ATE368136T1 - Verfahren zur vorbehandlung einer oberfläche eines mit metall zu beschichtenden nichtleitenden materials - Google Patents
Verfahren zur vorbehandlung einer oberfläche eines mit metall zu beschichtenden nichtleitenden materialsInfo
- Publication number
- ATE368136T1 ATE368136T1 AT03798083T AT03798083T ATE368136T1 AT E368136 T1 ATE368136 T1 AT E368136T1 AT 03798083 T AT03798083 T AT 03798083T AT 03798083 T AT03798083 T AT 03798083T AT E368136 T1 ATE368136 T1 AT E368136T1
- Authority
- AT
- Austria
- Prior art keywords
- metal
- sub
- ions
- pretreating
- metal ions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200201429A DK175025B1 (da) | 2002-09-26 | 2002-09-26 | Fremgangsmåde til forbehandling af en overflade på et ikke-ledende materiale, der skal pletteres |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE368136T1 true ATE368136T1 (de) | 2007-08-15 |
Family
ID=32039054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03798083T ATE368136T1 (de) | 2002-09-26 | 2003-09-23 | Verfahren zur vorbehandlung einer oberfläche eines mit metall zu beschichtenden nichtleitenden materials |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060000720A1 (de) |
EP (1) | EP1546435B1 (de) |
AT (1) | ATE368136T1 (de) |
AU (1) | AU2003266486A1 (de) |
DE (1) | DE60315170D1 (de) |
DK (1) | DK175025B1 (de) |
WO (1) | WO2004029327A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6900236B1 (en) | 1999-10-18 | 2005-05-31 | University Of Connecticut | Cannabimimetic indole derivatives |
US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
DE102010021554A1 (de) | 2010-05-21 | 2011-11-24 | Siemens Aktiengesellschaft | Bauteil mit einer katalytischen Oberfläche, Verfahren zu dessen Herstellung und Verwendung dieses Bauteils |
DE102010021553A1 (de) | 2010-05-21 | 2011-11-24 | Siemens Aktiengesellschaft | Bauteil mit einer katalytischen Oberfläche, Verfahren zu dessen Herstellung und Verwendung dieses Bauteils |
CN111519226A (zh) * | 2020-06-05 | 2020-08-11 | 麦德美科技(苏州)有限公司 | 聚醚酰亚胺化学粗化电镀工艺 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579428A (en) * | 1967-09-30 | 1971-05-18 | Mitsubishi Petrochemical Co | Method of manufacturing plated polypropylene shaped articles |
GB1404855A (en) * | 1971-07-28 | 1975-09-03 | Mitsui Mining & Smelting Co | Catalytic purification of exhaust gases |
GB1401600A (en) * | 1972-12-13 | 1975-07-16 | Kollmorgen Corp | Composition and process for the activation of resinous bodies for adherent metallization |
US4073740A (en) * | 1975-06-18 | 1978-02-14 | Kollmorgen Technologies Corporation | Composition for the activation of resinous bodies for adherent metallization |
DE3816494A1 (de) * | 1988-05-10 | 1989-11-16 | Schering Ag | Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen |
US5078889A (en) * | 1989-02-28 | 1992-01-07 | Csa Division, Lake Industries, Inc. | Selective removal of contaminants from water sources using inorganic media |
US4999251A (en) * | 1989-04-03 | 1991-03-12 | General Electric Company | Method for treating polyetherimide substrates and articles obtained therefrom |
DE3928435A1 (de) * | 1989-08-24 | 1991-02-28 | Schering Ag | Verfahren zur direkten metallisierung eines nicht leitenden substrats |
US5693209A (en) * | 1989-09-14 | 1997-12-02 | Atotech Deutschland Gmbh | Process for metallization of a nonconductor surface |
US5648125A (en) * | 1995-11-16 | 1997-07-15 | Cane; Frank N. | Electroless plating process for the manufacture of printed circuit boards |
-
2002
- 2002-09-26 DK DK200201429A patent/DK175025B1/da not_active IP Right Cessation
-
2003
- 2003-09-23 WO PCT/DK2003/000617 patent/WO2004029327A1/en active IP Right Grant
- 2003-09-23 US US10/529,467 patent/US20060000720A1/en not_active Abandoned
- 2003-09-23 EP EP03798083A patent/EP1546435B1/de not_active Expired - Lifetime
- 2003-09-23 AU AU2003266486A patent/AU2003266486A1/en not_active Abandoned
- 2003-09-23 DE DE60315170T patent/DE60315170D1/de not_active Expired - Lifetime
- 2003-09-23 AT AT03798083T patent/ATE368136T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DK200201429A (da) | 2004-03-27 |
DK175025B1 (da) | 2004-05-03 |
EP1546435B1 (de) | 2007-07-25 |
US20060000720A1 (en) | 2006-01-05 |
EP1546435A1 (de) | 2005-06-29 |
WO2004029327A1 (en) | 2004-04-08 |
DE60315170D1 (de) | 2007-09-06 |
AU2003266486A1 (en) | 2004-04-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |