ATE141740T1 - Vorrichtung zur bearbeitung eines feststoffes - Google Patents

Vorrichtung zur bearbeitung eines feststoffes

Info

Publication number
ATE141740T1
ATE141740T1 AT92910430T AT92910430T ATE141740T1 AT E141740 T1 ATE141740 T1 AT E141740T1 AT 92910430 T AT92910430 T AT 92910430T AT 92910430 T AT92910430 T AT 92910430T AT E141740 T1 ATE141740 T1 AT E141740T1
Authority
AT
Austria
Prior art keywords
pct
jet
sec
date
solid
Prior art date
Application number
AT92910430T
Other languages
English (en)
Inventor
Eugene Zorina
Vladimir Ivanov
Pavel Kulik
Alexis Logoshin
Alim Tchabanov
George Pavlov
Vecleslav Shvetchov
Original Assignee
Opa Overseas Publishers Ass Am
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Opa Overseas Publishers Ass Am filed Critical Opa Overseas Publishers Ass Am
Application granted granted Critical
Publication of ATE141740T1 publication Critical patent/ATE141740T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/36—Circuit arrangements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/3494—Means for controlling discharge parameters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/32—Plasma torches using an arc
    • H05H1/34—Details, e.g. electrodes, nozzles
    • H05H1/40—Details, e.g. electrodes, nozzles using applied magnetic fields, e.g. for focusing or rotating the arc

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Sink And Installation For Waste Water (AREA)
  • Polarising Elements (AREA)
  • Treatment Of Sludge (AREA)
  • Processing Of Meat And Fish (AREA)
AT92910430T 1991-05-24 1992-05-19 Vorrichtung zur bearbeitung eines feststoffes ATE141740T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU914935913A RU2030811C1 (ru) 1991-05-24 1991-05-24 Установка для плазменной обработки твердого тела

Publications (1)

Publication Number Publication Date
ATE141740T1 true ATE141740T1 (de) 1996-09-15

Family

ID=21574339

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92910430T ATE141740T1 (de) 1991-05-24 1992-05-19 Vorrichtung zur bearbeitung eines feststoffes

Country Status (8)

Country Link
US (1) US5474642A (de)
EP (1) EP0586441B1 (de)
JP (1) JPH07508855A (de)
AT (1) ATE141740T1 (de)
DE (1) DE69213004T2 (de)
GB (1) GB2256939B (de)
RU (1) RU2030811C1 (de)
WO (1) WO1992021220A1 (de)

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RU2075135C1 (ru) * 1995-01-13 1997-03-10 Акционерное общество Научно-производственная фирма "А3" Установка для плазмоструйной обработки пластин
JP3521587B2 (ja) * 1995-02-07 2004-04-19 セイコーエプソン株式会社 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法
WO1996032742A1 (fr) * 1995-04-11 1996-10-17 Zakrytoe Aktsionernoe Obschestvo Nauchno-Proizvodstvennaya Firma 'az' Installation destinee au traitement par flux plasmiques de plaques
US6365235B2 (en) * 1995-11-13 2002-04-02 Tepla Ag Surface treatment method and device therefor
DE69706983T2 (de) * 1996-05-31 2002-05-29 Ipec Precision, Inc.(N.D.Ges.D.Staates Delaware) Anlage zum behandeln von substraten mit einem plasmastrahl
KR20000016136A (ko) 1996-05-31 2000-03-25 피터 무몰라 플라즈마 제트로 제품을 처리하는 방법
US6173672B1 (en) * 1997-06-06 2001-01-16 Celestech, Inc. Diamond film deposition on substrate arrays
US6406760B1 (en) 1996-06-10 2002-06-18 Celestech, Inc. Diamond film deposition on substrate arrays
US5767627A (en) * 1997-01-09 1998-06-16 Trusi Technologies, Llc Plasma generation and plasma processing of materials
US6139678A (en) * 1997-11-20 2000-10-31 Trusi Technologies, Llc Plasma processing methods and apparatus
DE19807086A1 (de) * 1998-02-20 1999-08-26 Fraunhofer Ges Forschung Verfahren zum Beschichten von Oberflächen eines Substrates, Vorrichtung zur Durchführung des Verfahrens, Schichtsystem sowie beschichtetes Substrat
EP1080942B2 (de) * 1999-08-31 2009-10-14 Agfa Graphics N.V. Verfahren zur Erneuerung einer Flachdruckplatte
US6467297B1 (en) 2000-10-12 2002-10-22 Jetek, Inc. Wafer holder for rotating and translating wafers
US6492613B2 (en) * 2000-05-15 2002-12-10 Jetek, Inc. System for precision control of the position of an atmospheric plasma
US6423923B1 (en) 2000-08-04 2002-07-23 Tru-Si Technologies, Inc. Monitoring and controlling separate plasma jets to achieve desired properties in a combined stream
EP1205962A1 (de) * 2000-11-10 2002-05-15 Jobin Yvon S.A. Verfahren zur Plasmazustandsüberwachung und -kontrolle in einem Plasmaspektrometer sowie Spektrometer zur Durchführung dieses Verfahrens
US6749764B1 (en) * 2000-11-14 2004-06-15 Tru-Si Technologies, Inc. Plasma processing comprising three rotational motions of an article being processed
US7591957B2 (en) 2001-01-30 2009-09-22 Rapt Industries, Inc. Method for atmospheric pressure reactive atom plasma processing for surface modification
US7510664B2 (en) * 2001-01-30 2009-03-31 Rapt Industries, Inc. Apparatus and method for atmospheric pressure reactive atom plasma processing for shaping of damage free surfaces
US6660177B2 (en) 2001-11-07 2003-12-09 Rapt Industries Inc. Apparatus and method for reactive atom plasma processing for material deposition
US6936546B2 (en) * 2002-04-26 2005-08-30 Accretech Usa, Inc. Apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
US20040173316A1 (en) * 2003-03-07 2004-09-09 Carr Jeffrey W. Apparatus and method using a microwave source for reactive atom plasma processing
US7371992B2 (en) 2003-03-07 2008-05-13 Rapt Industries, Inc. Method for non-contact cleaning of a surface
WO2009052161A1 (en) * 2007-10-19 2009-04-23 E. I. Du Pont De Nemours And Company Polyacetal compositions with improved tribological properties
JP6146807B2 (ja) * 2013-05-30 2017-06-14 学校法人文理学園 プラズマ処理装置及びプラズマ処理方法
US9633862B2 (en) * 2015-08-31 2017-04-25 Kabushiki Kaisha Toshiba Semiconductor manufacturing apparatus and semiconductor manufacturing method

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US3278796A (en) * 1962-06-15 1966-10-11 Hitachi Ltd Magnetically controllable plasma flame generator
US4021675A (en) * 1973-02-20 1977-05-03 Hughes Aircraft Company System for controlling ion implantation dosage in electronic materials
US4487162A (en) * 1980-11-25 1984-12-11 Cann Gordon L Magnetoplasmadynamic apparatus for the separation and deposition of materials
JPS57205769A (en) * 1981-06-15 1982-12-16 Fuji Electric Corp Res & Dev Ltd Base material reproducting method of electrophotographic receptor
US4609810A (en) * 1984-06-25 1986-09-02 The Perkin-Elmer Corporation Apparatus for controlling a plasma
US4675530A (en) * 1985-07-11 1987-06-23 Eaton Corporation Charge density detector for beam implantation
DE68926923T2 (de) * 1988-03-16 1996-12-19 Hitachi Ltd Mikrowellenionenquelle
JPH0223613A (ja) * 1988-07-12 1990-01-25 Tokyo Ohka Kogyo Co Ltd プラズマ反応装置
US5062364A (en) * 1989-03-29 1991-11-05 Presstek, Inc. Plasma-jet imaging method
US5091049A (en) * 1989-06-13 1992-02-25 Plasma & Materials Technologies, Inc. High density plasma deposition and etching apparatus
US5000771A (en) * 1989-12-29 1991-03-19 At&T Bell Laboratories Method for manufacturing an article comprising a refractory dielectric body
US5120703A (en) * 1990-04-17 1992-06-09 Alfred University Process for preparing oxide superconducting films by radio-frequency generated aerosol-plasma deposition in atmosphere
JP2840699B2 (ja) * 1990-12-12 1998-12-24 株式会社 半導体エネルギー研究所 被膜形成装置及び被膜形成方法
US5336355A (en) * 1991-12-13 1994-08-09 Hughes Aircraft Company Methods and apparatus for confinement of a plasma etch region for precision shaping of surfaces of substances and films
US5290382A (en) * 1991-12-13 1994-03-01 Hughes Aircraft Company Methods and apparatus for generating a plasma for "downstream" rapid shaping of surfaces of substrates and films

Also Published As

Publication number Publication date
RU2030811C1 (ru) 1995-03-10
GB2256939A (en) 1992-12-23
DE69213004D1 (de) 1996-09-26
WO1992021220A1 (en) 1992-11-26
US5474642A (en) 1995-12-12
EP0586441A1 (de) 1994-03-16
JPH07508855A (ja) 1995-09-28
DE69213004T2 (de) 1996-12-19
GB2256939B (en) 1994-07-06
GB9115179D0 (en) 1991-08-28
EP0586441B1 (de) 1996-08-21

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties