teijin Limited | Process for the production of composite molded article |
US5753358A (en) * | 1994-08-25 | 1998-05-19 | W. L. Gore & Associates, Inc. | Adhisive-filler polymer film composite |
US5879794A (en) * | 1994-08-25 | 1999-03-09 | W. L. Gore & Associates, Inc. | Adhesive-filler film composite |
US5766750A (en) * | 1994-08-25 | 1998-06-16 | W. L. Gore & Associates, Inc. | Process for making an adhesive-filler polymer film composite |
US5670250A (en) * | 1995-02-24 | 1997-09-23 | Polyclad Laminates, Inc. | Circuit board prepreg with reduced dielectric constant |
WO1998020528A1 (en) | 1996-11-08 | 1998-05-14 | W.L. Gore & Associates, Inc. | METHOD FOR IMPROVING RELIABILITY OF THIN CIRCUIT SUBSTRATES BY INCREASING THE Tg OF THE SUBSTRATE |
US6042936A (en) * | 1997-09-23 | 2000-03-28 | Fibermark, Inc. | Microsphere containing circuit board paper |
US6632511B2 (en) | 2001-11-09 | 2003-10-14 | Polyclad Laminates, Inc. | Manufacture of prepregs and laminates with relatively low dielectric constant for printed circuit boards |
US6600645B1 (en) * | 2002-09-27 | 2003-07-29 | Ut-Battelle, Llc | Dielectric composite materials and method for preparing |
US7217458B2 (en) * | 2003-07-16 | 2007-05-15 | Huber Engineered Woods Llc | Strength-enhanced, lightweight lignocellulosic composite board materials and methods of their manufacture |
US20070026226A1 (en) * | 2005-07-29 | 2007-02-01 | Jiann-Hsing Chen | Epoxy primer layer for fuser belts |
US20070026225A1 (en) * | 2005-07-29 | 2007-02-01 | Jiann-Hsing Chen | Primer composition for high temperature belts |
EP2129716B1 (de) * | 2007-02-28 | 2018-05-23 | Solvay Specialty Polymers USA, LLC. | Thermoplastische zusammensetzungen mit mikrokügelchen |
US20090239429A1 (en) | 2007-03-21 | 2009-09-24 | Kipp Michael D | Sound Attenuation Building Material And System |
CN103898996A (zh) | 2007-03-21 | 2014-07-02 | 阿什工业技术有限责任公司 | 结合微粒基质的实用材料 |
US8445101B2 (en) | 2007-03-21 | 2013-05-21 | Ashtech Industries, Llc | Sound attenuation building material and system |
DE112009001730T5 (de) | 2008-07-18 | 2012-11-22 | World Properties, Inc. | Schaltungsmaterialien, Schaltungslaminate und Herstellungsverfahren hiervon |
US8591677B2 (en) | 2008-11-04 | 2013-11-26 | Ashtech Industries, Llc | Utility materials incorporating a microparticle matrix formed with a setting agent |
KR20130068659A (ko) * | 2011-12-15 | 2013-06-26 | 엘지이노텍 주식회사 | 인쇄회로기판 및 그의 제조 방법 |
EP3025566B1 (de) | 2013-07-23 | 2021-04-07 | Rogers Corporation | Schaltungsmaterialien, schaltungslaminate und verfahren zur herstellung davon |
KR20160140258A (ko) * | 2015-05-29 | 2016-12-07 | 삼성전기주식회사 | 패키지용 수지 조성물, 이를 이용한 절연 필름 및 인쇄회로기판 |
EP3490958A1 (de) | 2016-07-27 | 2019-06-05 | Corning Incorporated | Keramik- und polymerverbundstoff, verfahren zur herstellung und verwendungen davon |
CN111763415B (zh) * | 2020-06-15 | 2023-02-14 | 九牧厨卫股份有限公司 | 一种超薄抗开裂的马桶配件及其材料和制备方法 |
TW202206286A (zh) | 2020-07-28 | 2022-02-16 | 美商聖高拜塑膠製品公司 | 介電基板及其形成方法 |
CN116530220A (zh) | 2020-12-16 | 2023-08-01 | 美国圣戈班性能塑料公司 | 介电基板及其形成方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2854372A (en) * | 1953-09-03 | 1958-09-30 | Abitibi Power & Paper Co | Process for forming wood particle board and product |
US2993235A (en) * | 1957-03-04 | 1961-07-25 | Owens Corning Fiberglass Corp | Method for making reinforced resin products |
FR1375656A (fr) * | 1960-06-16 | 1964-10-23 | Procédé de décoration ou d'impression en couleurs sur des supports quelconques, appareillage pour son application et articles en résultant | |
US3103406A (en) * | 1960-10-14 | 1963-09-10 | Method of making low density epoxy | |
US3257484A (en) * | 1963-01-14 | 1966-06-21 | Barnette Stanley Ronald | Plastic articles having isotropic properties and methods of making same |
NL6513483A (de) * | 1965-04-20 | 1967-04-20 | ||
US3832426A (en) * | 1972-12-19 | 1974-08-27 | Atomic Energy Commission | Syntactic carbon foam |
NL7607048A (nl) * | 1976-06-28 | 1977-12-30 | Philips Nv | Dragerplaat voor gedrukte bedradingen. |
DE2814633A1 (de) * | 1978-04-05 | 1979-10-11 | Guenther Dr Ing Herrmann | Basismaterialien zur herstellung gedruckter schaltungen |
US4518737A (en) * | 1978-12-26 | 1985-05-21 | Rogers Corporation | Dielectric material and method of making the dielectric material |
FR2525849B1 (fr) * | 1982-04-26 | 1985-08-09 | Hutchinson | Substrat de circuit imprime |
-
1985
- 1985-08-14 DE DE8585110227T patent/DE3567140D1/de not_active Expired
- 1985-08-14 AT AT85110227T patent/ATE39598T1/de active
- 1985-08-14 EP EP85110227A patent/EP0211979B2/de not_active Expired - Lifetime
- 1985-08-14 US US06/765,476 patent/US4661301A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0211979B2 (de) | 1992-01-29 |
DE3567140D1 (en) | 1989-02-02 |
US4661301A (en) | 1987-04-28 |
EP0211979A1 (de) | 1987-03-04 |
EP0211979B1 (de) | 1988-12-28 |
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