ATE100218T1 - Lichtempfindliche waesserig entwickelbare, keramische beschichtungszusammensetzung. - Google Patents
Lichtempfindliche waesserig entwickelbare, keramische beschichtungszusammensetzung.Info
- Publication number
- ATE100218T1 ATE100218T1 AT89109703T AT89109703T ATE100218T1 AT E100218 T1 ATE100218 T1 AT E100218T1 AT 89109703 T AT89109703 T AT 89109703T AT 89109703 T AT89109703 T AT 89109703T AT E100218 T1 ATE100218 T1 AT E100218T1
- Authority
- AT
- Austria
- Prior art keywords
- binder
- particles
- weight ratio
- weight
- coating composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
- C08L33/12—Homopolymers or copolymers of methyl methacrylate
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/106—Binder containing
- Y10S430/111—Polymer of unsaturated acid or ester
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ceramic Engineering (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Paints Or Removers (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/200,401 US4912019A (en) | 1988-05-31 | 1988-05-31 | Photosensitive aqueous developable ceramic coating composition |
EP89109703A EP0347616B1 (de) | 1988-05-31 | 1989-05-30 | Lichtempfindliche wässerig entwickelbare, keramische Beschichtungszusammensetzung |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE100218T1 true ATE100218T1 (de) | 1994-01-15 |
Family
ID=22741575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT89109703T ATE100218T1 (de) | 1988-05-31 | 1989-05-30 | Lichtempfindliche waesserig entwickelbare, keramische beschichtungszusammensetzung. |
Country Status (7)
Country | Link |
---|---|
US (1) | US4912019A (de) |
EP (1) | EP0347616B1 (de) |
JP (1) | JP2723975B2 (de) |
KR (1) | KR890017303A (de) |
CN (1) | CN1037212C (de) |
AT (1) | ATE100218T1 (de) |
DE (1) | DE68912212T2 (de) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5032490A (en) * | 1989-08-21 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Photosensitive aqueous developable copper conductor composition |
US5032478A (en) * | 1989-08-21 | 1991-07-16 | E. I. Du Pont De Nemours And Company | Photosensitive aqueous developable gold conductor composition |
US5049480A (en) * | 1990-02-20 | 1991-09-17 | E. I. Du Pont De Nemours And Company | Photosensitive aqueous developable silver conductor composition |
EP0569762A1 (de) * | 1992-05-07 | 1993-11-18 | E.I. Du Pont De Nemours And Company | Verfahren zur Herstellung von Mustern in dielektrischen photohärtbaren Schichten |
DE69324640T2 (de) * | 1992-09-23 | 1999-10-14 | Du Pont | Photoempfindliches dielektrisches Schichtmaterial und untereinander verbundene Mehrschichtschaltungen |
US5563019A (en) | 1994-06-30 | 1996-10-08 | E. I. Du Pont De Nemours And Company | Donor element for laser-induced thermal transfer |
TW367504B (en) * | 1996-05-21 | 1999-08-21 | Du Pont | Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer |
KR100609364B1 (ko) * | 1997-03-25 | 2006-08-08 | 이 아이 듀폰 디 네모아 앤드 캄파니 | 디스플레이 패널용 필드 이미터 캐소드 배면판 구조물, 그제조 방법, 및 그를 포함하는 디스플레이 패널 |
EP1008909B1 (de) | 1998-12-11 | 2003-08-13 | E.I. Dupont De Nemours And Company | Zusammensetzung für ein Silber enthaltendes, lichtempfindliches, leitendes Band und das damit behandelte Band |
JP2000275826A (ja) * | 1999-03-25 | 2000-10-06 | Murata Mfg Co Ltd | ペースト組成物及びそれを用いた回路基板 |
US20060208621A1 (en) * | 1999-09-21 | 2006-09-21 | Amey Daniel I Jr | Field emitter cathode backplate structures for display panels |
US7052824B2 (en) * | 2000-06-30 | 2006-05-30 | E. I. Du Pont De Nemours And Company | Process for thick film circuit patterning |
US6762009B2 (en) * | 2001-10-12 | 2004-07-13 | E. I. Du Pont De Nemours And Company | Aqueous developable photoimageable thick film compositions with photospeed enhancer |
US6994948B2 (en) * | 2001-10-12 | 2006-02-07 | E.I. Du Pont De Nemours And Company, Inc. | Aqueous developable photoimageable thick film compositions |
US20030124461A1 (en) * | 2001-10-12 | 2003-07-03 | Suess Terry R. | Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
EP1507667A1 (de) * | 2002-05-17 | 2005-02-23 | E.I. Du Pont De Nemours And Company | Planarisierendes element für thermisches drucken eines farbfilters |
JP4372493B2 (ja) * | 2003-08-28 | 2009-11-25 | Tdk株式会社 | セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法 |
US7618704B2 (en) * | 2003-09-29 | 2009-11-17 | E.I. Du Pont De Nemours And Company | Spin-printing of electronic and display components |
JP4507873B2 (ja) * | 2003-12-18 | 2010-07-21 | 東レ株式会社 | 感光性セラミックス組成物 |
US7435763B2 (en) * | 2004-04-02 | 2008-10-14 | Hewlett-Packard Development Company, L.P. | Solid freeform compositions, methods of application thereof, and systems for use thereof |
KR100611446B1 (ko) * | 2004-05-18 | 2006-08-10 | 제일모직주식회사 | 수성 현상가능한 감광성 코팅액 조성물의 제조방법 |
US20060027307A1 (en) * | 2004-08-03 | 2006-02-09 | Bidwell Larry A | Method of application of a dielectric sheet and photosensitive dielectric composition(s) and tape(s) used therein |
US7135267B2 (en) * | 2004-08-06 | 2006-11-14 | E. I. Du Pont De Nemours And Company | Aqueous developable photoimageable compositions for use in photo-patterning methods |
US8143326B2 (en) * | 2004-09-28 | 2012-03-27 | E.I. Du Pont De Nemours And Company | Spin-printing of electronic and display components |
JP5108239B2 (ja) * | 2005-03-09 | 2012-12-26 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 黒色導電性組成物、黒色電極、およびその形成方法 |
US7569165B2 (en) | 2005-03-09 | 2009-08-04 | E. I. Du Pont De Nemours And Company | Black conductive compositions, black electrodes, and methods of forming thereof |
US8252385B2 (en) * | 2005-03-25 | 2012-08-28 | E I Du Pont De Nemours And Company | Spin-printing of electronic and display components |
US7214466B1 (en) | 2005-12-14 | 2007-05-08 | E. I. Du Pont De Nemours And Company | Cationically polymerizable photoimageable thick film compositions, electrodes, and methods of forming thereof |
US7645564B2 (en) * | 2006-03-03 | 2010-01-12 | Haixin Yang | Polymer solutions, aqueous developable thick film compositions, processes of making and electrodes formed thereof |
JP5200591B2 (ja) * | 2007-03-14 | 2013-06-05 | 東レ株式会社 | 感光性ペースト |
EP2980693A4 (de) | 2013-03-29 | 2016-12-21 | Seiko Epson Corp | Drucksteuerungsvorrichtung, druckvorrichtung, datenverarbeitungsverfahren und einstellverfahren für drucksteuerungsvorrichtung |
JP6409855B2 (ja) * | 2016-12-15 | 2018-10-24 | セイコーエプソン株式会社 | 印刷装置、印刷装置の制御方法、及び、プログラム |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4273857A (en) * | 1976-01-30 | 1981-06-16 | E. I. Du Pont De Nemours And Company | Polymeric binders for aqueous processable photopolymer compositions |
US4229517A (en) * | 1976-11-13 | 1980-10-21 | E. I. Du Pont De Nemours And Company | Dot-etchable photopolymerizable elements |
US4293635A (en) * | 1980-05-27 | 1981-10-06 | E. I. Du Pont De Nemours And Company | Photopolymerizable composition with polymeric binder |
JPS5749105A (en) * | 1980-09-05 | 1982-03-20 | Nippon Electric Co | Insulating paste composition |
JPS5749106A (en) * | 1980-09-05 | 1982-03-20 | Nippon Electric Co | Insulating paste composition |
JPS58190867A (ja) * | 1982-04-26 | 1983-11-07 | 鳴海製陶株式会社 | セラミツクテ−プの製造方法 |
US4539286A (en) * | 1983-06-06 | 1985-09-03 | Dynachem Corporation | Flexible, fast processing, photopolymerizable composition |
US4536535A (en) * | 1983-06-07 | 1985-08-20 | E. I. Du Pont De Nemours And Company | Castable ceramic compositions |
US4613560A (en) * | 1984-12-28 | 1986-09-23 | E. I. Du Pont De Nemours And Company | Photosensitive ceramic coating composition |
US4724021A (en) * | 1986-07-23 | 1988-02-09 | E. I. Du Pont De Nemours And Company | Method for making porous bottom-layer dielectric composite structure |
-
1988
- 1988-05-31 US US07/200,401 patent/US4912019A/en not_active Expired - Lifetime
-
1989
- 1989-05-30 KR KR1019890007448A patent/KR890017303A/ko not_active Application Discontinuation
- 1989-05-30 AT AT89109703T patent/ATE100218T1/de not_active IP Right Cessation
- 1989-05-30 EP EP89109703A patent/EP0347616B1/de not_active Expired - Lifetime
- 1989-05-30 DE DE89109703T patent/DE68912212T2/de not_active Expired - Lifetime
- 1989-05-31 JP JP1138981A patent/JP2723975B2/ja not_active Expired - Lifetime
- 1989-05-31 CN CN89104484A patent/CN1037212C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4912019A (en) | 1990-03-27 |
CN1037212C (zh) | 1998-01-28 |
EP0347616B1 (de) | 1994-01-12 |
JPH0225848A (ja) | 1990-01-29 |
JP2723975B2 (ja) | 1998-03-09 |
CN1039488A (zh) | 1990-02-07 |
KR890017303A (ko) | 1989-12-15 |
DE68912212T2 (de) | 1994-04-28 |
DE68912212D1 (de) | 1994-02-24 |
EP0347616A1 (de) | 1989-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |