AT526249B1 - Method for temperature control of building rooms - Google Patents

Abstract

The invention relates to a method for controlling the temperature of building rooms (1) and/or for preparing hot water in building rooms (1) with a temperature control circuit (2) comprising a temperature control fluid, a flow (3) and a return (4) and running in an environment (U). , in which a temperature control source (5) and at least one heat pump (7) assigned to a building room (1) are provided, described. In order to be able to achieve a desired target temperature for temperature control of building rooms (1) and/or for hot water preparation in building rooms in the most energy-saving manner possible, it is proposed that the temperature control fluid from the temperature control source (5) is brought to a flow temperature Tv, which corresponds to an average ambient temperature Tu + x °C corresponds, and that the temperature control fluid is brought by the heat pump (7) to a return temperature Tr, which corresponds to the mean ambient temperature Tu - x °C, where |x| is less than or equal to 15.

Description

Description

The invention relates to a method for temperature control of building rooms and/or for hot water treatment in building rooms, in particular building rooms in low-energy houses, with a temperature control circuit comprising a temperature control fluid, a flow and a return and running in an environment, in which a temperature control source and at least one heat pump assigned to a building room is provided.

[0002] From CH708598B1 a method for temperature control of building rooms and for hot water treatment in building rooms is known. For this purpose, a temperature control fluid flowing in a temperature control circuit is heated to a flow temperature by a central heating device as a temperature control source and conveyed to decentralized heat pumps via distribution lines. The decentralized heat pumps extract heat energy from the temperature control fluid, which lowers the flow temperature of the temperature control fluid to a return temperature. By supplying additional work, the working medium of the heat pump can be raised to a target temperature for hot water preparation or for heating a building room to which the respective heat pump is assigned. Although a certain amount of energy efficiency can be achieved when the target temperature is reached by using heat pumps, distribution losses arise, especially when distributing the temperature control fluid to the heat pumps, since heat is released into the environment during transport through the distribution lines. As a result, the heat pumps have to be operated with correspondingly more energy in order to reach the desired target temperature based on the heat energy provided via the temperature control fluid.

The invention is therefore based on the object of proposing a method of the type described at the outset, in which a desired target temperature for temperature control of building rooms and/or for hot water treatment in building rooms can be achieved in the most energy-saving manner possible. The invention is also based on the object of proposing a device with which a desired target temperature for temperature control of building rooms and/or for hot water preparation in building rooms can be achieved in the most energy-saving manner possible.

The invention solves the problem in that the temperature control fluid is brought from the temperature control source to a flow temperature T, which corresponds to an average ambient temperature Tu + x ° C of the environment, and in that the temperature control fluid from the heat pump is brought to a return temperature T, is brought, which corresponds to the average ambient temperature T, - x °C of the environment, where |x| is less than or equal to 15, preferably 1 to 15, more preferably 1 to 10. As a result of the measures according to the invention, the distribution losses, i.e. the losses during the transport of the temperature control fluid from the temperature control source to the heat pumps through the distribution lines of the temperature control circuit, can be kept extremely low, since the force driving the heat transfer, the temperature gradient between the temperature control fluid and the environment, is significantly reduced . In this way, the flow temperature T, which is generated by the temperature control source, can be conveyed to the heat pump with almost no loss, so that as soon as the system is in equilibrium, the heat pump is only supplied with energy to raise the flow temperature T to the target temperature and not with energy to compensate for the distribution losses. According to the invention, the temperature control fluid in the temperature control circuit is reduced or increased by the heat pump by essentially the same amount as the temperature control fluid is increased or decreased by the temperature control source, the amount of reduction or increase being in the range of less than or equal to 15, in particular 1 to 15 °C. In this way, building physics requirements can be met, so that local undercooling of the masonry and/or basement and/or soil as an environment, caused by excessive undercooling by the heat pump, and the associated formation of moisture is prevented. Preferably |x/ is in the range from 1 to 5, more preferably |x/ is in the range from 1 to 3. In addition, increasing or decreasing the temperature of the temperature control fluid by the same amount results in an energy input or energy output from the balancing limits prevented, since averaged none

Heating or cooling of the environment, for example the entire masonry, takes place. A temperature control source and several heat pumps, each assigned to a building room, can preferably be provided in the temperature control circuit. For the purposes of the invention, the assignment of a heat pump to a building space does not necessarily mean that the heat pump is arranged in the building space; rather, it is sufficient that the heat pump is arranged in such a way that it can transfer or remove heat from the building space. This is possible, for example, if the heat pump is arranged in a riser leading to this building space. Basically, the specified ranges of |x| apply for the steady-state system and can vary or be higher, particularly when starting off.

The temperature control source can be a heat source or a cold source. For example, the temperature control source can be a waste heat source, an electrical heater, a fuel heater, a geothermal heater or a solar heater. Particularly high energy efficiency can be achieved if the temperature control source itself is also a heat pump. The temperature control source can be powered by a photovoltaic system. The temperature control source heats the temperature control fluid to a flow temperature T, which can be specified by a control unit, after which the temperature control fluid, for example water, is pumped via a pump through the temperature control circuit to the heat pumps. The heat circuit can comprise a central heat circuit, in which the temperature control source is arranged, and one or more decentralized heat circuits, each of which is fluidly connected to the central heat circuit, and in each of which a heat pump is arranged. Alternatively, only one heat circuit can be provided, in which the heat pump or heat pumps and the temperature control source are thus connected in series. The heat pumps can each be assigned to a building room and can heat the building room itself or a hot water storage tank by absorbing the energy transported via the temperature control fluid by the heat pump, whereby the temperature of the temperature control fluid in the temperature control circuit is reduced to a return temperature T,. The thermal energy absorbed by the heat pump is converted into heating heat in a manner known from the prior art, with the flow temperature T, being raised to a target temperature by additional energy input. To heat the building space, the building space can have its own heating circuit, into which the heat absorbed by the temperature control fluid and additionally generated by the heat pump is introduced via, for example, heat exchangers. Of course, if the heat pumps operate in opposite directions, cooling can also take place, with energy from the building space being absorbed by the heat pump and released to the temperature control fluid.

The difference between the flow temperature T and return temperature T to the ambient temperature T can be in a range greater than or equal to 0 and less than or equal to 15 ° C. The definition of the ambient temperature depends on the application. If the majority of the temperature control circuit is located in the masonry as the environment, the mean internal masonry temperature can be assumed to be the mean ambient temperature. If the majority of the temperature control circuit is located in the ground as an environment, for example as in the case of a district heating network, the average earth temperature can be assumed as the average ambient temperature. The average ambient temperature T can be determined, for example, by representative measuring points, by settling the temperature control fluid without taking it off or feeding it in, or by energy balancing. The extent of heat transfer from the temperature control source to the temperature control fluid and from the temperature control fluid to the building rooms or hot water tank can be controlled by a control unit to ensure compliance with the control conditions (Ty= Tu+X, Tr= Tu - X, |x| = less than or equal to 15, or in particular 1 to 15 or 1 to 10 or preferably 1 to 5 or 1 to 3 or 1 to 2). The control unit can therefore specify x. The control unit can control the temperature control source, the heat pumps and the pump to increase or decrease the flow rates of the respective temperature control fluids or working media.

[0007] Example - Heating [0008] Tu = 18°C; x= 2°C; |x/ = 2

The temperature control source serves as a heat source and increases the temperature of the temperature control fluid to a flow temperature T of 20 ° C

(Ty= Tu+X °C = 18 °C + 2 °C). The 20°C warm temperature control fluid is conveyed via the flow to the heat pumps, which extract so much heat from the temperature control fluid that the temperature of the temperature control fluid in the return, i.e. the return temperature T, is 16°C (T, = Tu-Xx °C = 18 °C 2°C). This can be controlled by a control unit. The heat absorbed can be used in a manner known from the prior art to heat a building or a hot water storage tank. From the heat source, the temperature control fluid can then be heated from the return temperature T to the flow temperature T.

Example - Cooling

[0011] Tu = 23°C; x = -4°C; |x| = 4

The temperature control source serves as a heat sink or cold source and reduces the temperature of the temperature control fluid to a flow temperature T of 19°C (Tv = Tu+ X °C = 23°C - 4°C). The 19°C cool temperature control fluid is conveyed via the flow to the heat pumps, which transfer so much heat to the temperature control fluid that the temperature of the temperature control fluid in the return, i.e. the return temperature T, is 27°C (Tr, = Tu-x °C = 23 °C - (-4) °C). This can be controlled by a control unit. The heat given off can be used to cool a building space in a manner known from the prior art. The heat sink can then cool the temperature control fluid from the return temperature T to the flow temperature T.

[0012] So that the control conditions can be optimally adapted to the current conditions with regard to the nature of the building rooms, the temperature control circuit pipe systems and also the environmental conditions, it is proposed that the environment in which the temperature control circuit runs and/or the temperature control circuit is assigned an admissibility class and | x| is selected depending on this admissibility class. The environment in which the temperature control circuit runs can therefore be divided into several, for example 2, permissibility classes. Different admissibility classes can have different amounts of |x| be assigned. An admissibility class 1 can have an amount of |x| of less than or equal to 15, in particular 1 to 15, an admissibility class 2 can correspond to an amount of |x| of less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, more preferably less than or equal to 3, in particular 1 to 3. If the temperature control circuit is located in an external environment, for example in a soil environment, larger local temperature differences can be tolerated, so that an external environment can be assigned an admissibility class 1 and thus the amount of |x| can be less than or equal to 15, in particular 1 to 15. If the temperature control circuit is located in an indoor environment, for example in a masonry environment, then for building physics reasons only small local temperature differences are permitted, so that an indoor environment can be assigned an admissibility class 2 and thus the amount of |x| can be less than or equal to 10, preferably 1 - 10, in particular 1 to 5, more preferably 1 to 3. Alternatively or additionally, the allocation of permissibility classes can also be based on the nature of the temperature control circuit. If the temperature control circuit predominantly comprises insulated pipes, relatively lower heat losses result even with a higher temperature difference between the temperature control fluid and the ambient temperature T,. A temperature control circuit that includes insulated pipes can therefore be assigned an admissibility class 1. However, if the pipes are uninsulated, the temperature control circuit can be assigned approval class 2. There can also be 3 admissibility classes. In this case, an admissibility class 1 can be assigned an amount of |x| of less than or equal to 15, in particular 1 - 15, an admissibility class 2 corresponds to an amount of |x| of less than or equal to 10, in particular 1 to 10, and an admissibility class 3 corresponds to an amount of |x| of less than or equal to 5, in particular 1 - 5, preferably less than or equal to 3, in particular 1 to 3.

A particularly energy-efficient method results when several cascaded temperature control circuits are used, which are coupled to one another via a temperature control source, in particular via a heat pump. This can be implemented by giving the temperature

The pre-tempering circuit is preceded by a pre-tempering circuit comprising a pre-tempering fluid, a pre-tempering flow and a pre-tempering return and running in a pre-tempering environment, which includes a pre-tempering source and which is coupled to the tempering circuit via the tempering source, and that the pre-tempering fluid is brought to a pre-tempering flow temperature T" by the pre-tempering source, which corresponds to an average ambient temperature Tu+ is less than or equal to 15, in particular 1 to 15. The amount of |x| can, analogous to the above statements, preferably correspond to less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, more preferably less than or equal to 3, in particular 1 to 3. This results in two or more temperature control circuits, through which a temperature increase or decrease from the previous to the subsequent temperature control circuit takes place in the manner according to the invention, before a final increase or decrease takes place by the heat pumps assigned to the building rooms. The different temperature control circuits, i.e. the temperature control circuit and the pre-temperature control circuit, can have different ambient temperatures T, since, for example, the pre-temperature control circuit runs in the ground as a pre-temperature control environment and the temperature control circuit runs in the basement of a building as an environment. Here too |x/| can be selected depending on the permissibility classes, so that different amounts of |x| be used. A particularly efficient cascading also occurs when the ambient temperature T of the subsequent temperature control circuit is higher than the ambient temperature T of the previous temperature control circuit. In the case of cooling, this situation can of course be reversed.

Advantageous transmission ratios, which can also be regulated particularly precisely, result when the heat pump or heat pumps comprise at least one Peltier element. The Peltier elements can be connected to the pipes of the temperature control circuit via appropriate heat exchanger surfaces and, depending on requirements, pump heat from the flow into the building room or hot water storage, or heat from the building rooms or hot water storage into the return. To heat the building space, the building space can have its own heating circuit, for example underfloor heating.

So that the temperature control of building rooms or the hot water preparation can be operated largely independently of external infrastructure, it is proposed that the heat pump or heat pumps be supplied via a photovoltaic system. In this way, the additional energy required to raise the flow temperature of the temperature control fluid to a target temperature can be produced independently. In particular, the Peltier elements can be supplied via a photovoltaic system so that the energy required to generate the temperature gradient can be produced independently. The heat pumps or heat pumps can also be powered by a wind turbine. The photovoltaic system and/or wind power system can be assigned energy storage as buffer storage.

In order to increase the energy efficiency of the temperature control source in heating mode and to reduce additional energy expenditure, the temperature control source can transfer heat from a wastewater pipe of the building into the temperature control circuit. This transfer can take place through a heat exchanger known from the prior art, which includes the temperature control source.

The method according to the invention can be accomplished with a device for temperature control of building rooms and/or for hot water treatment in building rooms with a temperature control circuit comprising a temperature control fluid, a flow and a return, in which a temperature control source and at least one heat pump assigned to a building room are provided . According to the invention, a control unit is signal-connected to the temperature control source and to the heat pump, the control unit being set up to control the temperature control source to raise or lower the temperature of the temperature control fluid to a flow temperature T, which corresponds to an average ambient temperature Tu + x °C, and where the control unit is set up to use the heat pump to lower or raise the temperature of the temperature control fluid to a return temperature T, which is the average environment.

temperature T, - x corresponds to °C, where |x| is less than or equal to 15, in particular 1 to 15. A pump can be provided to convey the temperature control fluid in the temperature control circuit. This can also be controlled by the control unit to adjust the flow rate. To precisely specify the flow temperature T and the return temperature T, the control unit can be connected to temperature sensors in the flow and return and control the temperature control source or the heat pump or the heat pumps until the specified flow temperature T and return temperature T is reached. The control unit can also be connected to a temperature sensor in the building room and/or in the hot water tank in order to prevent heating or cooling when the desired building room temperature or hot water temperature is reached. The heat pumps can include a Peltier element. The heat pumps can be connected to a photovoltaic system. The temperature control source may include a heat exchanger that is connected to a wastewater pipe of the building. In this way, the residual heat from the wastewater pipe can be used to increase the temperature of the temperature control fluid. The temperature control source itself can also be a heat pump and connected to a photovoltaic system. The amount of |x| can, analogous to the above statements, preferably correspond to less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, more preferably less than or equal to 3, in particular 1 to 3.

A further aspect of the invention relates to a prefabricated wall element for temperature control of building rooms and/or for hot water preparation in building rooms with a temperature control circuit section comprising a flow section and a return section for guiding a temperature control fluid, the flow and return sections having a connection for flow connection to a temperature control source and/or other flow and return sections, wherein a heat pump is provided in the temperature control circuit section, which is connected to a control unit which is set up to use the heat pump to lower or raise the temperature of the temperature control fluid to a return temperature T, which is an average ambient temperature T, - x corresponds to °C, where x corresponds to the difference between the flow temperature T, and the average ambient temperature T, and |x| is less than or equal to 15, in particular 1 to 15. As a result of the design according to the invention, several prefabricated wall elements can be connected via the connections of the flow and return sections and, together with a temperature control source, form a complete, closed temperature control circuit. In order to enable proper regulation of the closed temperature control circuit, the control units of the prefabricated wall elements connected to one another can also be signal-connected. The control units of the individual prefabricated wall elements can also be measuring and control devices that are signal-connected to a central control unit. The return temperature T and flow temperature T in question refer to the temperature in the return or flow of a closed temperature control circuit made from preferably several prefabricated wall elements. The average ambient temperature T refers to the average internal masonry temperature of the masonry, which is preferably formed from several prefabricated wall elements.

The flow and return sections are preferably embedded in the prefabricated wall. The heat pump is also preferably embedded in the prefabricated wall at least in sections. Depending on whether the precast wall element is a final element or an intermediate element, the forward section can be separated from the return section of a precast wall element (intermediate element) or the forward section can be connected to the return section (final element). The heat pump preferably includes a Peltier element. The temperature control fluid can be part of the prefabricated wall element. The temperature control source can also be part of the prefabricated wall element. The way the temperature control works through the prefabricated wall elements is analogous to the process described above. The amount of |x| can, analogous to the above statements, preferably correspond to less than or equal to 10, in particular 1 to 10, preferably less than or equal to 5, in particular 1 to 5, more preferably less than or equal to 3, in particular 1 to 3.

The subject matter of the invention is shown, for example, in the drawing. Show it

1 shows a schematic representation of a first embodiment of a device for temperature control of building rooms and/or for hot water preparation in building rooms,

2 shows a schematic representation of a second embodiment of a device for temperature control of building rooms and/or for hot water preparation in building rooms,

3 shows a schematic representation of a prefabricated wall element for temperature control of building rooms and/or for hot water preparation in building rooms and

4 is a schematic representation of a third embodiment of a device for temperature control of building rooms and/or for hot water preparation in building rooms.

A device for temperature control of building rooms 1 and/or for hot water preparation in building rooms 1 has, as shown in FIGS. 1 and 2, a temperature control circuit 2 running in an environment U, in which a temperature control fluid is guided. The temperature control circuit 2 has a flow 3 and a return 4. The temperature control fluid can be tempered, i.e. heated or cooled, by a temperature control source 5, for example a heat pump, and conveyed through the temperature control circuit 2 by a pump 6. Heat pumps 7, for example Peltier elements, are also provided in the temperature control circuit 2, each of which is assigned to a building room 1. As indicated in Fig. 1, the heat circuit 2 can include a central heat circuit 2a, in which the temperature control source 5 is arranged, and several decentralized heat circuits 2b, each of which is flow-connected to the central heat circuit 2a, in each of which a heat pump 7 is arranged. The decentralized heat circuits 2b can be decoupled from the central heat circuit 2a, for example via switching valves 8. According to the invention, a control unit 9 is signal-connected to the temperature control source 5 and to the heat pumps 7 (indicated by dashed signal lines), the control unit 9 controlling the temperature control source 5 in such a way that the temperature control fluid from the temperature control source 5 is brought to a flow temperature T, which is an average Ambient temperature Tu + x °C corresponds, and the control unit 9 controls the heat pumps 7 so that the temperature control fluid from the heat pumps 7 is brought to a return temperature T, which corresponds to the average ambient temperature T, - x °C, where | (Amount of x) is less than or equal to 15. Due to this small difference in the temperature of the temperature control fluid to the ambient temperature, the distribution losses can be kept low. To determine the flow temperature T and the return temperature T, the control unit 9 can be signal-connected to temperature sensors 10 in the flow 3 and in the return 4. Temperature sensors 10, which are not shown for reasons of clarity, can also be used to determine the ambient temperature.

If the device is used to heat the building rooms 1 or a hot water storage tank 11, the temperature of the temperature control fluid from the heat pumps 7 is reduced from a higher level to a lower return temperature T, which occurs due to heat absorption by the heat pumps 7 from the temperature control fluid. Through additional work, the heat absorbed by the heat pump 7 can be increased in a manner known from the prior art and used to heat a building room 1 or a hot water storage tank 11. The heat pump 7 can be connected to an underfloor heating 12 or an infrared heating 13 for heating a building room 1, for example. To prepare hot water, the heat pump 7 can be connected to a hot water tank 11. Based on the representation of the heat pump 7 connected to the hot water tank 11, the meaning of the term assignment in the sense of the invention becomes clear. The term assignment does not necessarily mean that the heat pump 7 is arranged in the building room 1, rather it is sufficient that the heat pump 7 is arranged in such a way that it can transfer or remove heat from the building room 1. This is possible, for example, if the heat pump 7 is in a riser leading to this building room.

strand is arranged.

The heat pumps 7, the temperature control source 5 and other electrical components can be supplied via a photovoltaic system 14.

2 shows an alternative embodiment of the device according to the invention, in which the photovoltaic system has been omitted for reasons of clarity, although of course this embodiment can also be supplied by such a system. This exemplary embodiment only has one temperature control circuit 2. So that the conditions regarding the return temperature (T, = Tu - x ° C and |x| = less than or equal to 15, in particular 1 to 15) can be met, the temperature sensor 10 can be arranged after the last heat pump 7 to determine this. In order to be able to continue to comply with this condition and, for example, to prevent excessive undercooling of the temperature control fluid in the return line 4, the various heat pumps 7 can be switched on or off by the control unit 9. An additional or alternative possibility is that the control unit 9 can be used to control which heat pump 7 makes what percentage contribution to the heat dissipation and thus to the lowering of the temperature of the temperature control fluid and that the heat dissipation by the heat pumps 7 is only activated by the control unit 9 for as long as as long as the conditions (T, = Tu - x °C and |x| = less than or equal to 15, in particular 1 to 15) are met and the desired room temperature in building room 1 is reached.

2 reveals that the temperature control source 5 can include a heat exchanger 15, which feeds heat from a wastewater line 16 into the temperature control circuit 2. Such an embodiment can of course also be provided in FIG.

3 shows a prefabricated wall element 17 for temperature control of building rooms 1 and/or for hot water preparation in building rooms 1. The prefabricated wall element 17 has a temperature control circuit section 18 comprising a flow section 19 and a return section 20. A temperature control fluid can be carried in the temperature control circuit section 18. The flow and return sections 19, 20 have one or more connections 21 for flow connection to a temperature control source 5 and/or for flow connection to other flow and return sections 19, 20 of another prefabricated wall element 17. In this way, a closed temperature control circuit 2 can be formed from several prefabricated wall elements 17 by combining their flow and return sections 19, 20 and by adding a temperature control source 5. According to the invention, a heat pump 7 is provided in the temperature control circuit section 18. The heat pump can be connected to an infrared heater 22 in order to control the temperature of a building room 1. The heat pump 7 is also connected to a control unit 9, which is set up to control the heat pump 7 to lower or raise the temperature of the temperature control fluid to a return temperature T, which corresponds to an average ambient temperature Tu - x °C, where x is the Difference between flow temperature T and mean ambient temperature T. corresponds, and |x| is less than or equal to 15, in particular corresponding to 1 to 15. x can be specified by the control unit. The feed section 19 and return cut 20 can also be designed as risers.

4 shows that the temperature control circuit 2 can be preceded by a pre-temperature control circuit 23, for example a district heating network with a pre-temperature control source 24. The pre-tempering circuit 23 includes a pre-tempering fluid, a pre-tempering flow 25 and a pre-tempering return 26 and is arranged in a pre-tempering environment VU. The pre-tempering fluid can be brought from the pre-tempering source 24 to a pre-tempering flow temperature T, which corresponds to an average ambient temperature Tu + x °C. The pre-tempering fluid can then be brought from the tempering source 5 to a pre-tempering return temperature Tv, which corresponds to the mean ambient temperature T, - x ° C, where |x| is less than or equal to 15, in particular 1 to 15. Since the pre-temperature control circuit 23 is in a different environment VU than the temperature control circuit 2, different ambient temperatures T can be present. Also the |x| can be different in the different temperature control circuits 2.23.

4 shows that between the heat pumps 7 and the temperature control circuit 2,2a,2b

Intermediate heat pumps 27 can be provided. This results in a further intermediate temperature control circuit between the heat pumps 7 and the associated intermediate heat pumps 27 with a different ambient temperature T, which depends on the intermediate environment, for example on the masonry. 4 thus shows several cascaded temperature control circuits 23, 2, 2a, 2b, 28, each of which is coupled to one another via at least one temperature control source 5, 27, in particular via a heat pump. In particular, the ambient temperature Tu of the subsequent temperature control circuit 2,2a,2b,28 can be higher than the ambient temperature Tu of the previous temperature control circuit 23,2,2a,2b.

Claims (10)

Patent claims 1. Method for temperature control of building rooms (1) and/or for hot water treatment in building rooms (1) with a temperature control circuit (2) comprising a temperature control fluid, a flow (3) and a return (4) and running in an environment (U), in which a temperature control source (5) and at least one heat pump (7) assigned to a building room (1) are provided, characterized in that the temperature control fluid is brought from the temperature control source (5) to a flow temperature T, which is an average ambient temperature Tu + x °C, and that the temperature control fluid is brought by the heat pump (7) to a return temperature T, which corresponds to the average ambient temperature Tv - x °C, where |x| is less than or equal to 15. 2. The method according to claim 1, characterized in that the environment (U) in which the temperature control circuit (2) runs and / or the temperature control circuit (2) is assigned an admissibility class and |x| is selected depending on this admissibility class. 3. The method according to claim 1 or 2, characterized in that the temperature control circuit (2) is preceded by a pre-temperation circuit (23) comprising a pre-temperation fluid, a pre-temperation flow (25) and a pre-temperation return (26) and running in a pre-temperation environment (VU), which a pre-tempering source (24) and which is coupled to the tempering circuit (2) via the tempering source (5), and that the pre-tempering fluid is brought from the pre-tempering source (24) to a pre-tempering flow temperature T, which is an average ambient temperature Tu + x ° C corresponds to the pre-tempering environment (VU), and that the pre-tempering fluid is brought from the tempering source (5) to a pre-tempering return temperature T, which corresponds to the mean ambient temperature Tu - x ° C of the pre-tempering environment (VU), where |x| is less than or equal to 15. 4. The method according to claim 1, characterized in that the heat pump (7) comprises at least one Peltier element. 5. Method according to one of claims 1 to 4, characterized in that the heat pump (7) is supplied via a photovoltaic system (14). 6. Method according to one of claims 1 to 5, characterized in that the temperature control source (5) transfers heat from a wastewater pipe (16) of the building into the temperature control circuit (2). 7. The method according to one of claims 1 to 6, characterized in that the mean ambient temperature T is the mean internal masonry temperature of the masonry through which the temperature control circuit (2) runs. 8. Device for temperature control of building rooms (1) and / or for hot water treatment in building rooms (1) with a temperature control circuit (2) comprising a temperature control fluid, a flow (3) and a return (4), in which a temperature control source (5) and at least one heat pump (7) assigned to a building room (1) is provided, characterized in that a control unit (9) is signal-connected to the temperature control source (5) and to the heat pump (7), the control unit (9) being set up to do this: to control the temperature control source (5) to raise or lower the temperature of the temperature control fluid to a flow temperature T, which corresponds to an average ambient temperature Tu + x °C, and the control unit (9) is set up to lower or lower the heat pump (7). Raising the temperature of the temperature control fluid to a return temperature T, which corresponds to the average ambient temperature T. - x °C, where |x| is less than or equal to 15. 9. Prefabricated wall element (17) for temperature control of building rooms (1) and / or for hot water treatment in building rooms (1) with a temperature control circuit section (18) comprising a flow section (19) and a return section (20) for guiding a temperature control fluid, the flow and the return section (19, 20) has a connection (21) for flow connection to a temperature control source (5) and/or other flow and Return sections (19, 20), characterized in that a heat pump (7) is provided in the temperature control circuit section (18), which is connected to a control unit (9), which is set up to control the heat pump (7) to lower or raise the Temperature of the temperature control fluid to a return temperature T, which corresponds to an average ambient temperature T, - x ° C, where x corresponds to the difference between the flow temperature T and the average ambient temperature Tu, and |x| is less than or equal to 15. 10. Prefabricated wall element according to claim 9, characterized in that the heat pump comprises a Peltier element. 4 sheets of drawings