ATE322665T1 - Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten - Google Patents

Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten

Info

Publication number
ATE322665T1
ATE322665T1 AT00947218T AT00947218T ATE322665T1 AT E322665 T1 ATE322665 T1 AT E322665T1 AT 00947218 T AT00947218 T AT 00947218T AT 00947218 T AT00947218 T AT 00947218T AT E322665 T1 ATE322665 T1 AT E322665T1
Authority
AT
Austria
Prior art keywords
electronic part
electronic components
dimensional inspection
camera
dimensional
Prior art date
Application number
AT00947218T
Other languages
English (en)
Inventor
David P Mork
Original Assignee
Beaty Elwin M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23382862&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE322665(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US09/351,892 external-priority patent/US6862365B1/en
Application filed by Beaty Elwin M filed Critical Beaty Elwin M
Application granted granted Critical
Publication of ATE322665T1 publication Critical patent/ATE322665T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Processing (AREA)
  • Studio Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AT00947218T 1999-07-13 2000-07-12 Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten ATE322665T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/351,892 US6862365B1 (en) 1998-01-16 1999-07-13 Method and apparatus for three dimensional inspection of electronic components

Publications (1)

Publication Number Publication Date
ATE322665T1 true ATE322665T1 (de) 2006-04-15

Family

ID=23382862

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00947218T ATE322665T1 (de) 1999-07-13 2000-07-12 Verfahren und apparat für die dreidimensionale inspektion von elektronischen komponenten

Country Status (5)

Country Link
EP (1) EP1218688B1 (de)
JP (1) JP2003504607A (de)
AT (1) ATE322665T1 (de)
DE (1) DE60027175D1 (de)
WO (1) WO2001004567A2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030072011A1 (en) * 2001-10-09 2003-04-17 Shirley Lyle G. Method and apparatus for combining views in three-dimensional surface profiling
AU2002357335A1 (en) * 2001-12-28 2003-07-24 Applied Precision, Llc Stereoscopic three-dimensional metrology system and method
EP2153410B1 (de) * 2007-05-29 2016-11-16 Cognex Technology and Investment Corporation 3d-zusammenstellungsverifikation aus 2d-bildern
FR2919396B1 (fr) * 2007-07-27 2010-08-20 Clara Vision Boitier et systeme de prise de vue, notamment pour le controle de qualite de cordon de soudure.
KR102158026B1 (ko) * 2014-01-28 2020-09-21 엘지이노텍 주식회사 캘리브레이션 장치 및 카메라 시스템
JP2016188781A (ja) * 2015-03-30 2016-11-04 セイコーエプソン株式会社 電子部品搬送装置および電子部品検査装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818061A (en) * 1992-06-24 1998-10-06 Robotic Vision Systems, Inc. Apparatus and method for obtaining three-dimensional data from objects in a contiguous array
US5652658A (en) * 1993-10-19 1997-07-29 View Engineering, Inc. Grid array inspection system and method
JPH07151522A (ja) * 1993-11-29 1995-06-16 Sanyo Electric Co Ltd 電子部品検査装置
JPH09304030A (ja) * 1996-05-20 1997-11-28 Komatsu Ltd 半導体パッケージの端子検査装置
US5926557A (en) * 1997-02-26 1999-07-20 Acuity Imaging, Llc Inspection method
US5828449A (en) * 1997-02-26 1998-10-27 Acuity Imaging, Llc Ring illumination reflective elements on a generally planar surface
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US5910844A (en) * 1997-07-15 1999-06-08 Vistech Corporation Dynamic three dimensional vision inspection system

Also Published As

Publication number Publication date
EP1218688B1 (de) 2006-04-05
EP1218688A4 (de) 2004-09-22
WO2001004567A2 (en) 2001-01-18
EP1218688A2 (de) 2002-07-03
WO2001004567A3 (en) 2001-05-03
DE60027175D1 (de) 2006-05-18
JP2003504607A (ja) 2003-02-04

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Legal Events

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