ATA23196A - Verbundbauteil - Google Patents

Verbundbauteil

Info

Publication number
ATA23196A
ATA23196A AT0023196A AT23196A ATA23196A AT A23196 A ATA23196 A AT A23196A AT 0023196 A AT0023196 A AT 0023196A AT 23196 A AT23196 A AT 23196A AT A23196 A ATA23196 A AT A23196A
Authority
AT
Austria
Prior art keywords
composite component
composite
component
Prior art date
Application number
AT0023196A
Other languages
English (en)
Other versions
AT405039B (de
Inventor
Theodore Nicolas Dipl Schmitt
Helmut Dr Nechansky
Original Assignee
Electrovac
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovac filed Critical Electrovac
Priority to AT0023196A priority Critical patent/AT405039B/de
Priority to GB9702181A priority patent/GB2309924B/en
Priority to DE19704357A priority patent/DE19704357A1/de
Priority to IT97MI000233A priority patent/IT1290269B1/it
Priority to FR9701372A priority patent/FR2744658B1/fr
Priority to US08/796,230 priority patent/US5985464A/en
Publication of ATA23196A publication Critical patent/ATA23196A/de
Application granted granted Critical
Publication of AT405039B publication Critical patent/AT405039B/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D19/00—Casting in, on, or around objects which form part of the product
    • B22D19/04—Casting in, on, or around objects which form part of the product for joining parts
    • C—CHEMISTRY; METALLURGY
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/006—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of metals or metal salts
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Products (AREA)
  • Joining Of Building Structures In Genera (AREA)
  • Laminated Bodies (AREA)
AT0023196A 1996-02-08 1996-02-08 Verbundbauteil AT405039B (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AT0023196A AT405039B (de) 1996-02-08 1996-02-08 Verbundbauteil
GB9702181A GB2309924B (en) 1996-02-08 1997-02-03 Composite component
DE19704357A DE19704357A1 (de) 1996-02-08 1997-02-05 Verbundbauteil
IT97MI000233A IT1290269B1 (it) 1996-02-08 1997-02-06 Elemento di giunzione per costruzioni
FR9701372A FR2744658B1 (fr) 1996-02-08 1997-02-06 Piece composite metal-substance non metallique
US08/796,230 US5985464A (en) 1996-02-08 1997-02-06 Composite structure, and method of making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0023196A AT405039B (de) 1996-02-08 1996-02-08 Verbundbauteil

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ATA23196A true ATA23196A (de) 1998-09-15
AT405039B AT405039B (de) 1999-04-26

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US (1) US5985464A (de)
AT (1) AT405039B (de)
DE (1) DE19704357A1 (de)
FR (1) FR2744658B1 (de)
GB (1) GB2309924B (de)
IT (1) IT1290269B1 (de)

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US6378755B1 (en) * 2000-11-08 2002-04-30 General Electric Company Joined structure utilizing a ceramic foam bonding element, and its fabrication
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JP5011556B2 (ja) * 2007-11-09 2012-08-29 イビデン株式会社 炭素系複合部材
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DE102012102611B4 (de) * 2012-02-15 2017-07-27 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
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DE102012015944A1 (de) * 2012-08-10 2014-02-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Bauteils mit einer Verbundstruktur sowie mit dem Verfahren herstellbares Bauteil
US10183358B2 (en) * 2014-12-27 2019-01-22 Cooler Master Co., Ltd. Bonded functionally graded material structure for heat transfer
US10882130B2 (en) 2018-04-17 2021-01-05 Watlow Electric Manufacturing Company Ceramic-aluminum assembly with bonding trenches
WO2020044594A1 (ja) * 2018-08-28 2020-03-05 三菱マテリアル株式会社 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、及び、絶縁回路基板の製造方法
CN114679874A (zh) * 2020-12-24 2022-06-28 富联裕展科技(深圳)有限公司 金属复合件、金属复合件的制备方法及电子装置的壳体
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Also Published As

Publication number Publication date
GB9702181D0 (en) 1997-03-26
US5985464A (en) 1999-11-16
FR2744658A1 (fr) 1997-08-14
DE19704357A1 (de) 1997-11-06
ITMI970233A1 (it) 1998-08-06
IT1290269B1 (it) 1998-10-22
GB2309924A (en) 1997-08-13
GB2309924B (en) 1999-12-29
AT405039B (de) 1999-04-26
FR2744658B1 (fr) 2000-05-05

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