AT522399A3 - Schleifvorrichtung - Google Patents

Schleifvorrichtung Download PDF

Info

Publication number
AT522399A3
AT522399A3 ATA50286/2020A AT502862020A AT522399A3 AT 522399 A3 AT522399 A3 AT 522399A3 AT 502862020 A AT502862020 A AT 502862020A AT 522399 A3 AT522399 A3 AT 522399A3
Authority
AT
Austria
Prior art keywords
inclination
wafer
rotation
axis
chuck table
Prior art date
Application number
ATA50286/2020A
Other languages
English (en)
Other versions
AT522399A2 (de
AT522399B1 (de
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of AT522399A2 publication Critical patent/AT522399A2/de
Publication of AT522399A3 publication Critical patent/AT522399A3/de
Application granted granted Critical
Publication of AT522399B1 publication Critical patent/AT522399B1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/50—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground, e.g. strings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

Eine Schleifvorrichtung, die einen Einspanntisch zum Halten eines Wafers, eine Schleifeinheit, die eine Spindel zum Drehen einer Schleifscheibe aufweist, eine neigungseinstellende Einheit zum Einstellen der Neigung der Drehachse des Einspanntischs mit Bezug auf die Drehachse der Spindel, ein interaktives Bedienfeld und einen Steuerteil umfasst. Der Steuerteil ist geeignet, die Informationen bezüglich der abschnittweisen Zielgestalt, die in ein Zielgestalteingabefeld eingegeben worden sind, mit den Informationen bezüglich der vorliegenden abschnittweisen Gestalt, die in ein Eingabefeld der vorliegenden Gestalt eingegeben worden sind, zu vergleichen und dann die neigungseinstellende Einheit zu steuern, um die Neigung der Drehachse des Einspanntischs so zu ändern, dass der Wafer geschliffen wird, um die abschnittweise Zielgestalt des Wafers zu erhalten.
ATA50286/2020A 2019-04-05 2020-04-03 Schleifvorrichtung AT522399B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019072603A JP7417362B2 (ja) 2019-04-05 2019-04-05 研削装置

Publications (3)

Publication Number Publication Date
AT522399A2 AT522399A2 (de) 2020-10-15
AT522399A3 true AT522399A3 (de) 2021-03-15
AT522399B1 AT522399B1 (de) 2023-05-15

Family

ID=72518772

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50286/2020A AT522399B1 (de) 2019-04-05 2020-04-03 Schleifvorrichtung

Country Status (7)

Country Link
US (1) US11524386B2 (de)
JP (1) JP7417362B2 (de)
CN (1) CN111805374B (de)
AT (1) AT522399B1 (de)
CZ (1) CZ2020194A3 (de)
DE (1) DE102020204370A1 (de)
FI (1) FI20205350A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113305732B (zh) * 2021-06-22 2022-05-03 北京中电科电子装备有限公司 一种用于半导体设备的多工位全自动减薄磨削方法
CN114473858A (zh) * 2022-02-11 2022-05-13 贵州航天控制技术有限公司 一种用于对斜盘进行高精度自适应研磨的装置
CN115365922B (zh) * 2022-10-24 2023-02-28 西安奕斯伟材料科技有限公司 研磨轮、研磨设备及硅片

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4335980A1 (de) * 1993-10-21 1995-04-27 Wacker Chemitronic Werkstückhalterung für Rotationsschleifmaschinen zum Schleifen von Halbleiterscheiben und Verfahren zum Positionieren der Werkstückhalterung
US20170095902A1 (en) * 2015-10-06 2017-04-06 Disco Corporation Grinding method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62181862A (ja) * 1986-02-07 1987-08-10 Hitachi Seiko Ltd 平面研削装置
JPH07100297B2 (ja) * 1987-01-27 1995-11-01 九州電子金属株式会社 半導体ウエハの研磨制御装置
JP4913517B2 (ja) * 2006-09-26 2012-04-11 株式会社ディスコ ウエーハの研削加工方法
JP2008264913A (ja) 2007-04-18 2008-11-06 Disco Abrasive Syst Ltd 研削加工装置
JP5336054B2 (ja) * 2007-07-18 2013-11-06 浜松ホトニクス株式会社 加工情報供給装置を備える加工情報供給システム
JP2011245610A (ja) * 2010-05-31 2011-12-08 Mitsubishi Electric Corp 半導体装置の製造方法
JP2013004726A (ja) 2011-06-16 2013-01-07 Disco Abrasive Syst Ltd 板状物の加工方法
US9393669B2 (en) * 2011-10-21 2016-07-19 Strasbaugh Systems and methods of processing substrates
JP2013193156A (ja) * 2012-03-19 2013-09-30 Disco Corp 研削装置、及び、研削方法
JP6147587B2 (ja) 2013-06-27 2017-06-14 株式会社ディスコ 研削装置及び研削方法
JP2015160260A (ja) * 2014-02-26 2015-09-07 株式会社東芝 研削装置及び研削方法
JP6348856B2 (ja) 2015-02-26 2018-06-27 株式会社東京精密 研削加工装置
JP6710138B2 (ja) * 2016-10-07 2020-06-17 株式会社ディスコ フレーム固定治具
WO2018235619A1 (ja) * 2017-06-21 2018-12-27 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体
JP6938262B2 (ja) 2017-07-24 2021-09-22 株式会社ディスコ ウエーハの加工方法
JP7089136B2 (ja) * 2018-03-22 2022-06-22 株式会社デンソー ウエーハの研削方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4335980A1 (de) * 1993-10-21 1995-04-27 Wacker Chemitronic Werkstückhalterung für Rotationsschleifmaschinen zum Schleifen von Halbleiterscheiben und Verfahren zum Positionieren der Werkstückhalterung
US20170095902A1 (en) * 2015-10-06 2017-04-06 Disco Corporation Grinding method

Also Published As

Publication number Publication date
DE102020204370A1 (de) 2020-10-08
CN111805374B (zh) 2024-06-25
US20200316750A1 (en) 2020-10-08
AT522399A2 (de) 2020-10-15
CN111805374A (zh) 2020-10-23
CZ2020194A3 (cs) 2020-10-14
FI20205350A1 (en) 2020-10-06
US11524386B2 (en) 2022-12-13
AT522399B1 (de) 2023-05-15
JP2020168701A (ja) 2020-10-15
JP7417362B2 (ja) 2024-01-18

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