AT289498B - Bad zum Abscheiden von Kupferüberzügen ohne Stromzufuhr von außen - Google Patents

Bad zum Abscheiden von Kupferüberzügen ohne Stromzufuhr von außen

Info

Publication number
AT289498B
AT289498B AT86567A AT86567A AT289498B AT 289498 B AT289498 B AT 289498B AT 86567 A AT86567 A AT 86567A AT 86567 A AT86567 A AT 86567A AT 289498 B AT289498 B AT 289498B
Authority
AT
Austria
Prior art keywords
bath
deposition
power supply
external power
copper coatings
Prior art date
Application number
AT86567A
Other languages
English (en)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT289498B publication Critical patent/AT289498B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
AT86567A 1966-02-01 1967-01-30 Bad zum Abscheiden von Kupferüberzügen ohne Stromzufuhr von außen AT289498B (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US52390266A 1966-02-01 1966-02-01
US52386366A 1966-02-01 1966-02-01

Publications (1)

Publication Number Publication Date
AT289498B true AT289498B (de) 1971-04-26

Family

ID=27061291

Family Applications (1)

Application Number Title Priority Date Filing Date
AT86567A AT289498B (de) 1966-02-01 1967-01-30 Bad zum Abscheiden von Kupferüberzügen ohne Stromzufuhr von außen

Country Status (8)

Country Link
AT (1) AT289498B (de)
CH (1) CH490509A (de)
DE (1) DE1621309C2 (de)
DK (1) DK141411B (de)
ES (1) ES336275A1 (de)
FR (1) FR1509789A (de)
NL (1) NL166727C (de)
SE (1) SE384880B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE441530B (sv) * 1980-12-09 1985-10-14 Ericsson Telefon Ab L M Sett och bad for att utfora stromlos forkoppring
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3119709A (en) * 1956-09-28 1964-01-28 Atkinson Lab Inc Material and method for electroless deposition of metal
US2884344A (en) * 1957-10-07 1959-04-28 Reynolds Metals Co Nickel plating

Also Published As

Publication number Publication date
ES336275A1 (es) 1967-12-16
DE1621309A1 (de) 1971-06-03
NL166727C (nl) 1981-09-15
NL6701526A (de) 1967-08-02
DE1621309C2 (de) 1981-04-16
CH490509A (de) 1970-05-15
SE384880B (sv) 1976-05-24
DE1621309B2 (de) 1972-10-12
DK141411B (da) 1980-03-10
DK141411C (de) 1980-09-08
NL166727B (nl) 1981-04-15
FR1509789A (fr) 1968-01-12

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee