AT328510B - Halbleiteranordnung und verfahren zu deren herstellung - Google Patents

Halbleiteranordnung und verfahren zu deren herstellung

Info

Publication number
AT328510B
AT328510B AT813270A AT813270A AT328510B AT 328510 B AT328510 B AT 328510B AT 813270 A AT813270 A AT 813270A AT 813270 A AT813270 A AT 813270A AT 328510 B AT328510 B AT 328510B
Authority
AT
Austria
Prior art keywords
manufacturing
conductor arrangement
conductor
arrangement
Prior art date
Application number
AT813270A
Other languages
English (en)
Other versions
ATA813270A (de
Original Assignee
Molekularelektronik
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molekularelektronik filed Critical Molekularelektronik
Publication of ATA813270A publication Critical patent/ATA813270A/de
Application granted granted Critical
Publication of AT328510B publication Critical patent/AT328510B/de

Links

Classifications

    • H10W99/00—
    • H10W72/20—
    • H10W76/134—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H10W72/884—
    • H10W90/753—
    • H10W90/754—
AT813270A 1969-09-08 1970-09-08 Halbleiteranordnung und verfahren zu deren herstellung AT328510B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DD14246469 1969-09-08

Publications (2)

Publication Number Publication Date
ATA813270A ATA813270A (de) 1975-06-15
AT328510B true AT328510B (de) 1976-03-25

Family

ID=5481655

Family Applications (1)

Application Number Title Priority Date Filing Date
AT813270A AT328510B (de) 1969-09-08 1970-09-08 Halbleiteranordnung und verfahren zu deren herstellung

Country Status (4)

Country Link
AT (1) AT328510B (de)
CH (1) CH514232A (de)
DE (1) DE2040648A1 (de)
FR (1) FR2060863A5 (de)

Also Published As

Publication number Publication date
ATA813270A (de) 1975-06-15
FR2060863A5 (de) 1971-06-18
CH514232A (de) 1971-10-15
DE2040648A1 (de) 1971-03-11

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Legal Events

Date Code Title Description
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