AT500993A5 - Elektrochemisches verdrängungsablagerungsverfahren zur herstellung von metallverbundpulvern - Google Patents

Elektrochemisches verdrängungsablagerungsverfahren zur herstellung von metallverbundpulvern Download PDF

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Publication number
AT500993A5
AT500993A5 AT0900104A AT90012004A AT500993A5 AT 500993 A5 AT500993 A5 AT 500993A5 AT 0900104 A AT0900104 A AT 0900104A AT 90012004 A AT90012004 A AT 90012004A AT 500993 A5 AT500993 A5 AT 500993A5
Authority
AT
Austria
Prior art keywords
electrochemic
production
metal compound
deposition method
compound powders
Prior art date
Application number
AT0900104A
Other languages
English (en)
Other versions
AT500993A2 (de
AT500993B1 (de
Original Assignee
Osram Sylvania Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc filed Critical Osram Sylvania Inc
Priority to AT0016805U priority Critical patent/AT8359U1/de
Publication of AT500993A2 publication Critical patent/AT500993A2/de
Publication of AT500993A5 publication Critical patent/AT500993A5/de
Application granted granted Critical
Publication of AT500993B1 publication Critical patent/AT500993B1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/148—Agglomerating
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/045—Alloys based on refractory metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/048—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by powder-metallurgical processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
AT0900104A 2003-01-21 2004-01-20 Elektrochemisches verdrängungsablagerungsverfahren zur herstellung von metallverbundpulvern AT500993B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT0016805U AT8359U1 (de) 2003-08-07 2005-03-18 Holster und sicherheitsabdeckeinrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44145403P 2003-01-21 2003-01-21
PCT/US2004/001361 WO2004065042A2 (en) 2003-01-21 2004-01-20 Electrochemical displacement-deposition method for making composite metal powders

Publications (3)

Publication Number Publication Date
AT500993A2 AT500993A2 (de) 2006-05-15
AT500993A5 true AT500993A5 (de) 2008-06-15
AT500993B1 AT500993B1 (de) 2008-09-15

Family

ID=32771932

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0900104A AT500993B1 (de) 2003-01-21 2004-01-20 Elektrochemisches verdrängungsablagerungsverfahren zur herstellung von metallverbundpulvern

Country Status (6)

Country Link
US (1) US7041151B2 (de)
JP (1) JP2006516305A (de)
CN (1) CN100402204C (de)
AT (1) AT500993B1 (de)
DE (1) DE112004000163T5 (de)
WO (1) WO2004065042A2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107377965B (zh) * 2017-06-21 2019-07-16 昆明理工大学 一种基于反歧化反应的碳纳米管/铜复合粉末制备方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3382066A (en) * 1965-07-23 1968-05-07 Mallory & Co Inc P R Method of making tungsten-copper composites
US4243728A (en) 1976-01-01 1981-01-06 Nihon Kogyo Kabushiki Kaisha Double-metal-coated metal sulfide powder and process of producing the same
JPS5467851A (en) 1977-11-11 1979-05-31 Nippon Mining Co Preparation of copper coated metallic sulfide powder
JPS5553017A (en) * 1978-10-16 1980-04-18 Nippon Mining Co Method of manufacturing multiple coating composite powder
JPS5554502A (en) 1978-10-16 1980-04-21 Nippon Mining Co Ltd Production of noble metal plated composite powder
US4913731A (en) * 1988-10-03 1990-04-03 Gte Products Corporation Process of making prealloyed tungsten alloy powders
US5610347A (en) * 1992-06-10 1997-03-11 Doduco Gmbh & Co. Dr. Eugen Durrwachter Material for electric contacts taking silver-tin oxide or silver-zinc oxide as basis
US5439638A (en) * 1993-07-16 1995-08-08 Osram Sylvania Inc. Method of making flowable tungsten/copper composite powder
US5897962A (en) * 1993-07-16 1999-04-27 Osram Sylvania Inc. Method of making flowable tungsten/copper composite powder
JPH08120310A (ja) * 1994-10-19 1996-05-14 Taiyo Koukou Kk Ｃｕ−Ｗ混合粉末の製造法
US6103392A (en) * 1994-12-22 2000-08-15 Osram Sylvania Inc. Tungsten-copper composite powder
US5468457A (en) * 1994-12-22 1995-11-21 Osram Sylvania Inc. Method of making tungsten-copper composite oxides
JPH08311510A (ja) * 1995-05-15 1996-11-26 Taiyo Koukou Kk 銅−タングステン混合粉末の製造法
US5759230A (en) * 1995-11-30 1998-06-02 The United States Of America As Represented By The Secretary Of The Navy Nanostructured metallic powders and films via an alcoholic solvent process
FR2784691B1 (fr) * 1998-10-16 2000-12-29 Eurotungstene Poudres Poudre metallique prealliee micronique a base de metaux de transition 3d
IT1302926B1 (it) * 1998-12-16 2000-10-10 Celsia S P A Procedimento per la produzione di polveri composite tungsteno-ramesinterizzabili.
US7122069B2 (en) * 2000-03-29 2006-10-17 Osram Sylvania Inc. Mo-Cu composite powder

Also Published As

Publication number Publication date
AT500993A2 (de) 2006-05-15
WO2004065042A2 (en) 2004-08-05
AT500993B1 (de) 2008-09-15
US20040149085A1 (en) 2004-08-05
DE112004000163T5 (de) 2006-03-02
US7041151B2 (en) 2006-05-09
CN1761545A (zh) 2006-04-19
CN100402204C (zh) 2008-07-16
WO2004065042A3 (en) 2004-10-14
JP2006516305A (ja) 2006-06-29

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee