AT523669A5 - LED-Modul mit Silikonlinse - Google Patents

LED-Modul mit Silikonlinse Download PDF

Info

Publication number
AT523669A5
AT523669A5 ATA9005/2017A AT90052017A AT523669A5 AT 523669 A5 AT523669 A5 AT 523669A5 AT 90052017 A AT90052017 A AT 90052017A AT 523669 A5 AT523669 A5 AT 523669A5
Authority
AT
Austria
Prior art keywords
led module
silicone lens
carrier plate
silicone
lens elements
Prior art date
Application number
ATA9005/2017A
Other languages
English (en)
Other versions
AT523669B1 (de
Inventor
Teklak Janusz
Ettl Sebastian
Original Assignee
Siteco Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siteco Gmbh filed Critical Siteco Gmbh
Publication of AT523669A5 publication Critical patent/AT523669A5/de
Application granted granted Critical
Publication of AT523669B1 publication Critical patent/AT523669B1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

Die Erfindung betrifft ein LED-Modul, umfassend: eine Trägerplatte aus einem kohlenstoffbasierten Polymer; Linsenelemente aus Silikon, welche mit der Trägerplatte verbunden sind; und mehrere LEDs, welche in Ausschnitten der Trägerplatte angeordnet sind, wobei jedem der Linsenelemente jeweils wenigstens eine LED zugeordnet ist.
ATA9005/2017A 2016-03-11 2017-03-10 LED-Modul mit Silikonlinse AT523669B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016104546.2A DE102016104546A1 (de) 2016-03-11 2016-03-11 LED-Modul mit Silikonlinse
PCT/EP2017/055709 WO2017153585A1 (de) 2016-03-11 2017-03-10 Led-modul mit silikonlinsen

Publications (2)

Publication Number Publication Date
AT523669A5 true AT523669A5 (de) 2021-10-15
AT523669B1 AT523669B1 (de) 2021-11-15

Family

ID=58266634

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA9005/2017A AT523669B1 (de) 2016-03-11 2017-03-10 LED-Modul mit Silikonlinse

Country Status (3)

Country Link
AT (1) AT523669B1 (de)
DE (1) DE102016104546A1 (de)
WO (1) WO2017153585A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018109408A1 (de) * 2018-04-19 2019-10-24 Siteco Beleuchtungstechnik Gmbh Led-modul mit silikonlinse in 3d druck
DE102019109509A1 (de) * 2019-04-10 2020-10-15 Siteco Gmbh LED-Modul mit Silikon-Leiterbahn

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224184A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体表示装置
JP2007059489A (ja) * 2005-08-22 2007-03-08 Asahi Rubber:Kk レンズ体
DE102012214478A1 (de) * 2012-08-14 2014-02-20 Osram Gmbh Längliches Leuchtmodul mit vergossenem Leuchtband

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006048592A1 (de) * 2006-10-13 2008-04-17 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
CN103109587B (zh) 2010-09-06 2016-10-19 贺利氏特种光源有限责任公司 光电子板上芯片模块的涂层方法
US9466772B2 (en) * 2014-03-03 2016-10-11 Bridgelux, Inc. Method and apparatus for providing high-temperature multi-layer optics

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59224184A (ja) * 1983-06-03 1984-12-17 Nec Corp 半導体表示装置
JP2007059489A (ja) * 2005-08-22 2007-03-08 Asahi Rubber:Kk レンズ体
DE102012214478A1 (de) * 2012-08-14 2014-02-20 Osram Gmbh Längliches Leuchtmodul mit vergossenem Leuchtband

Also Published As

Publication number Publication date
AT523669B1 (de) 2021-11-15
DE102016104546A1 (de) 2017-09-14
WO2017153585A1 (de) 2017-09-14

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