ATE297060T1 - Zwischenstück - Google Patents
ZwischenstückInfo
- Publication number
- ATE297060T1 ATE297060T1 AT00106828T AT00106828T ATE297060T1 AT E297060 T1 ATE297060 T1 AT E297060T1 AT 00106828 T AT00106828 T AT 00106828T AT 00106828 T AT00106828 T AT 00106828T AT E297060 T1 ATE297060 T1 AT E297060T1
- Authority
- AT
- Austria
- Prior art keywords
- plate
- intermediate piece
- passages
- overlying
- engagement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R35/00—Flexible or turnable line connectors, i.e. the rotation angle being limited
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
- H05K7/1069—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting with spring contact pieces
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Joining Of Building Structures In Genera (AREA)
- Ceramic Capacitors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/287,896 US6217342B1 (en) | 1997-10-30 | 1999-04-07 | Interposer assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE297060T1 true ATE297060T1 (de) | 2005-06-15 |
Family
ID=23104840
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00106828T ATE297060T1 (de) | 1999-04-07 | 2000-03-30 | Zwischenstück |
Country Status (9)
Country | Link |
---|---|
US (2) | US6217342B1 (de) |
EP (1) | EP1043807B1 (de) |
JP (1) | JP4494583B2 (de) |
KR (1) | KR100638302B1 (de) |
AT (1) | ATE297060T1 (de) |
CA (1) | CA2302792C (de) |
DE (1) | DE60020445T2 (de) |
SG (1) | SG97877A1 (de) |
TW (1) | TW501318B (de) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030214800A1 (en) * | 1999-07-15 | 2003-11-20 | Dibene Joseph Ted | System and method for processor power delivery and thermal management |
US6527563B2 (en) | 2000-10-04 | 2003-03-04 | Gary A. Clayton | Grid interposer |
US6544047B2 (en) * | 2001-03-30 | 2003-04-08 | Intel Corporation | Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment |
US6604950B2 (en) * | 2001-04-26 | 2003-08-12 | Teledyne Technologies Incorporated | Low pitch, high density connector |
US6447304B1 (en) * | 2001-05-15 | 2002-09-10 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector |
US6585527B2 (en) | 2001-05-31 | 2003-07-01 | Samtec, Inc. | Compliant connector for land grid array |
US6730134B2 (en) * | 2001-07-02 | 2004-05-04 | Intercon Systems, Inc. | Interposer assembly |
JP4210049B2 (ja) * | 2001-09-04 | 2009-01-14 | 株式会社アドバンストシステムズジャパン | スパイラル状接触子 |
US7363688B2 (en) * | 2002-07-25 | 2008-04-29 | International Business Machines Corporation | Land grid array structures and methods for engineering change |
TW551648U (en) * | 2002-11-22 | 2003-09-01 | Hon Hai Prec Ind Co Ltd | Contact of electrical connector |
US7443692B2 (en) * | 2003-05-16 | 2008-10-28 | Continental Automotive Systems Us, Inc. | Power converter architecture employing at least one capacitor across a DC bus |
US6987670B2 (en) * | 2003-05-16 | 2006-01-17 | Ballard Power Systems Corporation | Dual power module power system architecture |
US7505294B2 (en) * | 2003-05-16 | 2009-03-17 | Continental Automotive Systems Us, Inc. | Tri-level inverter |
US6906404B2 (en) * | 2003-05-16 | 2005-06-14 | Ballard Power Systems Corporation | Power module with voltage overshoot limiting |
US6921270B2 (en) * | 2003-06-11 | 2005-07-26 | Cinch Connectors, Inc. | Electrical connector |
US7625216B2 (en) * | 2003-06-11 | 2009-12-01 | Cinch Connectors, Inc. | Electrical connector |
US7455556B2 (en) * | 2003-06-11 | 2008-11-25 | Cinch Connectors, Inc. | Electrical contact |
US6994565B2 (en) * | 2003-07-14 | 2006-02-07 | Fci Americas Technology, Inc. | Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element |
TWM249244U (en) * | 2003-07-18 | 2004-11-01 | Hon Hai Prec Ind Co Ltd | Electrical connector |
US6923656B2 (en) | 2003-10-14 | 2005-08-02 | Sun Microsystems, Inc. | Land grid array socket with diverse contacts |
US7186119B2 (en) * | 2003-10-17 | 2007-03-06 | Integrated System Technologies, Llc | Interconnection device |
US20050128706A1 (en) * | 2003-12-16 | 2005-06-16 | Ballard Power Systems Corporation | Power module with heat exchange |
US6832917B1 (en) * | 2004-01-16 | 2004-12-21 | Intercon Systems, Inc. | Interposer assembly |
TWI282645B (en) * | 2004-04-16 | 2007-06-11 | Hon Hai Prec Ind Co Ltd | Electrical contact |
US7295448B2 (en) * | 2004-06-04 | 2007-11-13 | Siemens Vdo Automotive Corporation | Interleaved power converter |
US7289329B2 (en) * | 2004-06-04 | 2007-10-30 | Siemens Vdo Automotive Corporation | Integration of planar transformer and/or planar inductor with power switches in power converter |
US7563107B2 (en) * | 2004-07-19 | 2009-07-21 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with dual-function protrusions |
KR20060016726A (ko) * | 2004-08-18 | 2006-02-22 | 에스에무케이 가부시키가이샤 | 커넥터 |
JP2006073442A (ja) * | 2004-09-03 | 2006-03-16 | Tyco Electronics Amp Kk | 電気コネクタ |
US7180763B2 (en) * | 2004-09-21 | 2007-02-20 | Ballard Power Systems Corporation | Power converter |
WO2006044934A2 (en) * | 2004-10-20 | 2006-04-27 | Ballard Power Systems Corporation | Power system method and apparatus |
WO2006054329A1 (ja) * | 2004-11-16 | 2006-05-26 | Fujitsu Limited | コンタクタ及びコンタクタを用いた試験方法 |
EP2306634A3 (de) * | 2005-06-30 | 2015-04-29 | Continental Automotive Systems US, Inc. | Regelsystem für elektrische Antriebe |
US7070420B1 (en) * | 2005-08-08 | 2006-07-04 | Wakefield Steven B | Electrical interconnect system utilizing nonconductive elastomeric elements and continuous conductive elements |
DE602005014484D1 (de) * | 2005-09-22 | 2009-06-25 | Smk Kk | Verbinder |
US7402048B2 (en) * | 2006-03-30 | 2008-07-22 | Intel Corporation | Technique for blind-mating daughtercard to mainboard |
US20070254499A1 (en) * | 2006-05-01 | 2007-11-01 | Lotes Co., Ltd. | Electrical connector |
KR101098471B1 (ko) * | 2006-05-30 | 2011-12-27 | 가부시키가이샤후지쿠라 | 소켓용 콘택트 단자 및 반도체 장치 |
US7402049B2 (en) * | 2006-08-24 | 2008-07-22 | Hon Hai Precision Ind. Co., Ltd. | Contact for an interposer-type connector array |
US20080100323A1 (en) * | 2006-10-25 | 2008-05-01 | Silicon Test Systems, Inc. | Low cost, high pin count, wafer sort automated test equipment (ate) device under test (dut) interface for testing electronic devices in high parallelism |
US7775804B2 (en) | 2008-04-15 | 2010-08-17 | Amphenol Corporation | Interposer assembly with flat contacts |
EP2282381A4 (de) * | 2008-05-30 | 2011-10-12 | Elmec Corp | Kontaktsondeneinrichtung |
CN102124611B (zh) * | 2008-08-14 | 2013-08-21 | 皇家飞利浦电子股份有限公司 | 具有接触组件的电学装置 |
JP5261325B2 (ja) * | 2008-10-09 | 2013-08-14 | 日本碍子株式会社 | 電気的接続体 |
TWM373039U (en) * | 2009-07-17 | 2010-01-21 | Hon Hai Prec Ind Co Ltd | Electrical connector and contacts thereof |
US8512049B1 (en) * | 2011-03-25 | 2013-08-20 | Western Digital Technologies, Inc. | Solderless compression connector comprising constant width conducting elements housed substantially within a dielectric when installed |
US8672688B2 (en) * | 2012-01-17 | 2014-03-18 | International Business Machines Corporation | Land grid array interposer with compressible conductors |
US9172161B2 (en) * | 2012-12-12 | 2015-10-27 | Amphenol InterCon Systems, Inc. | Impedance controlled LGA interposer assembly |
KR101918833B1 (ko) | 2014-09-22 | 2018-11-14 | 암페놀 인터콘 시스템즈, 아이엔씨. | 인터포저 조립체 및 방법 |
DE102015110498B3 (de) * | 2015-06-30 | 2016-11-17 | HARTING Electronics GmbH | Gleitelement zur Kontaktierung von Leiterkarten |
KR101921932B1 (ko) * | 2016-10-28 | 2018-11-26 | 주식회사 오킨스전자 | 활-타입 범프, 및 이를 포함하는 인터포저 |
CN107359448A (zh) * | 2017-07-14 | 2017-11-17 | 番禺得意精密电子工业有限公司 | 电连接器及电子装置 |
JP7142425B2 (ja) | 2017-10-23 | 2022-09-27 | タイコエレクトロニクスジャパン合同会社 | インタポーザ組立体 |
CN108306138A (zh) * | 2018-01-09 | 2018-07-20 | 番禺得意精密电子工业有限公司 | 电连接器 |
KR102590955B1 (ko) | 2019-02-22 | 2023-10-17 | 암페놀 인터콘 시스템즈, 아이엔씨. | 인터포저 조립체 및 방법 |
CN111064031B (zh) | 2019-11-25 | 2021-05-25 | 番禺得意精密电子工业有限公司 | 电连接器及其制造方法 |
TWM602744U (zh) * | 2020-01-20 | 2020-10-11 | 唐虞企業股份有限公司 | 受力機構及其構成的連接器 |
CN111509434B (zh) * | 2020-04-30 | 2022-03-01 | 海光信息技术股份有限公司 | 插座用端子、插座及电子装置 |
CN113948924B (zh) * | 2021-09-06 | 2023-09-22 | 番禺得意精密电子工业有限公司 | 电连接器 |
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-
1999
- 1999-04-07 US US09/287,896 patent/US6217342B1/en not_active Expired - Lifetime
- 1999-12-07 US US09/455,989 patent/US6176707B1/en not_active Expired - Lifetime
-
2000
- 2000-03-28 CA CA002302792A patent/CA2302792C/en not_active Expired - Lifetime
- 2000-03-30 AT AT00106828T patent/ATE297060T1/de not_active IP Right Cessation
- 2000-03-30 SG SG200001777A patent/SG97877A1/en unknown
- 2000-03-30 TW TW089105931A patent/TW501318B/zh not_active IP Right Cessation
- 2000-03-30 DE DE60020445T patent/DE60020445T2/de not_active Expired - Lifetime
- 2000-03-30 EP EP00106828A patent/EP1043807B1/de not_active Expired - Lifetime
- 2000-04-06 KR KR1020000017827A patent/KR100638302B1/ko active IP Right Grant
- 2000-04-07 JP JP2000105919A patent/JP4494583B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
SG97877A1 (en) | 2003-08-20 |
DE60020445T2 (de) | 2005-10-13 |
JP2000311733A (ja) | 2000-11-07 |
TW501318B (en) | 2002-09-01 |
KR100638302B1 (ko) | 2006-10-25 |
EP1043807A2 (de) | 2000-10-11 |
KR20000071565A (ko) | 2000-11-25 |
CA2302792C (en) | 2008-05-13 |
EP1043807A3 (de) | 2001-07-25 |
US6176707B1 (en) | 2001-01-23 |
DE60020445D1 (de) | 2005-07-07 |
CA2302792A1 (en) | 2000-10-07 |
US6217342B1 (en) | 2001-04-17 |
EP1043807B1 (de) | 2005-06-01 |
JP4494583B2 (ja) | 2010-06-30 |
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