ATE277864T1 - Verfahren zum verstärken einer mechanischen mikrostruktur - Google Patents
Verfahren zum verstärken einer mechanischen mikrostrukturInfo
- Publication number
- ATE277864T1 ATE277864T1 AT02293119T AT02293119T ATE277864T1 AT E277864 T1 ATE277864 T1 AT E277864T1 AT 02293119 T AT02293119 T AT 02293119T AT 02293119 T AT02293119 T AT 02293119T AT E277864 T1 ATE277864 T1 AT E277864T1
- Authority
- AT
- Austria
- Prior art keywords
- reinforcing
- layer
- mechanical microstructure
- mechanical
- protruding
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
- B81C1/00896—Temporary protection during separation into individual elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0012—Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Sensors (AREA)
- Micromachines (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Materials For Medical Uses (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0117014A FR2834282B1 (fr) | 2001-12-28 | 2001-12-28 | Procede de renforcement d'une microstructure mecanique |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE277864T1 true ATE277864T1 (de) | 2004-10-15 |
Family
ID=8871069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02293119T ATE277864T1 (de) | 2001-12-28 | 2002-12-17 | Verfahren zum verstärken einer mechanischen mikrostruktur |
Country Status (6)
Country | Link |
---|---|
US (1) | US6878566B2 (de) |
EP (1) | EP1325886B1 (de) |
JP (1) | JP4464042B2 (de) |
AT (1) | ATE277864T1 (de) |
DE (1) | DE60201408T2 (de) |
FR (1) | FR2834282B1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7098117B2 (en) * | 2002-10-18 | 2006-08-29 | The Regents Of The University Of Michigan | Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices |
US6930368B2 (en) * | 2003-07-31 | 2005-08-16 | Hewlett-Packard Development Company, L.P. | MEMS having a three-wafer structure |
US6949807B2 (en) * | 2003-12-24 | 2005-09-27 | Honeywell International, Inc. | Signal routing in a hermetically sealed MEMS device |
US7238999B2 (en) * | 2005-01-21 | 2007-07-03 | Honeywell International Inc. | High performance MEMS packaging architecture |
US7808061B2 (en) * | 2006-07-28 | 2010-10-05 | Hewlett-Packard Development Company, L.P. | Multi-die apparatus including moveable portions |
US8987840B2 (en) * | 2011-02-01 | 2015-03-24 | Honeywell International Inc. | Edge-mounted sensor |
US9630837B1 (en) * | 2016-01-15 | 2017-04-25 | Taiwan Semiconductor Manufacturing Company Ltd. | MEMS structure and manufacturing method thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5476819A (en) * | 1993-07-26 | 1995-12-19 | Litton Systems, Inc. | Substrate anchor for undercut silicon on insulator microstructures |
EP0734589B1 (de) * | 1993-12-13 | 1998-03-25 | Honeywell Inc. | Integrierte silizium-vakuum-mikropackung für infrarot-geräte |
DE19536250A1 (de) * | 1995-09-28 | 1997-04-03 | Siemens Ag | Mikroelektronischer, integrierter Sensor und Verfahren zur Herstellung des Sensors |
DE19536228B4 (de) * | 1995-09-28 | 2005-06-30 | Infineon Technologies Ag | Mikroelektronischer, integrierter Sensor und Verfahren zur Herstellung des Sensors |
KR100276429B1 (ko) * | 1998-09-07 | 2000-12-15 | 정선종 | 미소 진공 구조체의 제작방법 |
FR2785449B1 (fr) * | 1998-10-29 | 2002-11-29 | Commissariat Energie Atomique | Systeme d'assemblage de substrats a zones d'accrochage pourvues de cavites |
-
2001
- 2001-12-28 FR FR0117014A patent/FR2834282B1/fr not_active Expired - Fee Related
-
2002
- 2002-12-17 AT AT02293119T patent/ATE277864T1/de not_active IP Right Cessation
- 2002-12-17 EP EP02293119A patent/EP1325886B1/de not_active Expired - Lifetime
- 2002-12-17 DE DE60201408T patent/DE60201408T2/de not_active Expired - Lifetime
- 2002-12-27 JP JP2002380337A patent/JP4464042B2/ja not_active Expired - Lifetime
- 2002-12-27 US US10/330,644 patent/US6878566B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP2003287551A (ja) | 2003-10-10 |
FR2834282B1 (fr) | 2004-02-27 |
JP4464042B2 (ja) | 2010-05-19 |
US20030166310A1 (en) | 2003-09-04 |
EP1325886B1 (de) | 2004-09-29 |
FR2834282A1 (fr) | 2003-07-04 |
US6878566B2 (en) | 2005-04-12 |
DE60201408D1 (de) | 2004-11-04 |
DE60201408T2 (de) | 2006-02-16 |
EP1325886A1 (de) | 2003-07-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |