ATE235796T1 - Nachbehandlung von kupfer auf gedruckten schaltungsplatten - Google Patents

Nachbehandlung von kupfer auf gedruckten schaltungsplatten

Info

Publication number
ATE235796T1
ATE235796T1 AT99933653T AT99933653T ATE235796T1 AT E235796 T1 ATE235796 T1 AT E235796T1 AT 99933653 T AT99933653 T AT 99933653T AT 99933653 T AT99933653 T AT 99933653T AT E235796 T1 ATE235796 T1 AT E235796T1
Authority
AT
Austria
Prior art keywords
copper
printed circuit
post
circuit boards
conversion coating
Prior art date
Application number
AT99933653T
Other languages
German (de)
English (en)
Inventor
Peter T Mcgrath
Abayomi Owei
Saeed Sarder
Eric Yakobson
Original Assignee
Frys Metals Inc Dba Alpha Metals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Frys Metals Inc Dba Alpha Metals Inc filed Critical Frys Metals Inc Dba Alpha Metals Inc
Application granted granted Critical
Publication of ATE235796T1 publication Critical patent/ATE235796T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT99933653T 1998-07-01 1999-07-01 Nachbehandlung von kupfer auf gedruckten schaltungsplatten ATE235796T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9133998P 1998-07-01 1998-07-01
PCT/US1999/014983 WO2000002426A1 (en) 1998-07-01 1999-07-01 Post-treatment for copper on printed circuit boards

Publications (1)

Publication Number Publication Date
ATE235796T1 true ATE235796T1 (de) 2003-04-15

Family

ID=22227266

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99933653T ATE235796T1 (de) 1998-07-01 1999-07-01 Nachbehandlung von kupfer auf gedruckten schaltungsplatten

Country Status (7)

Country Link
EP (1) EP1097618B1 (https=)
JP (1) JP4242566B2 (https=)
KR (1) KR100592746B1 (https=)
AT (1) ATE235796T1 (https=)
CA (1) CA2335816A1 (https=)
DE (1) DE69906301T2 (https=)
WO (1) WO2000002426A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1289354B1 (de) * 2001-09-01 2005-11-30 TRUMPF LASERTECHNIK GmbH Verfahren zum Herstellen von Löchern in einer Mehrlagenleiterplatte
JP4773399B2 (ja) * 2007-05-18 2011-09-14 矢崎総業株式会社 スズまたはスズ合金めっき層の定量分析方法
KR101663112B1 (ko) * 2014-01-13 2016-10-06 (주)켐프로스 통신용 ｒｆ 필터에 적용된 마그네슘 합금용 구리표면 부식방지제 조성물 및 처리방법
CN111954378B (zh) * 2020-07-20 2024-07-09 上海空间电源研究所 一种铜质焊盘表面铜氧化层还原修复剂及常温原位还原修复方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
US5261154A (en) * 1991-07-22 1993-11-16 Macdermid, Incorporated Process for fabricating multilayer printed circuits
GB9425090D0 (en) * 1994-12-12 1995-02-08 Alpha Metals Ltd Copper coating

Also Published As

Publication number Publication date
DE69906301D1 (de) 2003-04-30
KR100592746B1 (ko) 2006-06-26
KR20010053363A (ko) 2001-06-25
EP1097618B1 (en) 2003-03-26
EP1097618A1 (en) 2001-05-09
JP2002520827A (ja) 2002-07-09
JP4242566B2 (ja) 2009-03-25
CA2335816A1 (en) 2000-01-13
WO2000002426A1 (en) 2000-01-13
DE69906301T2 (de) 2004-01-22

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties