ATA1017674A - Verfahren zur herstellung von gedruckten schaltungen - Google Patents

Verfahren zur herstellung von gedruckten schaltungen

Info

Publication number
ATA1017674A
ATA1017674A AT1017674A AT1017674A ATA1017674A AT A1017674 A ATA1017674 A AT A1017674A AT 1017674 A AT1017674 A AT 1017674A AT 1017674 A AT1017674 A AT 1017674A AT A1017674 A ATA1017674 A AT A1017674A
Authority
AT
Austria
Prior art keywords
printed circuits
manufacturing printed
manufacturing
circuits
printed
Prior art date
Application number
AT1017674A
Other languages
German (de)
English (en)
Inventor
Peter Ing Blaha
Josef Drasch
Original Assignee
Eumig
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eumig filed Critical Eumig
Priority to AT1017674A priority Critical patent/ATA1017674A/de
Priority to NL7514723A priority patent/NL7514723A/xx
Priority to DE19752556826 priority patent/DE2556826A1/de
Priority to IT09657/75A priority patent/IT1068815B/it
Priority to BE162933A priority patent/BE836866A/xx
Priority to SE7514432A priority patent/SE7514432L/sv
Priority to FR7539075A priority patent/FR2295678A1/fr
Publication of ATA1017674A publication Critical patent/ATA1017674A/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
AT1017674A 1974-12-19 1974-12-19 Verfahren zur herstellung von gedruckten schaltungen ATA1017674A (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AT1017674A ATA1017674A (de) 1974-12-19 1974-12-19 Verfahren zur herstellung von gedruckten schaltungen
NL7514723A NL7514723A (nl) 1974-12-19 1975-12-17 Werkwijze voor het vervaardigen van gedrukte schakelingen en een onder toepassing van deze werkwijze vervaardigde gedrukte schakeling.
DE19752556826 DE2556826A1 (de) 1974-12-19 1975-12-17 Verfahren zur herstellung von gedruckten schaltungen und nach diesem verfahren hergestellte gedruckte schaltung
IT09657/75A IT1068815B (it) 1974-12-19 1975-12-18 Procedimento per fabbricare circuiti stampati e circuitio stampa to ottenuto secondo questo procedimento
BE162933A BE836866A (fr) 1974-12-19 1975-12-19 Procede de fabrication de circuits imprimes et circuits imprimes fabriques suivant ce procede
SE7514432A SE7514432L (sv) 1974-12-19 1975-12-19 Sett att framstella kretskort
FR7539075A FR2295678A1 (fr) 1974-12-19 1975-12-19 Procede de fabrication de circuits imprimes et circuit imprime fabrique selon ce procede

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT1017674A ATA1017674A (de) 1974-12-19 1974-12-19 Verfahren zur herstellung von gedruckten schaltungen

Publications (1)

Publication Number Publication Date
ATA1017674A true ATA1017674A (de) 1976-06-15

Family

ID=3620430

Family Applications (1)

Application Number Title Priority Date Filing Date
AT1017674A ATA1017674A (de) 1974-12-19 1974-12-19 Verfahren zur herstellung von gedruckten schaltungen

Country Status (7)

Country Link
AT (1) ATA1017674A (sv)
BE (1) BE836866A (sv)
DE (1) DE2556826A1 (sv)
FR (1) FR2295678A1 (sv)
IT (1) IT1068815B (sv)
NL (1) NL7514723A (sv)
SE (1) SE7514432L (sv)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0194655B1 (en) * 1985-03-14 1989-05-17 Kabushiki Kaisha Toshiba Printed circuit board and method of manufacturing the same
GB8602330D0 (en) * 1986-01-30 1986-03-05 Ici Plc Multilayer systems
US5316831A (en) * 1991-05-08 1994-05-31 Fuji Electric Co., Ltd. Metallic printed board
GB9803236D0 (en) * 1998-02-17 1998-04-08 Pressac Interconnect Limited Printed circuit assembly and method of making the same
WO2005011345A1 (de) * 2003-07-17 2005-02-03 Ksg Leiterplatten Gmbh Schichtanordnung für ein mit elektronischen bauelementen bestückbares trägerbauteil und verfahren zur herstellung
DE10339692A1 (de) * 2003-08-28 2005-03-31 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Entwärmende Isolationsschicht
DE102005002508B4 (de) * 2004-02-13 2014-09-04 Heidelberger Druckmaschinen Ag Leiterplatte mit Oxidationsschicht
DE102004058335A1 (de) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. Substrat
EP2025209B1 (de) * 2006-06-07 2013-03-27 Ab Mikroelektronik Gesellschaft Mit Beschränkter Haftung Verfahren zur herstellung eines schaltungsträgers
DE102011108198A1 (de) * 2011-07-22 2012-03-29 Fela Holding Gmbh Metallkernleiterplatte mit Eloxalschicht

Also Published As

Publication number Publication date
SE7514432L (sv) 1976-06-21
DE2556826A1 (de) 1976-06-24
FR2295678A1 (fr) 1976-07-16
NL7514723A (nl) 1976-06-22
BE836866A (fr) 1976-04-16
IT1068815B (it) 1985-03-21

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Legal Events

Date Code Title Description
A1Z Withdrawn