AT268811B - Bad zur Metallabscheidung ohne äußere Stromzufuhr - Google Patents

Bad zur Metallabscheidung ohne äußere Stromzufuhr

Info

Publication number
AT268811B
AT268811B AT416467A AT416467A AT268811B AT 268811 B AT268811 B AT 268811B AT 416467 A AT416467 A AT 416467A AT 416467 A AT416467 A AT 416467A AT 268811 B AT268811 B AT 268811B
Authority
AT
Austria
Prior art keywords
power supply
external power
metal deposition
deposition bath
bath
Prior art date
Application number
AT416467A
Other languages
German (de)
English (en)
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Application granted granted Critical
Publication of AT268811B publication Critical patent/AT268811B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AT416467A 1966-05-06 1967-05-03 Bad zur Metallabscheidung ohne äußere Stromzufuhr AT268811B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54807166A 1966-05-06 1966-05-06

Publications (1)

Publication Number Publication Date
AT268811B true AT268811B (de) 1969-02-25

Family

ID=24187280

Family Applications (1)

Application Number Title Priority Date Filing Date
AT416467A AT268811B (de) 1966-05-06 1967-05-03 Bad zur Metallabscheidung ohne äußere Stromzufuhr

Country Status (9)

Country Link
US (1) US3485643A (enrdf_load_stackoverflow)
JP (1) JPS5113734B1 (enrdf_load_stackoverflow)
AT (1) AT268811B (enrdf_load_stackoverflow)
CH (1) CH497541A (enrdf_load_stackoverflow)
DE (1) DE1621311C3 (enrdf_load_stackoverflow)
ES (1) ES340230A1 (enrdf_load_stackoverflow)
GB (1) GB1145578A (enrdf_load_stackoverflow)
NL (1) NL152299B (enrdf_load_stackoverflow)
SE (1) SE340738B (enrdf_load_stackoverflow)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621235A1 (de) * 1967-10-13 1971-04-22 Dynamit Nobel Ag Verfahren zur Metallisierung von geformten Gebilden aus thermoplastischen Kunststoffen
BE757573A (fr) * 1969-10-16 1971-04-15 Philips Nv Depot sans courant de cuivre flexible
US3902907A (en) * 1973-08-17 1975-09-02 Kazutaka Kishita System for electroless plating of copper and composition
US4167601A (en) * 1976-11-15 1979-09-11 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4170461A (en) * 1976-12-29 1979-10-09 Ppg Industries, Inc. Heat treatment of electrolessly deposited cuprous oxide coating
US4242369A (en) * 1977-06-07 1980-12-30 Whittaker Corporation Plating of substrates by jet printing
US4133908A (en) * 1977-11-03 1979-01-09 Western Electric Company, Inc. Method for depositing a metal on a surface
US4192764A (en) * 1977-11-03 1980-03-11 Western Electric Company, Inc. Stabilizing composition for a metal deposition process
US4228213A (en) * 1979-08-13 1980-10-14 Western Electric Company, Inc. Method of depositing a stress-free electroless copper deposit
US4464231A (en) * 1980-10-22 1984-08-07 Dover Findings Inc. Process for fabricating miniature hollow gold spheres
IT1157006B (it) * 1982-03-09 1987-02-11 Alfachimici Spa Miscela stabilizzante per un bagno di rame chimico
US4525390A (en) * 1984-03-09 1985-06-25 International Business Machines Corporation Deposition of copper from electroless plating compositions
US4666858A (en) * 1984-10-22 1987-05-19 International Business Machines Corporation Determination of amount of anionic material in a liquid sample
US4908242A (en) * 1986-10-31 1990-03-13 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
GB8812329D0 (en) * 1988-05-25 1988-06-29 Engelhard Corp Electroless deposition
US5965211A (en) * 1989-12-29 1999-10-12 Nippondenso Co., Ltd. Electroless copper plating solution and process for formation of copper film
US5258200A (en) * 1992-08-04 1993-11-02 Amp-Akzo Corporation Electroless copper deposition
US5256441A (en) * 1992-08-04 1993-10-26 Amp-Akzo Corporation Ductile copper
US6042889A (en) * 1994-02-28 2000-03-28 International Business Machines Corporation Method for electrolessly depositing a metal onto a substrate using mediator ions
CN101555612A (zh) * 2008-04-11 2009-10-14 深圳富泰宏精密工业有限公司 外壳的表面处理方法
EP2672520B1 (en) 2012-06-06 2018-07-04 SEMIKRON Elektronik GmbH & Co. KG Method for electroless deposition of a copper layer, electroless deposited copper layer and semiconductor component comprising said electroless deposited copper layer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3326700A (en) * 1963-06-12 1967-06-20 Rudolph J Zeblisky Electroless copper plating
US3259559A (en) * 1962-08-22 1966-07-05 Day Company Method for electroless copper plating
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating

Also Published As

Publication number Publication date
ES340230A1 (es) 1968-06-01
US3485643A (en) 1969-12-23
DE1621311C3 (de) 1974-10-31
SE340738B (enrdf_load_stackoverflow) 1971-11-29
DE1621311A1 (de) 1970-07-23
JPS5113734B1 (enrdf_load_stackoverflow) 1976-05-01
NL152299B (nl) 1977-02-15
GB1145578A (en) 1969-03-19
CH497541A (de) 1970-10-15
DE1621311B2 (de) 1972-06-29
NL6706434A (enrdf_load_stackoverflow) 1967-11-07

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